NO960419D0 - Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme - Google Patents
Pakning for elektronisk komponent, samt framgangsmåte for framstilling av sammeInfo
- Publication number
- NO960419D0 NO960419D0 NO960419A NO960419A NO960419D0 NO 960419 D0 NO960419 D0 NO 960419D0 NO 960419 A NO960419 A NO 960419A NO 960419 A NO960419 A NO 960419A NO 960419 D0 NO960419 D0 NO 960419D0
- Authority
- NO
- Norway
- Prior art keywords
- manufacturing
- well
- same
- electronic component
- component gasket
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/409,130 US5659950A (en) | 1995-03-23 | 1995-03-23 | Method of forming a package assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
NO960419D0 true NO960419D0 (no) | 1996-02-01 |
NO960419L NO960419L (no) | 1996-09-24 |
Family
ID=23619175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO960419A NO960419L (no) | 1995-03-23 | 1996-02-01 | Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme |
Country Status (4)
Country | Link |
---|---|
US (1) | US5659950A (no) |
EP (1) | EP0733906A1 (no) |
JP (1) | JP3725607B2 (no) |
NO (1) | NO960419L (no) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59402033D1 (de) * | 1993-09-30 | 1997-04-17 | Siemens Ag | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
US6911727B1 (en) | 1995-06-06 | 2005-06-28 | Analog Devices, Inc. | Package for sealing an integrated circuit die |
EP2267797A1 (de) | 1997-07-29 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
KR19990035575A (ko) * | 1997-10-31 | 1999-05-15 | 윤종용 | 쇼트 리드형 반도체 패키지의 리드 프레임 |
US5889658A (en) * | 1997-11-25 | 1999-03-30 | Motorola, Inc. | Package assembly for an electronic component |
US5867367A (en) | 1997-12-04 | 1999-02-02 | Intel Corporation | Quad flat pack integrated circuit package |
US6362426B1 (en) * | 1998-01-09 | 2002-03-26 | Micron Technology, Inc. | Radiused leadframe |
US6929485B1 (en) * | 2004-03-16 | 2005-08-16 | Agilent Technologies, Inc. | Lead frame with interdigitated pins |
US7602054B2 (en) * | 2005-10-05 | 2009-10-13 | Semiconductor Components Industries, L.L.C. | Method of forming a molded array package device having an exposed tab and structure |
US8169081B1 (en) | 2007-12-27 | 2012-05-01 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits using under bump metallization |
US8947887B2 (en) | 2009-02-23 | 2015-02-03 | Freescale Semiconductor, Inc. | Package assembly and method of tuning a natural resonant frequency of a package |
US8587099B1 (en) * | 2012-05-02 | 2013-11-19 | Texas Instruments Incorporated | Leadframe having selective planishing |
ITTO20120854A1 (it) * | 2012-09-28 | 2014-03-29 | Stmicroelectronics Malta Ltd | Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione |
US9235937B1 (en) | 2013-06-05 | 2016-01-12 | Analog Devices, Inc. | Mounting method for satellite crash sensors |
US9287200B2 (en) * | 2013-06-27 | 2016-03-15 | Freescale Semiconductor, Inc. | Packaged semiconductor device |
EP3239665A1 (de) * | 2016-04-25 | 2017-11-01 | Weickmann & Weickmann PartmbB | Sensorgehäuse |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1339660A (en) * | 1971-11-20 | 1973-12-05 | Ferranti Ltd | Supports for semiconductor devices |
US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
JPS63129652A (ja) * | 1986-11-20 | 1988-06-02 | Toshiba Corp | 半導体装置 |
US5088930A (en) * | 1990-11-20 | 1992-02-18 | Advanced Interconnections Corporation | Integrated circuit socket with reed-shaped leads |
US5118298A (en) * | 1991-04-04 | 1992-06-02 | Advanced Interconnections Corporation | Through hole mounting of integrated circuit adapter leads |
US5233131A (en) * | 1990-12-19 | 1993-08-03 | Vlsi Technology, Inc. | Integrated circuit die-to-leadframe interconnect assembly system |
JP2982126B2 (ja) * | 1991-03-20 | 1999-11-22 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US5263241A (en) * | 1992-04-06 | 1993-11-23 | Delco Electronics Corporation | Apparatus useful in the manufacture of a pressure sensor assembly |
US5311407A (en) * | 1992-04-30 | 1994-05-10 | Siemens Components, Inc. | Printed circuit based for mounted semiconductors and other electronic components |
US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
DE9309918U1 (de) * | 1993-07-03 | 1993-12-02 | Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen | Halter für Beschleunigungssensoren |
-
1995
- 1995-03-23 US US08/409,130 patent/US5659950A/en not_active Expired - Lifetime
-
1996
- 1996-02-01 NO NO960419A patent/NO960419L/no unknown
- 1996-03-04 EP EP96103287A patent/EP0733906A1/en not_active Withdrawn
- 1996-03-19 JP JP08892496A patent/JP3725607B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5659950A (en) | 1997-08-26 |
EP0733906A1 (en) | 1996-09-25 |
JPH08274247A (ja) | 1996-10-18 |
JP3725607B2 (ja) | 2005-12-14 |
NO960419L (no) | 1996-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TR199600792A2 (tr) | Dihaloazolopirimidinlerin hazirlanmasina yönelik proses. | |
NO972438D0 (no) | Plastkomponent, samt fremgangsmåte for dens fremstilling | |
NO944512L (no) | Fremgangsmåte for behandling av oljebrönn | |
IS4148A (is) | Hliðstæð aðferð til framleiðslu á 1,5 Benzodiazepine afleiðum | |
BR9612297A (pt) | Método de produção de 1,1,1,3,3-pentafluorpropano | |
DE69322755D1 (de) | Halbleiteranordnung, Herstellungsverfahren und Verfahren zur Montage der Halbleiteranordnung | |
NO960419D0 (no) | Pakning for elektronisk komponent, samt framgangsmåte for framstilling av samme | |
NO962643L (no) | Pyridazinonderivater samt fremgangsmåte til fremstilling av samme | |
ZA989631B (en) | Process for the production of N-Butanol. | |
NO894583D0 (no) | Fremgangsmaate for fremstilling av celleplast. | |
NO982667D0 (no) | Aksellerometer, samt fremgangsmÕte til fremstilling av samme | |
DK0857206T3 (da) | Krystallinsk cellulase samt fremgangsmåde til fremstilling af samme | |
ZA9610455B (en) | Process for manufacturing objects from the fibre-reinforced thermoplast | |
NO973267D0 (no) | Beleggsblanding for karbonholdige produkter samt det derved oppnådde belegg | |
IT1305122B1 (it) | Procedimento di produzione di trimetilolalcano. | |
ZA9810063B (en) | Process for the manufacture of an organic compound. | |
NO941974D0 (no) | Stötfanger, samt fremstilling av samme | |
NO971972D0 (no) | Hydrofon, samt fremgangsmåte for fremstilling av denne | |
NO910649D0 (no) | Fremgangsmaate til fremstilling av staurosporin. | |
ZA989954B (en) | Process for the manufacture of an organic compound. | |
NO974171D0 (no) | Belagt substrat for lystekniske formål, samt fremgangsmåte for fremstilling av samme | |
DE59104766D1 (de) | Phosphatierverfahren. | |
NO954789D0 (no) | Fremgangsmåte for fremstilling av en komposittgjenstand, samt gjenstanden | |
NO20005743D0 (no) | Fremgangsmåte til fremstilling av 4,5-epoksymorfinan-6- oksyglukoronider | |
TR199801514A3 (tr) | N-Piruvil-L-Prolin üretimi için yöntem. |