CA966256A - Dry replenishment of electroless copper solutions - Google Patents

Dry replenishment of electroless copper solutions

Info

Publication number
CA966256A
CA966256A CA153,675A CA153675A CA966256A CA 966256 A CA966256 A CA 966256A CA 153675 A CA153675 A CA 153675A CA 966256 A CA966256 A CA 966256A
Authority
CA
Canada
Prior art keywords
replenishment
dry
electroless copper
copper solutions
solutions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA153,675A
Other languages
English (en)
Inventor
Oleh B. Dutkewych
Lebert A. Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of CA966256A publication Critical patent/CA966256A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
CA153,675A 1971-10-12 1972-10-11 Dry replenishment of electroless copper solutions Expired CA966256A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18824371A 1971-10-12 1971-10-12

Publications (1)

Publication Number Publication Date
CA966256A true CA966256A (en) 1975-04-22

Family

ID=22692340

Family Applications (1)

Application Number Title Priority Date Filing Date
CA153,675A Expired CA966256A (en) 1971-10-12 1972-10-11 Dry replenishment of electroless copper solutions

Country Status (5)

Country Link
US (1) US3770464A (ja)
JP (1) JPS536934B2 (ja)
CA (1) CA966256A (ja)
GB (1) GB1411429A (ja)
NL (1) NL7213480A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating
JPS5561204U (ja) * 1978-10-24 1980-04-25
JPS588931A (ja) * 1981-06-23 1983-01-19 ボツシユシ−メンス・ハウスゲレ−テ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 組込式電気調理器
JPS61243181A (ja) * 1985-04-19 1986-10-29 Hitachi Ltd 化学銅めつき装置
US5106413A (en) * 1990-02-01 1992-04-21 Hitachi, Ltd. Measurement method, adjustment method and adjustment system for the concentrations of ingredients in electroless plating solution
US20100059385A1 (en) * 2008-09-06 2010-03-11 Delin Li Methods for fabricating thin film solar cells
JP6047714B2 (ja) * 2012-08-08 2016-12-21 石原ケミカル株式会社 無電解スズ系メッキ液用のペースト状スズ補給剤及び補給方法
US20160040291A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with micro-bubble injector
WO2018073886A1 (ja) 2016-10-18 2018-04-26 本田技研工業株式会社 車両制御装置
CN114452892A (zh) * 2021-12-27 2022-05-10 西安泰金工业电化学技术有限公司 一种气液混合自吸装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819188A (en) * 1954-05-18 1958-01-07 Gen Am Transport Processes of chemical nickel plating
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3532519A (en) * 1967-11-28 1970-10-06 Matsushita Electric Ind Co Ltd Electroless copper plating process
US3595684A (en) * 1968-06-27 1971-07-27 Enthone Electroless copper plating
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating

Also Published As

Publication number Publication date
JPS4846527A (ja) 1973-07-03
DE2250034B2 (de) 1977-06-08
GB1411429A (en) 1975-10-22
US3770464A (en) 1973-11-06
DE2250034A1 (de) 1973-04-19
NL7213480A (ja) 1973-04-16
JPS536934B2 (ja) 1978-03-13

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