NL8200561A - Werkwijze voor het neerslaan van een metaal. - Google Patents

Werkwijze voor het neerslaan van een metaal. Download PDF

Info

Publication number
NL8200561A
NL8200561A NL8200561A NL8200561A NL8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A NL 8200561 A NL8200561 A NL 8200561A
Authority
NL
Netherlands
Prior art keywords
substrate
metal
layer
irradiated
deposited
Prior art date
Application number
NL8200561A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8200561A priority Critical patent/NL8200561A/nl
Priority to US06/459,859 priority patent/US4441964A/en
Priority to DE8383200147T priority patent/DE3360538D1/de
Priority to EP83200147A priority patent/EP0086520B1/de
Priority to CA000421348A priority patent/CA1217163A/en
Priority to JP58019901A priority patent/JPS58147584A/ja
Publication of NL8200561A publication Critical patent/NL8200561A/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
NL8200561A 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal. NL8200561A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.
US06/459,859 US4441964A (en) 1982-02-15 1983-01-21 Method of depositing a metal
DE8383200147T DE3360538D1 (en) 1982-02-15 1983-01-27 Method of depositing a metal
EP83200147A EP0086520B1 (de) 1982-02-15 1983-01-27 Verfahren zur Metallplattierung
CA000421348A CA1217163A (en) 1982-02-15 1983-02-10 Method of depositing a metal
JP58019901A JPS58147584A (ja) 1982-02-15 1983-02-10 金属を堆積する方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8200561 1982-02-15
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.

Publications (1)

Publication Number Publication Date
NL8200561A true NL8200561A (nl) 1983-09-01

Family

ID=19839257

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8200561A NL8200561A (nl) 1982-02-15 1982-02-15 Werkwijze voor het neerslaan van een metaal.

Country Status (6)

Country Link
US (1) US4441964A (de)
EP (1) EP0086520B1 (de)
JP (1) JPS58147584A (de)
CA (1) CA1217163A (de)
DE (1) DE3360538D1 (de)
NL (1) NL8200561A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188774B (en) * 1986-04-02 1990-10-31 Westinghouse Electric Corp Method of forming a conductive pattern on a semiconductor surface
US5171709A (en) * 1988-07-25 1992-12-15 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US5182230A (en) * 1988-07-25 1993-01-26 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US6900119B2 (en) 2001-06-28 2005-05-31 Micron Technology, Inc. Agglomeration control using early transition metal alloys
US20060166013A1 (en) * 2005-01-24 2006-07-27 Hoden Seimitsu Kako Kenyusho Co., Ltd. Chromium-free rust inhibitive treatment method for metal products having zinc surface and metal products treated thereby
CN106467965B (zh) * 2016-09-27 2018-07-27 北京科技大学 一种陶瓷电路基板表面精细化金属图案的制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates

Also Published As

Publication number Publication date
JPS6210317B2 (de) 1987-03-05
DE3360538D1 (en) 1985-09-19
EP0086520A1 (de) 1983-08-24
EP0086520B1 (de) 1985-08-14
JPS58147584A (ja) 1983-09-02
US4441964A (en) 1984-04-10
CA1217163A (en) 1987-01-27

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Legal Events

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A1B A search report has been drawn up
BV The patent application has lapsed