NO883643L - Fremgangsmaate for aa lage fotoresistmoenster paa trykte kretskort. - Google Patents

Fremgangsmaate for aa lage fotoresistmoenster paa trykte kretskort.

Info

Publication number
NO883643L
NO883643L NO88883643A NO883643A NO883643L NO 883643 L NO883643 L NO 883643L NO 88883643 A NO88883643 A NO 88883643A NO 883643 A NO883643 A NO 883643A NO 883643 L NO883643 L NO 883643L
Authority
NO
Norway
Prior art keywords
procedure
printed circuits
photoresist patterns
made photoresist
patterns
Prior art date
Application number
NO88883643A
Other languages
English (en)
Norwegian (no)
Other versions
NO883643D0 (no
Inventor
Harold Lake
Paul E Grandmont
Original Assignee
Foxboro Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxboro Co filed Critical Foxboro Co
Publication of NO883643D0 publication Critical patent/NO883643D0/no
Publication of NO883643L publication Critical patent/NO883643L/no

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0952Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0505Double exposure of the same photosensitive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/0551Exposure mask directly printed on the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
NO88883643A 1985-06-10 1988-08-16 Fremgangsmaate for aa lage fotoresistmoenster paa trykte kretskort. NO883643L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/742,742 US4666818A (en) 1985-06-10 1985-06-10 Method of patterning resist for printed wiring board
PCT/US1986/002709 WO1988004797A1 (en) 1985-06-10 1986-12-17 Method of patterning resist for printed wiring board

Publications (2)

Publication Number Publication Date
NO883643D0 NO883643D0 (no) 1988-08-16
NO883643L true NO883643L (no) 1988-10-14

Family

ID=24986015

Family Applications (1)

Application Number Title Priority Date Filing Date
NO88883643A NO883643L (no) 1985-06-10 1988-08-16 Fremgangsmaate for aa lage fotoresistmoenster paa trykte kretskort.

Country Status (8)

Country Link
US (1) US4666818A (de)
EP (1) EP0339020B1 (de)
JP (1) JPH02501427A (de)
KR (1) KR940007800B1 (de)
DE (1) DE3689659T2 (de)
DK (1) DK170480B1 (de)
NO (1) NO883643L (de)
WO (1) WO1988004797A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254435A (en) * 1985-06-10 1993-10-19 The Foxboro Company Method of patterning resist
US5302494A (en) * 1985-06-10 1994-04-12 The Foxboro Company Multilayer circuit board having microporous layers and process for making same
US5015553A (en) * 1985-06-10 1991-05-14 The Foxboro Company Method of patterning resist
IL81157A (en) * 1987-01-05 1990-04-29 Uri Shoshani Decorative products made of plastic having a metallic decorative pattern
JPH02502675A (ja) * 1987-01-22 1990-08-23 ザ・フォックスボロ・カンパニー レジストパターニングの方法
CA1249065A (en) * 1987-07-06 1989-01-17 Allan R. Drake Process for forming silver conductors on a substrate
US4999277A (en) * 1988-02-22 1991-03-12 Trw Inc. Production of precision patterns on curved surfaces
JPH0234984A (ja) * 1988-04-13 1990-02-05 Mitsubishi Electric Corp プリント回路基板の製造方法
US4987050A (en) * 1988-12-06 1991-01-22 Fuji Photo Film Co., Ltd. Light-sensitive transfer material and image-forming process using the same
US5260168A (en) * 1989-10-13 1993-11-09 The Foxboro Company Application specific tape automated bonding
EP0448702B1 (de) * 1989-10-13 1995-08-09 The Foxboro Company Anwendungsorientiertes automatisiertes bandbonding
CA2028710A1 (en) * 1989-10-30 1991-05-01 Paul E. Grandmont Multilayer circuit board having microporous layers and method for making same
EP0433721A3 (en) * 1989-12-22 1992-07-08 Siemens Aktiengesellschaft Method of applying a solder stop coating on printed circuit boards
EP0486246A1 (de) * 1990-11-14 1992-05-20 Canon Kabushiki Kaisha Durch Wärme entwickelbare, lichtempfindliche Zusammensetzung
US5384230A (en) * 1992-03-02 1995-01-24 Berg; N. Edward Process for fabricating printed circuit boards
US5751594A (en) * 1993-03-16 1998-05-12 Emc Corporation Aperture control system for printed circuit board fabrication
JP3149289B2 (ja) * 1993-03-24 2001-03-26 三菱製紙株式会社 画像形成材料及びそれを使用する画像形成方法
DE4408507A1 (de) * 1994-03-14 1995-09-28 Heidelberg Instruments Mikrotechnik Gmbh Lithografisches Verfahren
US5712613A (en) * 1995-05-05 1998-01-27 Mcdonnell Douglas Corporation Computer-aided method for producing resistive tapers and resistive taper produced thereby
EP0785474A1 (de) * 1996-01-16 1997-07-23 Schablonentechnik Kufstein Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung einer Flexodruckschablone
GB2321908B (en) * 1996-08-09 2000-08-30 Matsushita Electric Works Ltd Process of plating on isolated conductor circuit
EP1246773A2 (de) * 2000-01-07 2002-10-09 President And Fellows Of Harvard College Herstellung von metallenen mikrostrukturen durch belichtung einer lichtempfindlichen zusammensetzung
JP3657168B2 (ja) 2000-02-28 2005-06-08 富士通株式会社 多層プリント配線板の製造方法
TW200507131A (en) 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
WO2005092043A2 (en) * 2004-03-22 2005-10-06 Epic Research Company, Inc. Process for fabrication of printed circuit boards
US8142987B2 (en) * 2004-04-10 2012-03-27 Eastman Kodak Company Method of producing a relief image for printing
KR100697601B1 (ko) 2004-07-10 2007-03-21 지성우 명함 제조 방법
JP2009239070A (ja) * 2008-03-27 2009-10-15 Fujifilm Corp 配線形成方法
CN108650797A (zh) * 2018-06-22 2018-10-12 赣州中盛隆电子有限公司 一种电路板负片图形转移工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT326703B (de) * 1971-10-07 1975-12-29 Zimmer Peter Verfahren zur herstellung von druckformen
US3867150A (en) * 1973-06-08 1975-02-18 Grace W R & Co Printing plate process and apparatus using a laser scanned silver negative
US4168980A (en) * 1977-08-19 1979-09-25 Eastman Kodak Company Heat developable photographic material and process
US4419675A (en) * 1979-05-24 1983-12-06 American Hoechst Corporation Imaging system and method for printed circuit artwork and the like
JPS5660442A (en) * 1979-10-23 1981-05-25 Fuji Photo Film Co Ltd Photosensitive lithographic plate and method for making lithographic plate
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
US4373018A (en) * 1981-06-05 1983-02-08 Bell Telephone Laboratories, Incorporated Multiple exposure microlithography patterning method
JPS5965838A (ja) * 1982-10-07 1984-04-14 Dainippon Screen Mfg Co Ltd 多層構造を有する感材およびその製版方法
JPS5973748U (ja) * 1982-11-11 1984-05-18 大日本スクリ−ン製造株式会社 色校正用フイルム
US4515877A (en) * 1982-11-27 1985-05-07 Basf Aktiengesellschaft Image-recording materials and image-recording carried out using these to produce an optical mask
JPH0664341B2 (ja) * 1983-01-24 1994-08-22 ウエスターン エレクトリック カムパニー,インコーポレーテッド 半導体デバイスの製作法
US4469777A (en) * 1983-12-01 1984-09-04 E. I. Du Pont De Nemours And Company Single exposure process for preparing printed circuits

Also Published As

Publication number Publication date
WO1988004797A1 (en) 1988-06-30
DK457988A (da) 1988-08-16
US4666818A (en) 1987-05-19
EP0339020B1 (de) 1994-02-16
JPH02501427A (ja) 1990-05-17
DK170480B1 (da) 1995-09-11
DK457988D0 (da) 1988-08-16
KR940007800B1 (ko) 1994-08-25
DE3689659D1 (de) 1994-03-24
EP0339020A1 (de) 1989-11-02
DE3689659T2 (de) 1994-09-29
NO883643D0 (no) 1988-08-16
KR890700855A (ko) 1989-04-27

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