NL7605701A - Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder - Google Patents

Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder

Info

Publication number
NL7605701A
NL7605701A NL7605701A NL7605701A NL7605701A NL 7605701 A NL7605701 A NL 7605701A NL 7605701 A NL7605701 A NL 7605701A NL 7605701 A NL7605701 A NL 7605701A NL 7605701 A NL7605701 A NL 7605701A
Authority
NL
Netherlands
Prior art keywords
copper
hardened
cpd
circuits
reducing agent
Prior art date
Application number
NL7605701A
Other languages
Dutch (nl)
Original Assignee
Mitsui Toatsu Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals filed Critical Mitsui Toatsu Chemicals
Priority to NL7605701A priority Critical patent/NL7605701A/en
Publication of NL7605701A publication Critical patent/NL7605701A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

Conductive hardened prod. mfr. involves reacting a Cu cpd. (I) with a reducing agent (II), which can reduce (I) to Cu in the presence of Cu powder on a substrate, so that a conductive bound unit of Cu powder is formed, and subjecting this to hardening-forming with a hardenable resinous compsn., so that the constituents are integrated to a conductive hardened prod. Used for producing electric circuits and heating circuits, filling galvanised perforations, fixing components, vehicle window de-icing circuits, FM receiving attanae, domestic heating circuits and window burglar alarm circuits. The prods. have good initial and long-term conductivity and can be formed at low temp.
NL7605701A 1976-05-26 1976-05-26 Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder NL7605701A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL7605701A NL7605701A (en) 1976-05-26 1976-05-26 Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7605701A NL7605701A (en) 1976-05-26 1976-05-26 Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder

Publications (1)

Publication Number Publication Date
NL7605701A true NL7605701A (en) 1977-11-29

Family

ID=19826268

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7605701A NL7605701A (en) 1976-05-26 1976-05-26 Hardened conductors having good initial and long term conductivity - mfd. from copper powder, copper cpd., reducing agent and resin binder

Country Status (1)

Country Link
NL (1) NL7605701A (en)

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
BV The patent application has lapsed