NL7314156A - - Google Patents
Info
- Publication number
- NL7314156A NL7314156A NL7314156A NL7314156A NL7314156A NL 7314156 A NL7314156 A NL 7314156A NL 7314156 A NL7314156 A NL 7314156A NL 7314156 A NL7314156 A NL 7314156A NL 7314156 A NL7314156 A NL 7314156A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/202—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials for lift-off processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47104283A JPS4960870A (cg-RX-API-DMAC7.html) | 1972-10-16 | 1972-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL7314156A true NL7314156A (cg-RX-API-DMAC7.html) | 1974-04-18 |
| NL158026B NL158026B (nl) | 1978-09-15 |
Family
ID=14376586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7314156.A NL158026B (nl) | 1972-10-16 | 1973-10-15 | Werkwijze voor het vervaardigen van een geintegreerde halfgeleiderschakeling. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3945347A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS4960870A (cg-RX-API-DMAC7.html) |
| CA (1) | CA989076A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2351943B2 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2203175B1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1418969A (cg-RX-API-DMAC7.html) |
| NL (1) | NL158026B (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4096623A (en) * | 1974-07-01 | 1978-06-27 | Siemens Aktiengesellschaft | Thyristor and method of producing the same |
| FR2284981A1 (fr) * | 1974-09-10 | 1976-04-09 | Radiotechnique Compelec | Procede d'obtention d'un circuit integre semiconducteur |
| US3985597A (en) * | 1975-05-01 | 1976-10-12 | International Business Machines Corporation | Process for forming passivated metal interconnection system with a planar surface |
| US4045594A (en) * | 1975-12-31 | 1977-08-30 | Ibm Corporation | Planar insulation of conductive patterns by chemical vapor deposition and sputtering |
| FR2340620A1 (fr) * | 1976-02-06 | 1977-09-02 | Ibm | Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane |
| US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
| JPS57176746A (en) * | 1981-04-21 | 1982-10-30 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit and manufacture thereof |
| US4564997A (en) * | 1981-04-21 | 1986-01-21 | Nippon-Telegraph And Telephone Public Corporation | Semiconductor device and manufacturing process thereof |
| US4392298A (en) * | 1981-07-27 | 1983-07-12 | Bell Telephone Laboratories, Incorporated | Integrated circuit device connection process |
| US4440804A (en) * | 1982-08-02 | 1984-04-03 | Fairchild Camera & Instrument Corporation | Lift-off process for fabricating self-aligned contacts |
| JPS5982746A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | 半導体装置の電極配線方法 |
| US4631806A (en) * | 1985-05-22 | 1986-12-30 | Gte Laboratories Incorporated | Method of producing integrated circuit structures |
| JPH02125422A (ja) * | 1988-11-02 | 1990-05-14 | Nec Corp | 半導体装置の製造方法 |
| KR0121106B1 (ko) * | 1994-02-15 | 1997-11-10 | 김주용 | 반도체 소자의 금속배선 형성방법 |
| US5854128A (en) | 1996-04-29 | 1998-12-29 | Micron Technology, Inc. | Method for reducing capacitive coupling between conductive lines |
| TW350099B (en) * | 1998-01-26 | 1999-01-11 | United Microelectronics Corp | IC microfilm process |
| DE10208728B4 (de) * | 2002-02-28 | 2009-05-07 | Advanced Micro Devices, Inc., Sunnyvale | Ein Verfahren zur Herstellung eines Halbleiterelements mit unterschiedlichen Metallsilizidbereichen |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE590576A (cg-RX-API-DMAC7.html) * | 1959-05-06 | |||
| US3160534A (en) * | 1960-10-03 | 1964-12-08 | Gen Telephone & Elect | Method of making tunnel diodes |
| US3266127A (en) * | 1964-01-27 | 1966-08-16 | Ibm | Method of forming contacts on semiconductors |
| NL132313C (cg-RX-API-DMAC7.html) * | 1964-12-17 | 1900-01-01 | ||
| US3498833A (en) * | 1966-07-08 | 1970-03-03 | Fairchild Camera Instr Co | Double masking technique for integrated circuit |
| US3840982A (en) * | 1966-12-28 | 1974-10-15 | Westinghouse Electric Corp | Contacts for semiconductor devices, particularly integrated circuits, and methods of making the same |
| GB1286737A (en) * | 1969-10-15 | 1972-08-23 | Itt | Multilevel conductive systems |
| GB1363815A (en) * | 1971-12-06 | 1974-08-21 | Tektronix Inc | Semiconductor device and method of producing same |
| US3747200A (en) * | 1972-03-31 | 1973-07-24 | Motorola Inc | Integrated circuit fabrication method |
-
1972
- 1972-10-16 JP JP47104283A patent/JPS4960870A/ja active Pending
-
1973
- 1973-10-12 FR FR7336533A patent/FR2203175B1/fr not_active Expired
- 1973-10-15 CA CA183,425A patent/CA989076A/en not_active Expired
- 1973-10-15 NL NL7314156.A patent/NL158026B/xx not_active IP Right Cessation
- 1973-10-16 DE DE2351943A patent/DE2351943B2/de not_active Ceased
- 1973-10-16 GB GB4821873A patent/GB1418969A/en not_active Expired
- 1973-10-16 US US05/406,927 patent/US3945347A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FR2203175B1 (cg-RX-API-DMAC7.html) | 1977-09-23 |
| GB1418969A (en) | 1975-12-24 |
| JPS4960870A (cg-RX-API-DMAC7.html) | 1974-06-13 |
| FR2203175A1 (cg-RX-API-DMAC7.html) | 1974-05-10 |
| NL158026B (nl) | 1978-09-15 |
| DE2351943A1 (de) | 1974-05-02 |
| US3945347A (en) | 1976-03-23 |
| CA989076A (en) | 1976-05-11 |
| DE2351943B2 (de) | 1980-08-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| V1 | Lapsed because of non-payment of the annual fee | ||
| NL80 | Information provided on patent owner name for an already discontinued patent |
Owner name: MATSUS ELEC |