KR960026362U - Heat sink structure for semiconductor package manufacturing - Google Patents

Heat sink structure for semiconductor package manufacturing

Info

Publication number
KR960026362U
KR960026362U KR2019940034333U KR19940034333U KR960026362U KR 960026362 U KR960026362 U KR 960026362U KR 2019940034333 U KR2019940034333 U KR 2019940034333U KR 19940034333 U KR19940034333 U KR 19940034333U KR 960026362 U KR960026362 U KR 960026362U
Authority
KR
South Korea
Prior art keywords
heat sink
semiconductor package
sink structure
package manufacturing
manufacturing
Prior art date
Application number
KR2019940034333U
Other languages
Korean (ko)
Other versions
KR200183066Y1 (en
Inventor
정관식
Original Assignee
아남반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남반도체주식회사 filed Critical 아남반도체주식회사
Priority to KR2019940034333U priority Critical patent/KR200183066Y1/en
Publication of KR960026362U publication Critical patent/KR960026362U/en
Application granted granted Critical
Publication of KR200183066Y1 publication Critical patent/KR200183066Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
KR2019940034333U 1994-12-16 1994-12-16 Heat sink structure for manufacturing semiconductor packages KR200183066Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940034333U KR200183066Y1 (en) 1994-12-16 1994-12-16 Heat sink structure for manufacturing semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940034333U KR200183066Y1 (en) 1994-12-16 1994-12-16 Heat sink structure for manufacturing semiconductor packages

Publications (2)

Publication Number Publication Date
KR960026362U true KR960026362U (en) 1996-07-22
KR200183066Y1 KR200183066Y1 (en) 2000-06-01

Family

ID=19401609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940034333U KR200183066Y1 (en) 1994-12-16 1994-12-16 Heat sink structure for manufacturing semiconductor packages

Country Status (1)

Country Link
KR (1) KR200183066Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100399709B1 (en) * 2001-01-03 2003-09-29 에쓰에쓰아이 주식회사 Method for manufacturing and framing Semiconductor Assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102533265B1 (en) 2023-01-16 2023-05-17 장병규 Heat sink utilizing filler metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100399709B1 (en) * 2001-01-03 2003-09-29 에쓰에쓰아이 주식회사 Method for manufacturing and framing Semiconductor Assembly

Also Published As

Publication number Publication date
KR200183066Y1 (en) 2000-06-01

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090313

Year of fee payment: 10

EXPY Expiration of term