NL84048C - - Google Patents

Info

Publication number
NL84048C
NL84048C NL84048DA NL84048C NL 84048 C NL84048 C NL 84048C NL 84048D A NL84048D A NL 84048DA NL 84048 C NL84048 C NL 84048C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL84048C publication Critical patent/NL84048C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL84048D 1952-07-05 NL84048C (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2742412X 1952-07-05

Publications (1)

Publication Number Publication Date
NL84048C true NL84048C (de)

Family

ID=19875526

Family Applications (4)

Application Number Title Priority Date Filing Date
NLAANVRAGE7106028,A NL170870B (nl) 1952-07-05 Werkwijze voor het vuurvast bekleden van ovenwanden en een aldus vervaardigde metallurgische schachtoven.
NL81606D NL81606C (de) 1952-07-05
NLAANVRAGE7413473,A NL170871B (nl) 1952-07-05 Werkwijze voor het verwijderen van zware en/of giftige metalen uit afvalgas.
NL84048D NL84048C (de) 1952-07-05

Family Applications Before (3)

Application Number Title Priority Date Filing Date
NLAANVRAGE7106028,A NL170870B (nl) 1952-07-05 Werkwijze voor het vuurvast bekleden van ovenwanden en een aldus vervaardigde metallurgische schachtoven.
NL81606D NL81606C (de) 1952-07-05
NLAANVRAGE7413473,A NL170871B (nl) 1952-07-05 Werkwijze voor het verwijderen van zware en/of giftige metalen uit afvalgas.

Country Status (4)

Country Link
US (2) US2742413A (de)
BE (1) BE518440A (de)
DE (2) DE940860C (de)
NL (4) NL84048C (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
DE1007592B (de) * 1955-01-19 1957-05-02 Dehydag Gmbh Bad zur Herstellung von galvanischen Metallueberzuegen
US2853443A (en) * 1956-04-25 1958-09-23 Westinghouse Electric Corp Addition agent for acid copper electrolytes
BE565994A (de) * 1957-04-16
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
NL238490A (de) * 1958-04-26
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4474649A (en) * 1982-06-21 1984-10-02 Asarco Incorporated Method of thiourea addition of electrolytic solutions useful for copper refining
JPH02232391A (ja) * 1988-12-21 1990-09-14 Internatl Business Mach Corp <Ibm> アデイテイブ鍍金浴および方法
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
WO2001090446A2 (en) 2000-05-23 2001-11-29 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
EP1470268A2 (de) * 2000-10-03 2004-10-27 Applied Materials, Inc. Verfahren und zugehöriger apparat zum kippen eines substrats beim eintauchen zur metallplattierung
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20100140098A1 (en) * 2008-05-15 2010-06-10 Solopower, Inc. Selenium containing electrodeposition solution and methods
JP2017503929A (ja) * 2013-11-25 2017-02-02 エンソン インコーポレイテッド 銅の電析

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA461186A (en) * 1949-11-22 John Franklin Beaver, Jr. Bright copper plating
CA477508A (en) * 1951-10-02 Brown Henry Electrodeposition of nickel from acid baths
DE104111C (de) *
US2196588A (en) * 1937-05-26 1940-04-09 Du Pont Electroplating
US2315802A (en) * 1940-04-20 1943-04-06 Harshaw Chem Corp Nickel plating
US2389179A (en) * 1941-02-21 1945-11-20 Udylite Corp Electrodeposition of metals
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
US2355505A (en) * 1941-10-03 1944-08-08 Purdue Research Foundation Electrodeposition of bright zinc
US2462870A (en) * 1942-07-09 1949-03-01 Gen Motors Corp Electrodeposition of copper
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
BE504701A (de) * 1950-07-17
US2700020A (en) * 1952-06-02 1955-01-18 Houdaille Hershey Corp Plating copper

Also Published As

Publication number Publication date
DE940860C (de) 1956-03-29
BE518440A (de)
DE962129C (de) 1957-04-18
US2742413A (en) 1956-04-17
US2742412A (en) 1956-04-17
NL170870B (nl)
NL170871B (nl)
NL81606C (de)

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