WO2000003574A3 - Heat sink with transverse ribs - Google Patents

Heat sink with transverse ribs Download PDF

Info

Publication number
WO2000003574A3
WO2000003574A3 PCT/EP1999/004779 EP9904779W WO0003574A3 WO 2000003574 A3 WO2000003574 A3 WO 2000003574A3 EP 9904779 W EP9904779 W EP 9904779W WO 0003574 A3 WO0003574 A3 WO 0003574A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
base profile
transverse ribs
cooling ribs
cooling
Prior art date
Application number
PCT/EP1999/004779
Other languages
German (de)
French (fr)
Other versions
WO2000003574A2 (en
Inventor
Joachim Glueck
Original Assignee
Joachim Glueck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1998130512 external-priority patent/DE19830512A1/en
Priority claimed from DE1998141583 external-priority patent/DE19841583A1/en
Priority claimed from DE1998141911 external-priority patent/DE19841911A1/en
Priority claimed from DE1998142977 external-priority patent/DE19842977A1/en
Priority claimed from DE1998152933 external-priority patent/DE19852933A1/en
Priority claimed from DE1999100970 external-priority patent/DE19900970A1/en
Application filed by Joachim Glueck filed Critical Joachim Glueck
Publication of WO2000003574A2 publication Critical patent/WO2000003574A2/en
Publication of WO2000003574A3 publication Critical patent/WO2000003574A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a heat sink for cooling elements, especially semiconductor components, motors and aggregates. Said heat sink is comprised of an extruded base profile (1.1 - 1.1.24) made of a light metal, having interspaced cooling ribs (1.2 - 1.2.33; 1.120) which protrude from the base profile (1.1 - 1.1.24) and which are connected to the base profile (1.1 - 1.1.24) in such a way that they transfer heat. The cooling ribs (1.2 - 1.2.33; 1.120) should be connected to the base profile (1.1 - 1.1.24) such that they are perpendicular or diagonal to the direction of extrusion of said base profile (1.1 - 1.1.24).
PCT/EP1999/004779 1998-07-09 1999-07-07 Heat sink with transverse ribs WO2000003574A2 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
DE1998130512 DE19830512A1 (en) 1998-07-09 1998-07-09 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
DE19830512.5 1998-07-09
DE19841583.4 1998-09-11
DE1998141583 DE19841583A1 (en) 1998-09-11 1998-09-11 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
DE19841911.2 1998-09-14
DE1998141911 DE19841911A1 (en) 1998-09-14 1998-09-14 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
DE19842977.0 1998-09-19
DE1998142977 DE19842977A1 (en) 1998-09-19 1998-09-19 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
DE19852933.3 1998-11-17
DE1998152933 DE19852933A1 (en) 1998-11-17 1998-11-17 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
DE19900970.8 1999-01-13
DE1999100970 DE19900970A1 (en) 1999-01-13 1999-01-13 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs

Publications (2)

Publication Number Publication Date
WO2000003574A2 WO2000003574A2 (en) 2000-01-20
WO2000003574A3 true WO2000003574A3 (en) 2000-06-22

Family

ID=27545097

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1999/004779 WO2000003574A2 (en) 1998-07-09 1999-07-07 Heat sink with transverse ribs

Country Status (1)

Country Link
WO (1) WO2000003574A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0406970A (en) 2003-01-24 2006-01-10 Ciba Sc Holding Ag Crystalline modification of a manganese complex
FR2965699B1 (en) * 2010-10-05 2013-03-29 Commissariat Energie Atomique DEVICE FOR THERMAL DISSIPATION FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD
US20130000872A1 (en) * 2011-06-29 2013-01-03 Chun-Hung Lin Fin Heat Sink with Improved Structure and Processing Method Thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123349A (en) * 1984-07-12 1986-01-31 Sumitomo Light Metal Ind Ltd Radiator
EP0206980A2 (en) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Heat sink for semiconductor devices and method for manufacturing the same
DE29601776U1 (en) * 1996-02-02 1996-06-13 Alusuisse Lonza Services Ag Heat sink for semiconductor components or the like.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123349A (en) * 1984-07-12 1986-01-31 Sumitomo Light Metal Ind Ltd Radiator
EP0206980A2 (en) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Heat sink for semiconductor devices and method for manufacturing the same
DE29601776U1 (en) * 1996-02-02 1996-06-13 Alusuisse Lonza Services Ag Heat sink for semiconductor components or the like.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 170 (E - 412) 17 June 1986 (1986-06-17) *

Also Published As

Publication number Publication date
WO2000003574A2 (en) 2000-01-20

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