KR960025529U - Semiconductor package built-in heat sink - Google Patents
Semiconductor package built-in heat sinkInfo
- Publication number
- KR960025529U KR960025529U KR2019940034332U KR19940034332U KR960025529U KR 960025529 U KR960025529 U KR 960025529U KR 2019940034332 U KR2019940034332 U KR 2019940034332U KR 19940034332 U KR19940034332 U KR 19940034332U KR 960025529 U KR960025529 U KR 960025529U
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- semiconductor package
- package built
- built
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940034332U KR0134092Y1 (en) | 1994-12-16 | 1994-12-16 | Radiator of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940034332U KR0134092Y1 (en) | 1994-12-16 | 1994-12-16 | Radiator of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960025529U true KR960025529U (en) | 1996-07-22 |
| KR0134092Y1 KR0134092Y1 (en) | 1999-01-15 |
Family
ID=19401608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940034332U KR0134092Y1 (en) | 1994-12-16 | 1994-12-16 | Radiator of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0134092Y1 (en) |
-
1994
- 1994-12-16 KR KR2019940034332U patent/KR0134092Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0134092Y1 (en) | 1999-01-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20091013 Year of fee payment: 12 |
|
| EXPY | Expiration of term |