NL7213480A - - Google Patents

Info

Publication number
NL7213480A
NL7213480A NL7213480A NL7213480A NL7213480A NL 7213480 A NL7213480 A NL 7213480A NL 7213480 A NL7213480 A NL 7213480A NL 7213480 A NL7213480 A NL 7213480A NL 7213480 A NL7213480 A NL 7213480A
Authority
NL
Netherlands
Application number
NL7213480A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7213480A publication Critical patent/NL7213480A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
NL7213480A 1971-10-12 1972-10-05 NL7213480A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18824371A 1971-10-12 1971-10-12

Publications (1)

Publication Number Publication Date
NL7213480A true NL7213480A (ja) 1973-04-16

Family

ID=22692340

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7213480A NL7213480A (ja) 1971-10-12 1972-10-05

Country Status (5)

Country Link
US (1) US3770464A (ja)
JP (1) JPS536934B2 (ja)
CA (1) CA966256A (ja)
GB (1) GB1411429A (ja)
NL (1) NL7213480A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating
JPS5561204U (ja) * 1978-10-24 1980-04-25
JPS588931A (ja) * 1981-06-23 1983-01-19 ボツシユシ−メンス・ハウスゲレ−テ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 組込式電気調理器
JPS61243181A (ja) * 1985-04-19 1986-10-29 Hitachi Ltd 化学銅めつき装置
US5106413A (en) * 1990-02-01 1992-04-21 Hitachi, Ltd. Measurement method, adjustment method and adjustment system for the concentrations of ingredients in electroless plating solution
US20100059385A1 (en) * 2008-09-06 2010-03-11 Delin Li Methods for fabricating thin film solar cells
JP6047714B2 (ja) * 2012-08-08 2016-12-21 石原ケミカル株式会社 無電解スズ系メッキ液用のペースト状スズ補給剤及び補給方法
US20160040291A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with micro-bubble injector
WO2018073886A1 (ja) 2016-10-18 2018-04-26 本田技研工業株式会社 車両制御装置
CN114452892A (zh) * 2021-12-27 2022-05-10 西安泰金工业电化学技术有限公司 一种气液混合自吸装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819188A (en) * 1954-05-18 1958-01-07 Gen Am Transport Processes of chemical nickel plating
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3532519A (en) * 1967-11-28 1970-10-06 Matsushita Electric Ind Co Ltd Electroless copper plating process
US3595684A (en) * 1968-06-27 1971-07-27 Enthone Electroless copper plating
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating

Also Published As

Publication number Publication date
JPS4846527A (ja) 1973-07-03
DE2250034B2 (de) 1977-06-08
GB1411429A (en) 1975-10-22
US3770464A (en) 1973-11-06
CA966256A (en) 1975-04-22
DE2250034A1 (de) 1973-04-19
JPS536934B2 (ja) 1978-03-13

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