NO975928L - Jordingsplankobling - Google Patents

Jordingsplankobling

Info

Publication number
NO975928L
NO975928L NO975928A NO975928A NO975928L NO 975928 L NO975928 L NO 975928L NO 975928 A NO975928 A NO 975928A NO 975928 A NO975928 A NO 975928A NO 975928 L NO975928 L NO 975928L
Authority
NO
Norway
Prior art keywords
ground plane
flexible circuit
plan switching
passage
grounding
Prior art date
Application number
NO975928A
Other languages
English (en)
Other versions
NO975928D0 (no
Inventor
Randolph D Schueller
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of NO975928L publication Critical patent/NO975928L/no
Publication of NO975928D0 publication Critical patent/NO975928D0/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

En fleksibel kretskonstruksjon som tillater at loddekuler (26) kan festes ved massesmelting til jordingsplanet (22) til en dobbelsidig bøyelig krets (20) ved å tilveiebringe en første gjennomgang (30) som er adskilt fra den gjenværende delen av jordingsplanet (22), men som er elektrisk forbundet til jordingsplanet (22) via en andre gjennomgang (38) i avstand fra den første gjennomgangen (30) ved hjelp av et kretsspor (36) på den motsatte siden av den bøyelige kretsen (20) til jordingsplanet (22).
NO975928A 1995-06-16 1997-12-16 Jordingsplankobling NO975928D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/491,120 US5585162A (en) 1995-06-16 1995-06-16 Ground plane routing
PCT/US1996/006292 WO1997000599A1 (en) 1995-06-16 1996-05-03 Ground plane routing

Publications (2)

Publication Number Publication Date
NO975928L true NO975928L (no) 1997-12-16
NO975928D0 NO975928D0 (no) 1997-12-16

Family

ID=23950875

Family Applications (1)

Application Number Title Priority Date Filing Date
NO975928A NO975928D0 (no) 1995-06-16 1997-12-16 Jordingsplankobling

Country Status (9)

Country Link
US (1) US5585162A (no)
EP (1) EP0832546A1 (no)
JP (1) JPH11507768A (no)
KR (1) KR19990022863A (no)
CN (1) CN1186588A (no)
CA (1) CA2221756A1 (no)
MY (1) MY132276A (no)
NO (1) NO975928D0 (no)
WO (1) WO1997000599A1 (no)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818697A (en) * 1997-03-21 1998-10-06 International Business Machines Corporation Flexible thin film ball grid array containing solder mask
JPH10335035A (ja) * 1997-05-30 1998-12-18 Ando Electric Co Ltd Ｂｇａ−ｉｃ用測定機構
JPH1126919A (ja) * 1997-06-30 1999-01-29 Fuji Photo Film Co Ltd プリント配線板
US5975921A (en) 1997-10-10 1999-11-02 Berg Technology, Inc. High density connector system
KR100545966B1 (ko) * 1997-10-10 2006-03-23 에프씨아이 고밀도 커넥터 시스템
US6118080A (en) * 1998-01-13 2000-09-12 Micron Technology, Inc. Z-axis electrical contact for microelectronic devices
US6329605B1 (en) * 1998-03-26 2001-12-11 Tessera, Inc. Components with conductive solder mask layers
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
EP1125329A1 (en) * 1998-10-14 2001-08-22 Minnesota Mining And Manufacturing Company Tape ball grid array with interconnected ground plane
ATE333207T1 (de) 1998-11-09 2006-08-15 Ballard Power Systems Elektrische kontaktvorrichtung für eine brennstoffzelle
US6354850B1 (en) * 1998-12-15 2002-03-12 Fci Americas Technology, Inc. Electrical connector with feature for limiting the effects of coefficient of thermal expansion differential
US6565364B1 (en) * 1998-12-23 2003-05-20 Mirae Corporation Wafer formed with CSP device and test socket of BGA device
US7115819B1 (en) * 1999-08-18 2006-10-03 Micron Technology, Inc. Positioning flowable solder for bonding integrated circuit elements
US6542377B1 (en) 2000-06-28 2003-04-01 Dell Products L.P. Printed circuit assembly having conductive pad array with in-line via placement
US6507118B1 (en) * 2000-07-14 2003-01-14 3M Innovative Properties Company Multi-metal layer circuit
US6903541B2 (en) * 2001-05-25 2005-06-07 Tyco Electronics Corporation Film-based microwave and millimeter-wave circuits and sensors
US6573461B2 (en) * 2001-09-20 2003-06-03 Dpac Technologies Corp Retaining ring interconnect used for 3-D stacking
US6801880B2 (en) * 2002-07-02 2004-10-05 Dell Products L.P. System and method for minimizing a loading effect of a via by tuning a cutout ratio
US20040198082A1 (en) * 2003-04-07 2004-10-07 Victor Zaderej Method of making an electrical connector
JP4212992B2 (ja) * 2003-09-03 2009-01-21 Ｔｄｋ株式会社 半田ボールの供給方法および供給装置
GB0817834D0 (en) * 2008-09-30 2008-11-05 Cambridge Silicon Radio Ltd Low cost flexible substrate
TWI491347B (zh) * 2012-10-24 2015-07-01 Hon Hai Prec Ind Co Ltd 散熱板及封裝殼體

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148310A (en) * 1964-09-08 Methods of making same
US3537176A (en) * 1969-04-01 1970-11-03 Lockheed Aircraft Corp Interconnection of flexible electrical circuits
JPH02238688A (ja) * 1989-03-10 1990-09-20 Toshiba Corp プリント配線基板
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5367435A (en) * 1993-11-16 1994-11-22 International Business Machines Corporation Electronic package structure and method of making same

Also Published As

Publication number Publication date
CN1186588A (zh) 1998-07-01
MY132276A (en) 2007-09-28
US5585162A (en) 1996-12-17
WO1997000599A1 (en) 1997-01-03
EP0832546A1 (en) 1998-04-01
JPH11507768A (ja) 1999-07-06
NO975928D0 (no) 1997-12-16
CA2221756A1 (en) 1997-01-03
KR19990022863A (ko) 1999-03-25

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application