NO20021507L - Tempor¶r bro for mikromaskinerte konstruksjoner - Google Patents

Tempor¶r bro for mikromaskinerte konstruksjoner

Info

Publication number
NO20021507L
NO20021507L NO20021507A NO20021507A NO20021507L NO 20021507 L NO20021507 L NO 20021507L NO 20021507 A NO20021507 A NO 20021507A NO 20021507 A NO20021507 A NO 20021507A NO 20021507 L NO20021507 L NO 20021507L
Authority
NO
Norway
Prior art keywords
micro
temporor
constructions
machined
bridge
Prior art date
Application number
NO20021507A
Other languages
English (en)
Norwegian (no)
Other versions
NO20021507D0 (no
Inventor
Lianzhong Yu
Howard D Goldberg
Duli Yu
Original Assignee
Input Output Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Input Output Inc filed Critical Input Output Inc
Publication of NO20021507D0 publication Critical patent/NO20021507D0/no
Publication of NO20021507L publication Critical patent/NO20021507L/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00142—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Bridges Or Land Bridges (AREA)
  • Golf Clubs (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Slide Fasteners, Snap Fasteners, And Hook Fasteners (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
NO20021507A 1999-09-27 2002-03-26 Tempor¶r bro for mikromaskinerte konstruksjoner NO20021507L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/406,158 US6458513B1 (en) 1999-07-13 1999-09-27 Temporary bridge for micro machined structures
PCT/US2000/026355 WO2001024228A2 (en) 1999-09-27 2000-09-25 Temporary bridge for micro machined structures

Publications (2)

Publication Number Publication Date
NO20021507D0 NO20021507D0 (no) 2002-03-26
NO20021507L true NO20021507L (no) 2002-03-26

Family

ID=23606774

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20021507A NO20021507L (no) 1999-09-27 2002-03-26 Tempor¶r bro for mikromaskinerte konstruksjoner

Country Status (9)

Country Link
US (1) US6458513B1 (de)
EP (1) EP1252028B1 (de)
JP (1) JP2003510194A (de)
AT (1) ATE439249T1 (de)
AU (1) AU7715200A (de)
CA (1) CA2384889C (de)
DE (1) DE60042757D1 (de)
NO (1) NO20021507L (de)
WO (1) WO2001024228A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693245B2 (en) * 2000-09-29 2004-02-17 Anritsu Corporation Electronic balance which is easily assembled, maintained, downsized and improved with respect to weighing performance, and method for manufacturing the same
US6818464B2 (en) 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
WO2003098302A2 (en) * 2002-05-15 2003-11-27 Hymite A/S Optical device receiving substrate and optical device holding carrier
US7681306B2 (en) 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
JP4651476B2 (ja) * 2005-07-29 2011-03-16 株式会社リコー 光走査装置の組立方法および光走査装置ならびに画像形成装置
EP1967317A1 (de) * 2007-03-07 2008-09-10 Fujitsu Limited Verfahren zur Trennung eines Werkstücks und Laserbearbeitungsvorrichtung
CN103149684B (zh) * 2013-02-07 2015-01-28 东南大学 可双向扭转的交错梳齿静电驱动可变光衰减器及制备方法
US20230127991A1 (en) * 2020-03-26 2023-04-27 Wemems Co.,Ltd. Light scanner package and method for manufacturing same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190748A (ja) * 1986-02-17 1987-08-20 Nissan Motor Co Ltd 半導体加速度センサ組立方法
US5060039A (en) * 1988-01-13 1991-10-22 The Charles Stark Draper Laboratory, Inc. Permanent magnet force rebalance micro accelerometer
US5534111A (en) * 1988-02-29 1996-07-09 Honeywell Inc. Thermal isolation microstructure
JPH04258175A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp シリコン半導体加速度センサの製造方法
JP3293194B2 (ja) * 1992-10-13 2002-06-17 株式会社デンソー 力学量センサ
JPH06350105A (ja) * 1993-06-07 1994-12-22 Nec Corp マイクロマシンとその製造方法
US5364497A (en) 1993-08-04 1994-11-15 Analog Devices, Inc. Method for fabricating microstructures using temporary bridges
JP2775578B2 (ja) * 1993-09-20 1998-07-16 仗祐 中田 加速度センサとその製造方法
US5369057A (en) * 1993-12-21 1994-11-29 Delco Electronics Corporation Method of making and sealing a semiconductor device having an air path therethrough
JPH07240395A (ja) * 1994-02-28 1995-09-12 Matsushita Electric Works Ltd 半導体装置の製造方法
US5481102A (en) * 1994-03-31 1996-01-02 Hazelrigg, Jr.; George A. Micromechanical/microelectromechanical identification devices and methods of fabrication and encoding thereof
JPH1096744A (ja) * 1996-09-20 1998-04-14 Zexel Corp 容量型加速度センサの製造方法
JPH10163505A (ja) * 1996-11-29 1998-06-19 Mitsubishi Materials Corp 半導体慣性センサ及びその製造方法
JPH1172505A (ja) * 1997-06-17 1999-03-16 Denso Corp 加速度センサおよびその製造方法
JPH1140820A (ja) * 1997-07-18 1999-02-12 Denso Corp 半導体力学量センサの製造方法
GB2343550A (en) * 1997-07-29 2000-05-10 Silicon Genesis Corp Cluster tool method and apparatus using plasma immersion ion implantation
EP1031736B1 (de) * 1999-02-26 2004-04-28 STMicroelectronics S.r.l. Verfahren zur Herstellung mechanischer, elektromechanischer und opto-elektromechanischer Mikrostrukturen mit aufgehängten Regionen welche während des Zusammenbaus mechanischen Spannungen ausgesetzt sind
JP3580179B2 (ja) * 1999-05-26 2004-10-20 松下電工株式会社 半導体加速度センサの製造方法

Also Published As

Publication number Publication date
EP1252028A4 (de) 2006-03-01
US6458513B1 (en) 2002-10-01
EP1252028A2 (de) 2002-10-30
JP2003510194A (ja) 2003-03-18
WO2001024228A2 (en) 2001-04-05
DE60042757D1 (de) 2009-09-24
AU7715200A (en) 2001-04-30
NO20021507D0 (no) 2002-03-26
ATE439249T1 (de) 2009-08-15
CA2384889A1 (en) 2001-04-05
CA2384889C (en) 2010-05-04
EP1252028B1 (de) 2009-08-12
WO2001024228A3 (en) 2002-03-14

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application