NO965321L - Optisk miniatyr-kapsel - Google Patents

Optisk miniatyr-kapsel

Info

Publication number
NO965321L
NO965321L NO965321A NO965321A NO965321L NO 965321 L NO965321 L NO 965321L NO 965321 A NO965321 A NO 965321A NO 965321 A NO965321 A NO 965321A NO 965321 L NO965321 L NO 965321L
Authority
NO
Norway
Prior art keywords
capsule
components
holes
front surface
solder
Prior art date
Application number
NO965321A
Other languages
English (en)
Norwegian (no)
Other versions
NO965321D0 (no
Inventor
Jens Peter Lo Curzio
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of NO965321D0 publication Critical patent/NO965321D0/no
Publication of NO965321L publication Critical patent/NO965321L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Optical Head (AREA)
  • Optical Filters (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Measuring Arrangements Characterized By The Use Of Fluids (AREA)
  • Optical Transform (AREA)
  • Led Device Packages (AREA)
NO965321A 1994-06-14 1996-12-12 Optisk miniatyr-kapsel NO965321L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9402082A SE9402082L (sv) 1994-06-14 1994-06-14 Optisk miniatyrkapsel
PCT/SE1995/000713 WO1995034836A2 (fr) 1994-06-14 1995-06-13 Capsule optique miniaturisee

Publications (2)

Publication Number Publication Date
NO965321D0 NO965321D0 (no) 1996-12-12
NO965321L true NO965321L (no) 1997-02-07

Family

ID=20394380

Family Applications (1)

Application Number Title Priority Date Filing Date
NO965321A NO965321L (no) 1994-06-14 1996-12-12 Optisk miniatyr-kapsel

Country Status (10)

Country Link
US (1) US5611013A (fr)
EP (1) EP0765490A2 (fr)
JP (1) JPH10501350A (fr)
AU (1) AU703630B2 (fr)
CA (1) CA2189745A1 (fr)
FI (1) FI964963A0 (fr)
NO (1) NO965321L (fr)
SE (1) SE9402082L (fr)
TW (2) TW360803B (fr)
WO (1) WO1995034836A2 (fr)

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JP3936010B2 (ja) * 1997-02-14 2007-06-27 古河電気工業株式会社 光モジュール
GB2327276B (en) * 1997-07-14 2002-02-20 Mitel Semiconductor Ab Optical module
US5913002A (en) * 1997-12-31 1999-06-15 The Whitaker Corporation Optical coupling device for passive alignment of optoelectronic devices and fibers
US5980312A (en) * 1998-01-12 1999-11-09 Amphenol Corporation Modular optical/electronic backplane assembly
GB2333853B (en) * 1998-01-31 2002-03-27 Mitel Semiconductor Ab Fiber optic module
GB2333854B (en) * 1998-01-31 2002-07-31 Mitel Semiconductor Ab System and method for aligning optical components
GB2334592B (en) 1998-02-19 2002-11-13 Mitel Semiconductor Ab Adapter for coupling optical and electronic circuits
JP3767156B2 (ja) * 1998-02-23 2006-04-19 住友電気工業株式会社 光送受信モジュ−ル
US7208725B2 (en) * 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
US6318909B1 (en) * 1999-02-11 2001-11-20 Agilent Technologies, Inc. Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
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US6302590B1 (en) 1999-09-03 2001-10-16 Picolight Incorporated Enclosure for optical subassembly having mechanical alignment features
US6485192B1 (en) * 1999-10-15 2002-11-26 Tyco Electronics Corporation Optical device having an integral array interface
US6583902B1 (en) 1999-12-09 2003-06-24 Alvesta, Inc. Modular fiber-optic transceiver
US6969265B2 (en) * 2000-05-18 2005-11-29 Infineon Technologies Ag Electrically connecting integrated circuits and transducers
US6305848B1 (en) * 2000-06-19 2001-10-23 Corona Optical Systems, Inc. High density optoelectronic transceiver module
FR2815139A1 (fr) * 2000-10-10 2002-04-12 Commissariat Energie Atomique Procede et dispositif d'alignement passif d'un connecteur optique multifibres et d'un composant optique
AU2001297945A1 (en) * 2000-11-16 2003-01-02 Schott Glas Method of forming an ordered optic fiber array and connector arrangement for same
US6527457B2 (en) 2001-02-01 2003-03-04 International Business Machines Corporation Optical fiber guide module and a method for making the same
US7101091B2 (en) * 2001-02-21 2006-09-05 Zarlink Semiconductor, Inc. Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same
GB2373064A (en) * 2001-03-10 2002-09-11 Mitel Corp Optical fibre connector using transparent filler material
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US7073954B1 (en) 2001-09-17 2006-07-11 Stratos International, Inc. Transceiver assembly for use in fiber optics communications
US6676302B2 (en) 2001-09-17 2004-01-13 Stratos Lightwave, Inc. Method of constructing a fiber optics communications module
US7056032B2 (en) * 2001-09-17 2006-06-06 Stratos International, Inc. Transceiver assembly for use in fiber optics communications
US6729771B2 (en) 2001-12-17 2004-05-04 Stratos Lightwave, Inc. Parallel optics subassembly having at least twelve lenses
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP3772163B2 (ja) * 2003-07-29 2006-05-10 株式会社東芝 コネクタ型光モジュール
US6837626B1 (en) * 2003-11-12 2005-01-04 Hewlett-Packard Development Company, L.P. Electro-optical connector
JP2005165165A (ja) * 2003-12-05 2005-06-23 Suzuka Fuji Xerox Co Ltd レセプタクル及びレセプタクルの製造方法
US8412052B2 (en) 2004-10-22 2013-04-02 Intel Corporation Surface mount (SMT) connector for VCSEL and photodiode arrays
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TWI504956B (zh) * 2011-12-28 2015-10-21 Hon Hai Prec Ind Co Ltd 光纖耦合連接器
CN103185926A (zh) * 2011-12-29 2013-07-03 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
JP5958364B2 (ja) * 2013-01-28 2016-07-27 日立金属株式会社 光モジュール
WO2014168866A1 (fr) * 2013-04-12 2014-10-16 Corning Optical Communications LLC Connexions optiques comportant une structure d'alignement intégrée
CN106487353B (zh) * 2015-08-28 2021-09-28 香港城市大学深圳研究院 将单端信号转换为差分信号的装置、方法以及系统
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Also Published As

Publication number Publication date
FI964963A (fi) 1996-12-11
CA2189745A1 (fr) 1995-12-21
WO1995034836A3 (fr) 1996-05-23
TW360803B (en) 1999-06-11
AU2759095A (en) 1996-01-05
TW354375B (en) 1999-03-11
US5611013A (en) 1997-03-11
SE9402082L (sv) 1995-12-15
JPH10501350A (ja) 1998-02-03
NO965321D0 (no) 1996-12-12
WO1995034836A2 (fr) 1995-12-21
SE9402082D0 (sv) 1994-06-14
AU703630B2 (en) 1999-03-25
FI964963A0 (fi) 1996-12-11
EP0765490A2 (fr) 1997-04-02

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application