NO20035058D0 - Fremgangsmåte for fremstilling av byggeelementer for elektroniske apparater - Google Patents

Fremgangsmåte for fremstilling av byggeelementer for elektroniske apparater

Info

Publication number
NO20035058D0
NO20035058D0 NO20035058A NO20035058A NO20035058D0 NO 20035058 D0 NO20035058 D0 NO 20035058D0 NO 20035058 A NO20035058 A NO 20035058A NO 20035058 A NO20035058 A NO 20035058A NO 20035058 D0 NO20035058 D0 NO 20035058D0
Authority
NO
Norway
Prior art keywords
layer
metal foil
substrate material
electronic devices
building elements
Prior art date
Application number
NO20035058A
Other languages
English (en)
Norwegian (no)
Other versions
NO20035058L (no
Inventor
Anders V Ekman
Richard Stoessel
Thierry Becret
Thierry Tschan
Kurt Stutz
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Publication of NO20035058D0 publication Critical patent/NO20035058D0/no
Publication of NO20035058L publication Critical patent/NO20035058L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Epoxy Resins (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
  • Magnetic Ceramics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
NO20035058A 2001-05-21 2003-11-13 Fremgangsmåte for fremstilling av byggeelementer for elektroniske apparater NO20035058L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH9442001 2001-05-21
PCT/EP2002/005348 WO2002096171A1 (fr) 2001-05-21 2002-05-15 Procede de fabrication de composants pour appareils electroniques

Publications (2)

Publication Number Publication Date
NO20035058D0 true NO20035058D0 (no) 2003-11-13
NO20035058L NO20035058L (no) 2003-11-13

Family

ID=4549641

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20035058A NO20035058L (no) 2001-05-21 2003-11-13 Fremgangsmåte for fremstilling av byggeelementer for elektroniske apparater

Country Status (13)

Country Link
US (1) US20040216838A1 (fr)
EP (1) EP1389408B1 (fr)
JP (1) JP2004532116A (fr)
KR (1) KR100893716B1 (fr)
CN (1) CN1311722C (fr)
AT (1) ATE279090T1 (fr)
BR (1) BR0209971A (fr)
CA (1) CA2449198A1 (fr)
DE (1) DE50201239D1 (fr)
IL (1) IL158699A0 (fr)
NO (1) NO20035058L (fr)
RU (1) RU2003133438A (fr)
WO (1) WO2002096171A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7666938B2 (en) * 2004-12-03 2010-02-23 Henkel Corporation Nanoparticle silica filled benzoxazine compositions
TWI294757B (en) * 2005-07-06 2008-03-11 Delta Electronics Inc Circuit board with a through hole wire, and forming method thereof
US7404725B2 (en) * 2006-07-03 2008-07-29 Hall David R Wiper for tool string direct electrical connection
KR101750836B1 (ko) * 2015-10-14 2017-06-27 대덕전자 주식회사 캐비티 회로기판 제조방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH470344A (de) * 1966-12-02 1969-03-31 Ciba Geigy Verfahren zur Herstellung von neuen Addukten aus Polypoxiden und Polyaminen
US4330659A (en) * 1980-10-06 1982-05-18 Ciba-Geigy Corporation Modified amine hardener systems
US4500582A (en) * 1981-05-26 1985-02-19 Ciba-Geigy Corporation Modified amine hardener systems
US4540750A (en) * 1984-09-24 1985-09-10 Ciba-Geigy Corporation Diethyl toluene diamine hardener systems
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
JPH02178042A (ja) * 1988-12-28 1990-07-11 Somar Corp 熱硬化性樹脂フイルム
JPH02177596A (ja) * 1988-12-28 1990-07-10 Somar Corp 多層配線板の製造方法
EP0377332A3 (fr) * 1988-12-28 1990-11-07 Somar Corporation Film multicouche comprenant une couche de résine thermodurcissable et son utilisation pour former une couche isolante sur un substrat conducteur
EP0379464B1 (fr) * 1989-01-16 1993-02-10 Ciba-Geigy Ag Sels de sulphonium araliphatiques et leur utilisation
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
TW237466B (fr) * 1992-07-21 1995-01-01 Giba Gerigy Ag
JPH0722741A (ja) * 1993-07-01 1995-01-24 Japan Gore Tex Inc カバーレイフィルム及びカバーレイフィルム被覆回路基板
US6016598A (en) * 1995-02-13 2000-01-25 Akzo Nobel N.V. Method of manufacturing a multilayer printed wire board
JP3084352B2 (ja) * 1995-08-28 2000-09-04 太陽インキ製造株式会社 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法
TW331698B (en) * 1996-06-18 1998-05-11 Hitachi Chemical Co Ltd Multi-layered printed circuit board
US5837355A (en) * 1996-11-07 1998-11-17 Sumitomo Bakelite Company Limited Multilayer printed circuit board and process for producing and using the same
TW399398B (en) * 1998-01-07 2000-07-21 Taiyo Ink Seizo K K Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof

Also Published As

Publication number Publication date
WO2002096171A1 (fr) 2002-11-28
ATE279090T1 (de) 2004-10-15
KR20040005957A (ko) 2004-01-16
CN1311722C (zh) 2007-04-18
RU2003133438A (ru) 2005-05-10
DE50201239D1 (de) 2004-11-11
US20040216838A1 (en) 2004-11-04
EP1389408A1 (fr) 2004-02-18
CN1511434A (zh) 2004-07-07
JP2004532116A (ja) 2004-10-21
CA2449198A1 (fr) 2002-11-28
IL158699A0 (en) 2004-05-12
NO20035058L (no) 2003-11-13
BR0209971A (pt) 2004-04-06
KR100893716B1 (ko) 2009-04-17
EP1389408B1 (fr) 2004-10-06

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application