NO322102B1 - LED-signalmodul - Google Patents
LED-signalmodul Download PDFInfo
- Publication number
- NO322102B1 NO322102B1 NO20020321A NO20020321A NO322102B1 NO 322102 B1 NO322102 B1 NO 322102B1 NO 20020321 A NO20020321 A NO 20020321A NO 20020321 A NO20020321 A NO 20020321A NO 322102 B1 NO322102 B1 NO 322102B1
- Authority
- NO
- Norway
- Prior art keywords
- circuit board
- led
- led signal
- signal module
- module according
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Devices (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10102353A DE10102353B4 (de) | 2001-01-19 | 2001-01-19 | LED-Signalmodul |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20020321D0 NO20020321D0 (no) | 2002-01-21 |
| NO20020321L NO20020321L (no) | 2002-07-22 |
| NO322102B1 true NO322102B1 (no) | 2006-08-14 |
Family
ID=7671117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20020321A NO322102B1 (no) | 2001-01-19 | 2002-01-21 | LED-signalmodul |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1243843B1 (da) |
| AT (1) | ATE419492T1 (da) |
| DE (2) | DE10102353B4 (da) |
| DK (1) | DK1243843T3 (da) |
| NO (1) | NO322102B1 (da) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004053958B3 (de) * | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug |
| EP1891671B1 (en) | 2005-05-20 | 2020-08-19 | Signify Holding B.V. | Light-emitting module |
| EP1791187B1 (en) * | 2005-11-29 | 2009-08-26 | National Central University | Light emitting device |
| US20080074884A1 (en) * | 2006-09-25 | 2008-03-27 | Thye Linn Mok | Compact high-intensty LED-based light source and method for making the same |
| WO2009027459A2 (de) | 2007-08-29 | 2009-03-05 | Behr-Hella Thermocontrol Gmbh | Sonnensensor zur erfassung der einfallsrichtung und der intensität von sonnenstrahlung |
| DE102009020851A1 (de) * | 2009-05-12 | 2010-11-25 | Osram Gesellschaft mit beschränkter Haftung | Leuchtband und Verfahren zum Herstellen eines Leuchtbands |
| ITTV20090228A1 (it) * | 2009-12-09 | 2011-06-10 | Giovine Vincenzo Di | Segnalatore a lungo raggio in rifrazione con sorgenti luminose di tipo led |
| DE102012202353A1 (de) * | 2012-02-16 | 2013-08-22 | Osram Gmbh | Leuchtmodul-Leiterplatte |
| DE102017104386A1 (de) | 2017-03-02 | 2018-09-06 | HELLA GmbH & Co. KGaA | Verfahren zur Herstellung einer elektrischen Baugruppe |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4733335A (en) * | 1984-12-28 | 1988-03-22 | Koito Manufacturing Co., Ltd. | Vehicular lamp |
| DE8815418U1 (da) * | 1988-12-12 | 1989-02-16 | Isensee-Electronic-Gmbh, 7012 Fellbach, De | |
| JPH033276A (ja) * | 1989-05-31 | 1991-01-09 | Nippon Denyo Kk | Ｌｅｄランプ |
| DE9003623U1 (da) * | 1990-03-28 | 1990-10-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
| JPH07114813A (ja) * | 1993-10-19 | 1995-05-02 | Koito Mfg Co Ltd | 車輌用灯具 |
| US5808592A (en) * | 1994-04-28 | 1998-09-15 | Toyoda Gosei Co., Ltd. | Integrated light-emitting diode lamp and method of producing the same |
| DE4444567A1 (de) * | 1994-12-02 | 1996-06-05 | Siemens Ag | Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung |
| US5612680A (en) * | 1995-03-31 | 1997-03-18 | Desanto; Joseph J. | Universal termination module for assembling wire harnesses having multiple diverse connectors |
| DE19528459C2 (de) * | 1995-08-03 | 2001-08-23 | Garufo Gmbh | Kühlung für ein mit LED's bestücktes Leuchtaggregat |
| US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| DE19736962B4 (de) * | 1997-08-25 | 2009-08-06 | Robert Bosch Gmbh | Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben |
-
2001
- 2001-01-19 DE DE10102353A patent/DE10102353B4/de not_active Expired - Fee Related
-
2002
- 2002-01-08 EP EP02090004A patent/EP1243843B1/de not_active Expired - Lifetime
- 2002-01-08 DK DK02090004T patent/DK1243843T3/da active
- 2002-01-08 AT AT02090004T patent/ATE419492T1/de not_active IP Right Cessation
- 2002-01-08 DE DE50213157T patent/DE50213157D1/de not_active Expired - Lifetime
- 2002-01-21 NO NO20020321A patent/NO322102B1/no not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE50213157D1 (de) | 2009-02-12 |
| EP1243843B1 (de) | 2008-12-31 |
| ATE419492T1 (de) | 2009-01-15 |
| NO20020321L (no) | 2002-07-22 |
| DE10102353A1 (de) | 2002-08-01 |
| DK1243843T3 (da) | 2009-04-14 |
| NO20020321D0 (no) | 2002-01-21 |
| EP1243843A3 (de) | 2004-12-15 |
| EP1243843A2 (de) | 2002-09-25 |
| DE10102353B4 (de) | 2007-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM1K | Lapsed by not paying the annual fees |