NL7713449A - Vorming van geintegreerde keten-gebied in sili- cium door inplanten van arsenicum en germanium. - Google Patents
Vorming van geintegreerde keten-gebied in sili- cium door inplanten van arsenicum en germanium.Info
- Publication number
- NL7713449A NL7713449A NL7713449A NL7713449A NL7713449A NL 7713449 A NL7713449 A NL 7713449A NL 7713449 A NL7713449 A NL 7713449A NL 7713449 A NL7713449 A NL 7713449A NL 7713449 A NL7713449 A NL 7713449A
- Authority
- NL
- Netherlands
- Prior art keywords
- arsenicum
- silicium
- germanium
- planning
- formation
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 title 1
- 229910052732 germanium Inorganic materials 0.000 title 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/167—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table further characterised by the doping material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/024—Defect control-gettering and annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/061—Gettering-armorphous layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Bipolar Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/748,035 US4111719A (en) | 1976-12-06 | 1976-12-06 | Minimization of misfit dislocations in silicon by double implantation of arsenic and germanium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7713449A true NL7713449A (nl) | 1978-06-08 |
Family
ID=25007704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7713449A NL7713449A (nl) | 1976-12-06 | 1977-12-05 | Vorming van geintegreerde keten-gebied in sili- cium door inplanten van arsenicum en germanium. |
Country Status (14)
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4369072A (en) * | 1981-01-22 | 1983-01-18 | International Business Machines Corp. | Method for forming IGFET devices having improved drain voltage characteristics |
| JPS5935425A (ja) * | 1982-08-23 | 1984-02-27 | Toshiba Corp | 半導体装置の製造方法 |
| GB2133618B (en) * | 1983-01-05 | 1986-09-10 | Gen Electric Co Plc | Fabricating semiconductor circuits |
| US4603471A (en) * | 1984-09-06 | 1986-08-05 | Fairchild Semiconductor Corporation | Method for making a CMOS circuit having a reduced tendency to latch by controlling the band-gap of source and drain regions |
| US4728998A (en) * | 1984-09-06 | 1988-03-01 | Fairchild Semiconductor Corporation | CMOS circuit having a reduced tendency to latch |
| US4928156A (en) * | 1987-07-13 | 1990-05-22 | Motorola, Inc. | N-channel MOS transistors having source/drain regions with germanium |
| US4837173A (en) * | 1987-07-13 | 1989-06-06 | Motorola, Inc. | N-channel MOS transistors having source/drain regions with germanium |
| JPH01220822A (ja) * | 1988-02-29 | 1989-09-04 | Mitsubishi Electric Corp | 化合物半導体装置の製造方法 |
| US4835112A (en) * | 1988-03-08 | 1989-05-30 | Motorola, Inc. | CMOS salicide process using germanium implantation |
| US5097308A (en) * | 1990-03-13 | 1992-03-17 | General Instrument Corp. | Method for controlling the switching speed of bipolar power devices |
| US5298435A (en) * | 1990-04-18 | 1994-03-29 | National Semiconductor Corporation | Application of electronic properties of germanium to inhibit n-type or p-type diffusion in silicon |
| US5095358A (en) * | 1990-04-18 | 1992-03-10 | National Semiconductor Corporation | Application of electronic properties of germanium to inhibit n-type or p-type diffusion in silicon |
| US5316958A (en) * | 1990-05-31 | 1994-05-31 | International Business Machines Corporation | Method of dopant enhancement in an epitaxial silicon layer by using germanium |
| US5266510A (en) * | 1990-08-09 | 1993-11-30 | Micron Technology, Inc. | High performance sub-micron p-channel transistor with germanium implant |
| US5108935A (en) * | 1990-11-16 | 1992-04-28 | Texas Instruments Incorporated | Reduction of hot carrier effects in semiconductor devices by controlled scattering via the intentional introduction of impurities |
| US5108954A (en) * | 1991-09-23 | 1992-04-28 | Micron Technology, Inc. | Method of reducing contact resistance at silicide/active area interfaces and semiconductor devices produced according to the method |
| US5420055A (en) * | 1992-01-22 | 1995-05-30 | Kopin Corporation | Reduction of parasitic effects in floating body MOSFETs |
| US5426069A (en) * | 1992-04-09 | 1995-06-20 | Dalsa Inc. | Method for making silicon-germanium devices using germanium implantation |
| KR0123434B1 (ko) * | 1994-02-07 | 1997-11-26 | 천성순 | 실리콘 웨이퍼에서의 부정합전위의 발생을 억제화하기 위한 링패턴 형성방법 및 그 구조 |
| JP3243146B2 (ja) * | 1994-12-08 | 2002-01-07 | 株式会社東芝 | 半導体装置 |
| JP2002504270A (ja) * | 1998-04-09 | 2002-02-05 | コーニンクレッカ、フィリップス、エレクトロニクス、エヌ、ヴィ | 整流接合を有する半導体デバイスおよび該半導体デバイスの製造方法 |
| US6030863A (en) * | 1998-09-11 | 2000-02-29 | Taiwan Semiconductor Manufacturing Company | Germanium and arsenic double implanted pre-amorphization process for salicide technology |
| US6262456B1 (en) | 1998-11-06 | 2001-07-17 | Advanced Micro Devices, Inc. | Integrated circuit having transistors with different threshold voltages |
| US6114206A (en) * | 1998-11-06 | 2000-09-05 | Advanced Micro Devices, Inc. | Multiple threshold voltage transistor implemented by a damascene process |
| GB9826519D0 (en) * | 1998-12-02 | 1999-01-27 | Arima Optoelectronics Corp | Semiconductor devices |
| US20040121524A1 (en) * | 2002-12-20 | 2004-06-24 | Micron Technology, Inc. | Apparatus and method for controlling diffusion |
| US7297617B2 (en) * | 2003-04-22 | 2007-11-20 | Micron Technology, Inc. | Method for controlling diffusion in semiconductor regions |
| US7253071B2 (en) * | 2004-06-02 | 2007-08-07 | Taiwan Semiconductor Manufacturing Company | Methods for enhancing the formation of nickel mono-silicide by reducing the formation of nickel di-silicide |
| US8110469B2 (en) | 2005-08-30 | 2012-02-07 | Micron Technology, Inc. | Graded dielectric layers |
| WO2021163175A1 (en) * | 2020-02-11 | 2021-08-19 | QROMIS, Inc. | Method and system for diffusing magnesium in gallium nitride materials using sputtered magnesium sources |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL204025A (US20110232667A1-20110929-C00004.png) * | 1955-03-23 | |||
| US3485684A (en) * | 1967-03-30 | 1969-12-23 | Trw Semiconductors Inc | Dislocation enhancement control of silicon by introduction of large diameter atomic metals |
| US3836999A (en) * | 1970-09-21 | 1974-09-17 | Semiconductor Res Found | Semiconductor with grown layer relieved in lattice strain |
| US3943016A (en) * | 1970-12-07 | 1976-03-09 | General Electric Company | Gallium-phosphorus simultaneous diffusion process |
| NL161920C (nl) * | 1971-03-12 | 1980-03-17 | Hitachi Ltd | Werkwijze voor het vervaardigen van een half- geleiderinrichting, waarbij de roostervervorming t.g.v. doteerstoffen wordt gecompenseerd. |
| JPS50116274A (US20110232667A1-20110929-C00004.png) * | 1974-02-27 | 1975-09-11 |
-
1976
- 1976-12-06 US US05/748,035 patent/US4111719A/en not_active Expired - Lifetime
-
1977
- 1977-09-23 CA CA287,340A patent/CA1075831A/en not_active Expired
- 1977-10-18 FR FR7732160A patent/FR2379162A1/fr active Granted
- 1977-10-26 JP JP12770077A patent/JPS5370668A/ja active Pending
- 1977-10-31 BE BE182249A patent/BE860359A/xx not_active IP Right Cessation
- 1977-11-03 IT IT29282/77A patent/IT1113672B/it active
- 1977-11-04 AU AU30349/77A patent/AU507591B2/en not_active Expired
- 1977-11-14 CH CH1382977A patent/CH623685A5/de not_active IP Right Cessation
- 1977-11-16 GB GB47695/77A patent/GB1536618A/en not_active Expired
- 1977-11-24 DE DE2752439A patent/DE2752439C3/de not_active Expired
- 1977-11-28 BR BR7707919A patent/BR7707919A/pt unknown
- 1977-12-02 ES ES464680A patent/ES464680A1/es not_active Expired
- 1977-12-05 NL NL7713449A patent/NL7713449A/xx not_active Application Discontinuation
- 1977-12-05 SE SE7713736A patent/SE425529B/sv not_active IP Right Cessation
-
1978
- 1978-05-22 US US05/908,322 patent/US4137103A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4111719A (en) | 1978-09-05 |
| CA1075831A (en) | 1980-04-15 |
| AU3034977A (en) | 1979-05-10 |
| ES464680A1 (es) | 1979-01-01 |
| CH623685A5 (US20110232667A1-20110929-C00004.png) | 1981-06-15 |
| IT1113672B (it) | 1986-01-20 |
| SE7713736L (sv) | 1978-06-07 |
| GB1536618A (en) | 1978-12-20 |
| DE2752439C3 (de) | 1981-01-29 |
| BE860359A (fr) | 1978-02-15 |
| AU507591B2 (en) | 1980-02-21 |
| DE2752439A1 (de) | 1978-06-08 |
| DE2752439B2 (de) | 1980-05-22 |
| BR7707919A (pt) | 1978-09-05 |
| US4137103A (en) | 1979-01-30 |
| FR2379162B1 (US20110232667A1-20110929-C00004.png) | 1980-12-19 |
| FR2379162A1 (fr) | 1978-08-25 |
| JPS5370668A (en) | 1978-06-23 |
| SE425529B (sv) | 1982-10-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BV | The patent application has lapsed |