FR2298251A1 - Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape - Google Patents

Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape

Info

Publication number
FR2298251A1
FR2298251A1 FR7500907A FR7500907A FR2298251A1 FR 2298251 A1 FR2298251 A1 FR 2298251A1 FR 7500907 A FR7500907 A FR 7500907A FR 7500907 A FR7500907 A FR 7500907A FR 2298251 A1 FR2298251 A1 FR 2298251A1
Authority
FR
France
Prior art keywords
components
wiring
shape
manual work
work required
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7500907A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR7500907A priority Critical patent/FR2298251A1/en
Publication of FR2298251A1 publication Critical patent/FR2298251A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Electrical components and wiring are assembled together on circuit boards without the use of solder or wire-wrapping. The technique, whilst not allowing easy replacement of components minimises the manual operations required in assembly. The leads of individual components are either designed specifically for the technique or they may be bent into the shape required for the circuit board design. These are then encapsulated in a suitable resin which after curing is ground in order to expose the required conductors. Conducting tracks are provided by a conducting paint interlinking the mounting points for the components; the whole circuit is then protected by covering it with a further layer of resin.
FR7500907A 1975-01-14 1975-01-14 Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape Withdrawn FR2298251A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7500907A FR2298251A1 (en) 1975-01-14 1975-01-14 Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7500907A FR2298251A1 (en) 1975-01-14 1975-01-14 Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape

Publications (1)

Publication Number Publication Date
FR2298251A1 true FR2298251A1 (en) 1976-08-13

Family

ID=9149705

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7500907A Withdrawn FR2298251A1 (en) 1975-01-14 1975-01-14 Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape

Country Status (1)

Country Link
FR (1) FR2298251A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988008180A1 (en) * 1987-04-15 1988-10-20 Dominique Bleys Electronic alarm label
FR2864342A1 (en) * 2003-12-19 2005-06-24 3D Plus Sa Electronic components e.g. ball grid array type encapsulation packages, connecting method, involves connecting conducting zones of external outputs of components appearing on wafer`s connection surface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988008180A1 (en) * 1987-04-15 1988-10-20 Dominique Bleys Electronic alarm label
FR2614109A1 (en) * 1987-04-15 1988-10-21 Bleys Dominique ELECTRONIC ALARM LABEL
FR2864342A1 (en) * 2003-12-19 2005-06-24 3D Plus Sa Electronic components e.g. ball grid array type encapsulation packages, connecting method, involves connecting conducting zones of external outputs of components appearing on wafer`s connection surface

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Legal Events

Date Code Title Description
ST Notification of lapse