NL7803039A - Aandrukbare halfgeleider inrichting. - Google Patents

Aandrukbare halfgeleider inrichting.

Info

Publication number
NL7803039A
NL7803039A NL7803039A NL7803039A NL7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A NL 7803039 A NL7803039 A NL 7803039A
Authority
NL
Netherlands
Prior art keywords
pushable
semiconductor device
semiconductor
pushable semiconductor
Prior art date
Application number
NL7803039A
Other languages
English (en)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL7803039A publication Critical patent/NL7803039A/nl

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL7803039A 1977-03-21 1978-03-21 Aandrukbare halfgeleider inrichting. NL7803039A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/779,327 US4117508A (en) 1977-03-21 1977-03-21 Pressurizable semiconductor pellet assembly

Publications (1)

Publication Number Publication Date
NL7803039A true NL7803039A (nl) 1978-09-25

Family

ID=25116057

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7803039A NL7803039A (nl) 1977-03-21 1978-03-21 Aandrukbare halfgeleider inrichting.

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Country Link
US (1) US4117508A (nl)
JP (1) JPS53124982A (nl)
DE (1) DE2811933A1 (nl)
NL (1) NL7803039A (nl)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
GB2089119A (en) * 1980-12-10 1982-06-16 Philips Electronic Associated High voltage semiconductor devices
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
JPS58500187A (ja) * 1981-02-07 1983-02-03 モトロ−ラ・インコ−ポレ−テツド 多レベル・リ−ドを有する大電流パツケ−ジ
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
FR2507353B1 (fr) * 1981-06-05 1985-08-30 Cepe Cellule de couplage thermique entre un element calorifique et un element thermo-sensible et enceinte thermostatee pour cristal piezo-electrique comportant une telle cellule
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
JPS5893358A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4603345A (en) * 1984-03-19 1986-07-29 Trilogy Computer Development Partners, Ltd. Module construction for semiconductor chip
FR2570877B1 (fr) * 1984-09-21 1987-05-22 Silicium Semiconducteur Ssc Composant semi-conducteur monte en boitier plastique et procede de montage correspondant
JPS6184851A (ja) * 1984-10-02 1986-04-30 Mitsubishi Electric Corp 半導体装置の外部端子取付方法
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
US5258647A (en) * 1989-07-03 1993-11-02 General Electric Company Electronic systems disposed in a high force environment
WO1991000617A1 (en) * 1989-07-03 1991-01-10 General Electric Company Low inductance encapsulated package including a semiconductor chip
US5172471A (en) * 1991-06-21 1992-12-22 Vlsi Technology, Inc. Method of providing power to an integrated circuit
US5302553A (en) * 1991-10-04 1994-04-12 Texas Instruments Incorporated Method of forming a coated plastic package
US5339218A (en) * 1993-05-20 1994-08-16 Microsemi Corporation Surface mount device
US5847436A (en) * 1994-03-18 1998-12-08 Kabushiki Kaisha Tokai Rika Denki Seisakusho Bipolar transistor having integrated thermistor shunt
DE19638090C2 (de) * 1996-09-18 2001-11-29 Infineon Technologies Ag Stromanschluß für Leistungshalbleiterbauelement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3414968A (en) * 1965-02-23 1968-12-10 Solitron Devices Method of assembly of power transistors
DE1815989A1 (de) * 1968-12-20 1970-07-02 Semikron Gleichrichterbau Halbleiter-Anordnung
US3846823A (en) * 1971-08-05 1974-11-05 Lucerne Products Inc Semiconductor assembly
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate

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US4117508A (en) 1978-09-26
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