DK0789396T3 - Cooling element for semiconductor components or the like - Google Patents
Cooling element for semiconductor components or the likeInfo
- Publication number
- DK0789396T3 DK0789396T3 DK96810883T DK96810883T DK0789396T3 DK 0789396 T3 DK0789396 T3 DK 0789396T3 DK 96810883 T DK96810883 T DK 96810883T DK 96810883 T DK96810883 T DK 96810883T DK 0789396 T3 DK0789396 T3 DK 0789396T3
- Authority
- DK
- Denmark
- Prior art keywords
- slot
- supplementary
- base plate
- cooling element
- semiconductor components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Glass Compositions (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The heat sink is of extruded aluminium or other light metal with spaced fins joined to and projecting from a base plate. The fins are secured by a gripping foot inserted in a slot or similar recess in the base plate. Next to each insertion slot a supplementary slot is provided for the temporary accommodation of a tool whilst in the corner region of the insertion slot, formed by the side wall (32) and the slot bottom (34), an additional slot (36) is formed. The centre lines of the supplementary and additional slots can enclose an angle of less than 90 degrees.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29601584 | 1996-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0789396T3 true DK0789396T3 (en) | 2006-10-23 |
Family
ID=8018748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK96810883T DK0789396T3 (en) | 1996-01-31 | 1996-12-19 | Cooling element for semiconductor components or the like |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0789396B1 (en) |
AT (1) | ATE330329T1 (en) |
DE (1) | DE59611356D1 (en) |
DK (1) | DK0789396T3 (en) |
ES (1) | ES2262151T3 (en) |
NO (1) | NO324069B1 (en) |
PT (1) | PT789396E (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19836314A1 (en) * | 1998-08-11 | 2000-02-24 | Joachim Bayer | Heatsink attachment for semiconductor components, with cooler profiles extruded from special aluminum alloy has a bent semicircular shape |
US6520248B2 (en) * | 2000-05-18 | 2003-02-18 | Aavid Thermalloy Llc | Heat sink having bonded cooling fins |
DE10157240B4 (en) * | 2001-11-22 | 2012-10-25 | Aleris Aluminum Vogt Gmbh | Heat sink and method for producing the same |
US6845812B2 (en) * | 2002-12-20 | 2005-01-25 | Motorola, Inc. | Heatsink with multiple, selectable fin densities |
US7497013B2 (en) * | 2005-04-15 | 2009-03-03 | R-Theta Thermal Solutions Inc. | Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2502472C2 (en) * | 1975-01-22 | 1982-09-02 | Siemens AG, 1000 Berlin und 8000 München | Heat sink for thyristors |
DE3518310A1 (en) | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
US5038858A (en) * | 1990-03-13 | 1991-08-13 | Thermalloy Incorporated | Finned heat sink and method of manufacture |
DE59106364D1 (en) * | 1990-10-24 | 1995-10-05 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices. |
DE4314663A1 (en) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Heatsinks for semiconductor devices |
DE9412460U1 (en) * | 1994-08-02 | 1995-12-14 | Hoogovens Aluminium Profiltech | Cooling device for electrical or electronic components with a base plate and with cooling elements |
-
1996
- 1996-12-19 EP EP96810883A patent/EP0789396B1/en not_active Expired - Lifetime
- 1996-12-19 AT AT96810883T patent/ATE330329T1/en active
- 1996-12-19 DK DK96810883T patent/DK0789396T3/en active
- 1996-12-19 PT PT96810883T patent/PT789396E/en unknown
- 1996-12-19 DE DE59611356T patent/DE59611356D1/en not_active Expired - Lifetime
- 1996-12-19 ES ES96810883T patent/ES2262151T3/en not_active Expired - Lifetime
-
1997
- 1997-01-29 NO NO19970387A patent/NO324069B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE59611356D1 (en) | 2006-07-27 |
NO970387L (en) | 1997-08-01 |
NO970387D0 (en) | 1997-01-29 |
ES2262151T3 (en) | 2006-11-16 |
NO324069B1 (en) | 2007-08-06 |
EP0789396A3 (en) | 1998-09-30 |
ATE330329T1 (en) | 2006-07-15 |
PT789396E (en) | 2006-10-31 |
EP0789396B1 (en) | 2006-06-14 |
EP0789396A2 (en) | 1997-08-13 |
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