NL8200561A - Werkwijze voor het neerslaan van een metaal. - Google Patents

Werkwijze voor het neerslaan van een metaal. Download PDF

Info

Publication number
NL8200561A
NL8200561A NL8200561A NL8200561A NL8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A
Authority
NL
Netherlands
Prior art keywords
substrate
metal
layer
irradiated
deposited
Prior art date
Application number
NL8200561A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8200561A priority Critical patent/NL8200561A/nl
Priority to US06/459,859 priority patent/US4441964A/en
Priority to EP83200147A priority patent/EP0086520B1/en
Priority to DE8383200147T priority patent/DE3360538D1/de
Priority to JP58019901A priority patent/JPS58147584A/ja
Priority to CA000421348A priority patent/CA1217163A/en
Publication of NL8200561A publication Critical patent/NL8200561A/nl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/024Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H10W72/536
    • H10W72/884
    • H10W90/736

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
NL8200561A 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal. NL8200561A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.
US06/459,859 US4441964A (en) 1982-02-15 1983-01-21 Method of depositing a metal
EP83200147A EP0086520B1 (en) 1982-02-15 1983-01-27 Method of depositing a metal
DE8383200147T DE3360538D1 (en) 1982-02-15 1983-01-27 Method of depositing a metal
JP58019901A JPS58147584A (ja) 1982-02-15 1983-02-10 金属を堆積する方法
CA000421348A CA1217163A (en) 1982-02-15 1983-02-10 Method of depositing a metal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8200561 1982-02-15
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.

Publications (1)

Publication Number Publication Date
NL8200561A true NL8200561A (nl) 1983-09-01

Family

ID=19839257

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.

Country Status (6)

Country Link
US (1) US4441964A (index.php)
EP (1) EP0086520B1 (index.php)
JP (1) JPS58147584A (index.php)
CA (1) CA1217163A (index.php)
DE (1) DE3360538D1 (index.php)
NL (1) NL8200561A (index.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188774B (en) * 1986-04-02 1990-10-31 Westinghouse Electric Corp Method of forming a conductive pattern on a semiconductor surface
US5182230A (en) * 1988-07-25 1993-01-26 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US5171709A (en) * 1988-07-25 1992-12-15 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US6900119B2 (en) 2001-06-28 2005-05-31 Micron Technology, Inc. Agglomeration control using early transition metal alloys
US20060166013A1 (en) * 2005-01-24 2006-07-27 Hoden Seimitsu Kako Kenyusho Co., Ltd. Chromium-free rust inhibitive treatment method for metal products having zinc surface and metal products treated thereby

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates

Also Published As

Publication number Publication date
US4441964A (en) 1984-04-10
CA1217163A (en) 1987-01-27
JPS58147584A (ja) 1983-09-02
DE3360538D1 (en) 1985-09-19
JPS6210317B2 (index.php) 1987-03-05
EP0086520A1 (en) 1983-08-24
EP0086520B1 (en) 1985-08-14

Similar Documents

Publication Publication Date Title
US5156997A (en) Method of making semiconductor bonding bumps using metal cluster ion deposition
US4144139A (en) Method of plating by means of light
CN101796622B (zh) 半导体元件、其制造方法及实装其的实装构造体
TWI243488B (en) Electrical contact-area for optoelectronic semiconductor-chip and its production method
US8030744B2 (en) Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
JP2526007B2 (ja) 半導体チップへの電気的相互接続を形成するための構造および方法
JPS60189931A (ja) 半導体デバイスの電気コーテイング処理の方法
US10937744B2 (en) Semiconductor packages including roughening features
JP2001502121A (ja) 背面を金属化した半導体
JPH0722435A (ja) 半導体装置およびその製造方法
US10566214B1 (en) Seed layer free nanoporous metal deposition for bonding
US3528090A (en) Method of providing an electric connection on a surface of an electronic device and device obtained by using said method
NL8200561A (nl) Werkwijze voor het neerslaan van een metaal.
US6603190B2 (en) Semiconductor device
RU98120170A (ru) Подложка, способ ее получения (варианты) и металлическое соединенное изделие
US4767049A (en) Special surfaces for wire bonding
EP0756325A3 (de) Halbleitervorrichtung mit einem Träger
US6805786B2 (en) Precious alloyed metal solder plating process
JPH07183304A (ja) 半導体装置の製造方法
EP1524693A1 (en) Leadframe being protected against corrosion
US7923842B2 (en) GaAs integrated circuit device and method of attaching same
US20210050227A1 (en) Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
US5935719A (en) Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes
JP3289890B2 (ja) ヒートシンクおよびその製造方法
JPS62122157A (ja) 光半導体用ヒ−トシンクの電極構造

Legal Events

Date Code Title Description
A1B A search report has been drawn up
BV The patent application has lapsed