NO3040358T3 - - Google Patents

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Publication number
NO3040358T3
NO3040358T3 NO15163407A NO15163407A NO3040358T3 NO 3040358 T3 NO3040358 T3 NO 3040358T3 NO 15163407 A NO15163407 A NO 15163407A NO 15163407 A NO15163407 A NO 15163407A NO 3040358 T3 NO3040358 T3 NO 3040358T3
Authority
NO
Norway
Application number
NO15163407A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NO3040358T3 publication Critical patent/NO3040358T3/no

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3437—Six-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NO15163407A 2014-12-29 2015-04-13 NO3040358T3 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410844103.6A CN105802128B (zh) 2014-12-29 2014-12-29 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板

Publications (1)

Publication Number Publication Date
NO3040358T3 true NO3040358T3 (no) 2018-03-03

Family

ID=52991492

Family Applications (1)

Application Number Title Priority Date Filing Date
NO15163407A NO3040358T3 (no) 2014-12-29 2015-04-13

Country Status (8)

Country Link
US (1) US9611377B2 (no)
EP (1) EP3040358B1 (no)
KR (1) KR101641824B1 (no)
CN (1) CN105802128B (no)
ES (1) ES2645857T3 (no)
NO (1) NO3040358T3 (no)
TW (1) TWI586697B (no)
WO (1) WO2016107068A1 (no)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106317869A (zh) * 2016-08-22 2017-01-11 威海光威复合材料股份有限公司 纳米陶瓷粉改性苯并噁嗪树脂制备复合材料的方法
CN106633633A (zh) * 2016-10-20 2017-05-10 蓝星（成都）新材料有限公司 一种芳纶复合材料及其制备方法
KR102215814B1 (ko) * 2016-12-09 2021-02-16 에네오스 가부시키가이샤 경화 수지용 조성물, 이 경화 수지용 조성물의 경화물 및 경화 방법, 및 반도체 장치
CN109694462B (zh) * 2018-12-26 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、覆金属箔层压板和印制电路板
CN117050463A (zh) * 2023-07-28 2023-11-14 同宇新材料(广东)股份有限公司 一种含磷苯并噁嗪树脂组合物及其应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100276206B1 (ko) * 1998-10-12 2000-12-15 리 존시 에폭시 수지 조성물
DE60335671D1 (de) * 2002-11-08 2011-02-17 Akzo Nobel Nv Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat
EP1753772B1 (en) 2004-05-28 2016-12-28 Blue Cube IP LLC Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
JP4997937B2 (ja) 2005-12-05 2012-08-15 日立化成工業株式会社 硬化性樹脂組成物、およびこれを用いたプリプレグと多層プリント配線板
TWI423741B (zh) * 2009-02-13 2014-01-11 Iteq Corp An epoxy resin composition and a film and a substrate made of the epoxy resin composition
CN101880294B (zh) 2009-05-08 2013-08-28 萧介夫 新颖磷系双酚及其衍生物的制造方法
CN101643570B (zh) 2009-08-24 2011-08-10 广东生益科技股份有限公司 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
US8362116B2 (en) * 2010-03-15 2013-01-29 Nan Ya Plastics Corporation Low dielectric resin varnish composition for laminates and the preparation thereof
TWI494340B (zh) 2010-08-02 2015-08-01 Taiwan Union Technology Corp 環氧樹脂組成物及其製成的預浸材和印刷電路板
WO2012165665A1 (ja) * 2011-06-03 2012-12-06 Arisawa Mfg. Co., Ltd. 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板
TWI638005B (zh) * 2011-08-19 2018-10-11 法克斯聚合物股份有限公司 具優越耐火性之熱塑性聚胺基甲酸酯
KR20140029717A (ko) * 2012-08-29 2014-03-11 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
TWI646142B (zh) 2012-12-21 2019-01-01 台光電子材料股份有限公司 Resin composition and copper foil substrate and printed circuit board using same
CN103724575B (zh) 2013-12-24 2016-02-10 四川东材科技集团股份有限公司 一种含磷双酚a酚醛树脂的制备方法
CN103834168B (zh) * 2014-02-25 2016-09-07 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物
CN103965624B (zh) 2014-05-28 2016-08-31 苏州生益科技有限公司 一种无卤树脂组合物、由其制备的预浸料及层压板
CN103992622B (zh) 2014-06-10 2017-03-01 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板

Also Published As

Publication number Publication date
ES2645857T3 (es) 2017-12-11
TW201623358A (zh) 2016-07-01
WO2016107068A1 (zh) 2016-07-07
EP3040358A1 (en) 2016-07-06
CN105802128B (zh) 2018-05-04
US9611377B2 (en) 2017-04-04
KR101641824B1 (ko) 2016-07-29
US20160185939A1 (en) 2016-06-30
KR20160082910A (ko) 2016-07-11
TWI586697B (zh) 2017-06-11
EP3040358B1 (en) 2017-10-04
CN105802128A (zh) 2016-07-27

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