NL7213464A - - Google Patents

Info

Publication number
NL7213464A
NL7213464A NL7213464A NL7213464A NL7213464A NL 7213464 A NL7213464 A NL 7213464A NL 7213464 A NL7213464 A NL 7213464A NL 7213464 A NL7213464 A NL 7213464A NL 7213464 A NL7213464 A NL 7213464A
Authority
NL
Netherlands
Application number
NL7213464A
Other versions
NL171176B (nl
NL171176C (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NLAANVRAGE7213464,A priority Critical patent/NL171176C/xx
Priority to DE2346616A priority patent/DE2346616C3/de
Priority to US00400880A priority patent/US3843373A/en
Priority to AT840773A priority patent/AT321052B/de
Priority to IT69892/73A priority patent/IT996763B/it
Priority to CH1407373A priority patent/CH591565A5/xx
Priority to SE7313397A priority patent/SE390631B/xx
Priority to GB4593673A priority patent/GB1400120A/en
Priority to JP11023573A priority patent/JPS5435584B2/ja
Priority to CA182,389A priority patent/CA990006A/en
Priority to FR7335326A priority patent/FR2202168B1/fr
Priority to BE136320A priority patent/BE805636A/xx
Publication of NL7213464A publication Critical patent/NL7213464A/xx
Publication of NL171176B publication Critical patent/NL171176B/xx
Application granted granted Critical
Publication of NL171176C publication Critical patent/NL171176C/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
NLAANVRAGE7213464,A 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper. NL171176C (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.
DE2346616A DE2346616C3 (de) 1972-10-05 1973-09-15 Bad zum stromlosen Abscheiden von duktilem Kupfer
US00400880A US3843373A (en) 1972-10-05 1973-09-26 Bath for the electroless deposition of ductile copper
IT69892/73A IT996763B (it) 1972-10-05 1973-10-02 Bagno per la deposizione di rame duttile senza impiego dell elettri cita
CH1407373A CH591565A5 (https=) 1972-10-05 1973-10-02
SE7313397A SE390631B (sv) 1972-10-05 1973-10-02 Alkaliskt vattenhaltigt kopparbeleggningsbad
AT840773A AT321052B (de) 1972-10-05 1973-10-02 Alkalisches wässeriges Bad zum stromlosen Abscheiden von duktilem Kupfer
GB4593673A GB1400120A (en) 1972-10-05 1973-10-02 Electroless deposition of copper
JP11023573A JPS5435584B2 (https=) 1972-10-05 1973-10-02
CA182,389A CA990006A (en) 1972-10-05 1973-10-02 Bath for the electroless deposition of ductile copper
FR7335326A FR2202168B1 (https=) 1972-10-05 1973-10-03
BE136320A BE805636A (fr) 1972-10-05 1973-10-03 Bain pour le depot sans courant de cuivre flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Publications (3)

Publication Number Publication Date
NL7213464A true NL7213464A (https=) 1974-04-09
NL171176B NL171176B (nl) 1982-09-16
NL171176C NL171176C (nl) 1983-02-16

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Country Status (12)

Country Link
US (1) US3843373A (https=)
JP (1) JPS5435584B2 (https=)
AT (1) AT321052B (https=)
BE (1) BE805636A (https=)
CA (1) CA990006A (https=)
CH (1) CH591565A5 (https=)
DE (1) DE2346616C3 (https=)
FR (1) FR2202168B1 (https=)
GB (1) GB1400120A (https=)
IT (1) IT996763B (https=)
NL (1) NL171176C (https=)
SE (1) SE390631B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
NL171176B (nl) 1982-09-16
DE2346616C3 (de) 1978-07-13
SE390631B (sv) 1977-01-03
NL171176C (nl) 1983-02-16
FR2202168A1 (https=) 1974-05-03
JPS5435584B2 (https=) 1979-11-02
US3843373A (en) 1974-10-22
CH591565A5 (https=) 1977-09-30
AT321052B (de) 1975-03-10
IT996763B (it) 1975-12-10
JPS4973338A (https=) 1974-07-16
BE805636A (fr) 1974-04-03
GB1400120A (en) 1975-07-16
FR2202168B1 (https=) 1976-10-01
DE2346616B2 (de) 1977-11-24
CA990006A (en) 1976-06-01
DE2346616A1 (de) 1974-04-11

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee