NO952739L - Fosfatsammensetninger og fremg. særlig for anv. i fremst. av trykkede kretser som utnytter organiske dekkmidler (Resister) - Google Patents

Fosfatsammensetninger og fremg. særlig for anv. i fremst. av trykkede kretser som utnytter organiske dekkmidler (Resister)

Info

Publication number
NO952739L
NO952739L NO952739A NO952739A NO952739L NO 952739 L NO952739 L NO 952739L NO 952739 A NO952739 A NO 952739A NO 952739 A NO952739 A NO 952739A NO 952739 L NO952739 L NO 952739L
Authority
NO
Norway
Prior art keywords
organic resin
phosphate conversion
compositions
composition
resister
Prior art date
Application number
NO952739A
Other languages
English (en)
Other versions
NO952739D0 (no
Inventor
Gary B Larson
Brian Jobson
James A Johnson
Lance C Sturni
Original Assignee
Macdermid Inc
Ppg Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc, Ppg Industries Inc filed Critical Macdermid Inc
Publication of NO952739D0 publication Critical patent/NO952739D0/no
Publication of NO952739L publication Critical patent/NO952739L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08—Orthophosphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C23C22/42—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates containing also phosphates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing Of Solid Wastes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Dental Preparations (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Paints Or Removers (AREA)

Abstract

Sammensetninger og fremgangsmåter for å skaffe tilveie et fosfatomdannlngsbelegg på en metalloverflate, særlig en kobberoverflate er kjennetegnet ved at fosfaterlngs- sammensetningen Innbefatter minst en sammensetnlngs- oppløsellg forbindelse som inneholder vanadium, niobj wolfram og tantal .. Fosfatomdanningsbeleggene som blir fremstilt er tykkere, mer holdbare og Jevnere enn de som blir fremstilt ved kjente fosfaterlngssam- mensetninger. Sammensetningene og fremgangsmåtene er særlig nyttige for å skaffe tilvele passlvlserende/- unlformerende belegglag på kobberoverflater til hvilke organisk harpiks deretter blir avsatt for å tjene som en reslst i trykkede kretsfremstillingssekvenser, særlig når den organiske harpiksen er en elektrofore- tisk avsatt organisk harpiks. Det ble også beskrevet mlkroetsing av kobberoverflater med en fosforsyre/- peroksidmikroetsemiddel for avsetning derpå (eller etter en ytterligere tilveiebringelse av et fosfatom- danningsbelegg) av en fotoresist som deretter blir eksponert og fremkalt for å skaffe tilvele en mønstret resist.
NO952739A 1993-01-11 1995-07-10 Fosfatsammensetninger og fremg. særlig for anv. i fremst. av trykkede kretser som utnytter organiske dekkmidler (Resister) NO952739L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US292293A 1993-01-11 1993-01-11
PCT/US1993/011013 WO1994016120A2 (en) 1993-01-11 1993-11-15 Phosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resists

Publications (2)

Publication Number Publication Date
NO952739D0 NO952739D0 (no) 1995-07-10
NO952739L true NO952739L (no) 1995-09-01

Family

ID=21703202

Family Applications (1)

Application Number Title Priority Date Filing Date
NO952739A NO952739L (no) 1993-01-11 1995-07-10 Fosfatsammensetninger og fremg. særlig for anv. i fremst. av trykkede kretser som utnytter organiske dekkmidler (Resister)

Country Status (23)

Country Link
US (1) US5550006A (no)
EP (1) EP0678124B1 (no)
JP (1) JPH08505901A (no)
KR (1) KR960700359A (no)
AT (1) ATE195560T1 (no)
AU (1) AU5668394A (no)
BG (1) BG99820A (no)
BR (1) BR9307811A (no)
CA (1) CA2152948A1 (no)
CZ (1) CZ170395A3 (no)
DE (1) DE69329249T2 (no)
DK (1) DK0678124T3 (no)
ES (1) ES2150480T3 (no)
FI (1) FI953377A (no)
GR (1) GR3034763T3 (no)
HU (1) HUT71621A (no)
NO (1) NO952739L (no)
NZ (1) NZ258702A (no)
PL (1) PL309779A1 (no)
PT (1) PT678124E (no)
SK (1) SK88295A3 (no)
TW (1) TW240370B (no)
WO (1) WO1994016120A2 (no)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392008B2 (ja) * 1996-10-30 2003-03-31 日本表面化学株式会社 金属の保護皮膜形成処理剤と処理方法
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
DE19740431C1 (de) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats
US6830627B1 (en) * 1999-03-23 2004-12-14 International Business Machines Corporation Copper cleaning compositions, processes and products derived therefrom
WO2001086016A2 (en) * 2000-05-11 2001-11-15 Henkel Corporation Metal surface treatment agent
US20030209293A1 (en) * 2000-05-11 2003-11-13 Ryousuke Sako Metal surface treatment agent
EP1158843B1 (en) * 2000-05-22 2006-09-13 Macdermid Incorporated Process for improving adhesion of polymeric materials to metal surfaces.
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6692583B2 (en) * 2002-02-14 2004-02-17 Jon Bengston Magnesium conversion coating composition and method of using same
JP4253280B2 (ja) * 2003-12-05 2009-04-08 三井金属鉱業株式会社 プリント配線基板の製造方法
US7704562B2 (en) * 2006-08-14 2010-04-27 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
WO2015012177A1 (ja) * 2013-07-24 2015-01-29 Jsr株式会社 パターン形成方法
US9991163B2 (en) 2014-09-25 2018-06-05 X-Celeprint Limited Small-aperture-ratio display with electrical component

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Also Published As

Publication number Publication date
NO952739D0 (no) 1995-07-10
EP0678124B1 (en) 2000-08-16
ATE195560T1 (de) 2000-09-15
DE69329249T2 (de) 2001-02-01
US5550006A (en) 1996-08-27
CZ170395A3 (en) 1995-12-13
HUT71621A (en) 1996-01-29
PT678124E (pt) 2000-11-30
NZ258702A (en) 1996-12-20
BR9307811A (pt) 1995-11-14
DE69329249D1 (de) 2000-09-21
ES2150480T3 (es) 2000-12-01
AU5668394A (en) 1994-08-15
JPH08505901A (ja) 1996-06-25
DK0678124T3 (da) 2000-09-25
EP0678124A1 (en) 1995-10-25
GR3034763T3 (en) 2001-02-28
WO1994016120A2 (en) 1994-07-21
SK88295A3 (en) 1996-03-06
PL309779A1 (en) 1995-11-13
FI953377A0 (fi) 1995-07-10
CA2152948A1 (en) 1994-07-21
HU9502095D0 (en) 1995-09-28
FI953377A (fi) 1995-07-10
WO1994016120A3 (en) 1994-09-01
KR960700359A (ko) 1996-01-19
TW240370B (no) 1995-02-11
BG99820A (bg) 1996-02-29

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