NO970572L - Heat sink for semiconductor components and similar equipment - Google Patents

Heat sink for semiconductor components and similar equipment

Info

Publication number
NO970572L
NO970572L NO970572A NO970572A NO970572L NO 970572 L NO970572 L NO 970572L NO 970572 A NO970572 A NO 970572A NO 970572 A NO970572 A NO 970572A NO 970572 L NO970572 L NO 970572L
Authority
NO
Norway
Prior art keywords
heat sink
groove
semiconductor components
similar equipment
corrugations
Prior art date
Application number
NO970572A
Other languages
Norwegian (no)
Other versions
NO970572D0 (en
NO320638B1 (en
Inventor
Uwe Bock
Original Assignee
Alusuisse Lonza Services Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Lonza Services Ag filed Critical Alusuisse Lonza Services Ag
Publication of NO970572D0 publication Critical patent/NO970572D0/en
Publication of NO970572L publication Critical patent/NO970572L/en
Publication of NO320638B1 publication Critical patent/NO320638B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)
  • Ceramic Products (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The heat sink is made particularly of aluminium alloy with cooling fins, 10 cm long, protruding from grooves (14) in the base (12) of its housing. Each fin has two parallel limbs (22) of thickness (n) 1.8 mm and a root (26) of length 4.5 mm which is slightly greater than the depth (h) of the groove. Security of the fins in the grooves is aided by corrugations (42,44) in the vertical walls of each groove. Between each groove and its neighbour a notch (18) is cut out of the base for a wedge-shaped tool to apply sideways pressure across the corrugations.
NO19970572A 1996-02-09 1997-02-07 Dress body for semiconductor components NO320638B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29602212U DE29602212U1 (en) 1996-02-09 1996-02-09 Heat sink for semiconductor components or the like. Facilities

Publications (3)

Publication Number Publication Date
NO970572D0 NO970572D0 (en) 1997-02-07
NO970572L true NO970572L (en) 1997-08-11
NO320638B1 NO320638B1 (en) 2006-01-09

Family

ID=8019201

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19970572A NO320638B1 (en) 1996-02-09 1997-02-07 Dress body for semiconductor components

Country Status (5)

Country Link
EP (1) EP0795905B1 (en)
AT (1) ATE274750T1 (en)
DE (2) DE29602212U1 (en)
ES (1) ES2224216T3 (en)
NO (1) NO320638B1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (en) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Heat sink for electric and-or electronic component
DE29715585U1 (en) * 1997-08-28 1998-12-24 Hoogovens Aluminium Profiltech Cooling device for electrical or electronic components
DE10157240B4 (en) * 2001-11-22 2012-10-25 Aleris Aluminum Vogt Gmbh Heat sink and method for producing the same
DE10229532B4 (en) * 2002-07-01 2008-06-19 Alcan Technology & Management Ag Cooling device for semiconductor devices
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
US8499824B2 (en) * 2005-10-04 2013-08-06 Elektronische Bauelemente Gesellschaft M.B.H. Heat sink
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
WO2015141305A1 (en) * 2014-03-18 2015-09-24 富士電機株式会社 Power conversion device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (en) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Heat sink for thyristors
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE59106364D1 (en) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices.

Also Published As

Publication number Publication date
DE59711864D1 (en) 2004-09-30
ES2224216T3 (en) 2005-03-01
EP0795905A3 (en) 1998-12-30
EP0795905B1 (en) 2004-08-25
DE29602212U1 (en) 1996-05-02
NO970572D0 (en) 1997-02-07
EP0795905A2 (en) 1997-09-17
ATE274750T1 (en) 2004-09-15
NO320638B1 (en) 2006-01-09

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Legal Events

Date Code Title Description
MM1K Lapsed by not paying the annual fees