NL7803039A - Aandrukbare halfgeleider inrichting. - Google Patents

Aandrukbare halfgeleider inrichting.

Info

Publication number
NL7803039A
NL7803039A NL7803039A NL7803039A NL7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A
Authority
NL
Netherlands
Prior art keywords
pushable
semiconductor device
semiconductor
pushable semiconductor
Prior art date
Application number
NL7803039A
Other languages
English (en)
Dutch (nl)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL7803039A publication Critical patent/NL7803039A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL7803039A 1977-03-21 1978-03-21 Aandrukbare halfgeleider inrichting. NL7803039A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/779,327 US4117508A (en) 1977-03-21 1977-03-21 Pressurizable semiconductor pellet assembly

Publications (1)

Publication Number Publication Date
NL7803039A true NL7803039A (nl) 1978-09-25

Family

ID=25116057

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7803039A NL7803039A (nl) 1977-03-21 1978-03-21 Aandrukbare halfgeleider inrichting.

Country Status (4)

Country Link
US (1) US4117508A (de)
JP (1) JPS53124982A (de)
DE (1) DE2811933A1 (de)
NL (1) NL7803039A (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
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EP0015053A1 (de) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company Verfahren zur Herstellung einer Baugruppe mit Leistungshalbleiter und nach diesem Verfahren hergestellte Baugruppe
GB2089119A (en) * 1980-12-10 1982-06-16 Philips Electronic Associated High voltage semiconductor devices
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
EP0076802A4 (de) * 1981-02-27 1984-12-11 Motorola Inc Packung für hohe stromstärke mit leitern auf mehreren ebenen.
EP0065686A3 (de) * 1981-05-21 1984-10-10 General Electric Company Leistungsanordnung-Modul
FR2507353B1 (fr) * 1981-06-05 1985-08-30 Cepe Cellule de couplage thermique entre un element calorifique et un element thermo-sensible et enceinte thermostatee pour cristal piezo-electrique comportant une telle cellule
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
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FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
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DE2811933A1 (de) 1978-09-28
US4117508A (en) 1978-09-26
JPS53124982A (en) 1978-10-31

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