NL7117429A - - Google Patents

Info

Publication number
NL7117429A
NL7117429A NL7117429A NL7117429A NL7117429A NL 7117429 A NL7117429 A NL 7117429A NL 7117429 A NL7117429 A NL 7117429A NL 7117429 A NL7117429 A NL 7117429A NL 7117429 A NL7117429 A NL 7117429A
Authority
NL
Netherlands
Application number
NL7117429A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7117429A priority Critical patent/NL7117429A/xx
Priority to US00312847A priority patent/US3853613A/en
Priority to CA158,768A priority patent/CA964384A/en
Priority to FR7244508A priority patent/FR2163609A1/fr
Priority to GB5801272A priority patent/GB1372459A/en
Priority to JP47125342A priority patent/JPS5125225B2/ja
Priority to IT70942/72A priority patent/IT976061B/it
Priority to DE19722261672 priority patent/DE2261672A1/de
Publication of NL7117429A publication Critical patent/NL7117429A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H10P95/00—
    • H10W20/40—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL7117429A 1971-12-18 1971-12-18 NL7117429A (cg-RX-API-DMAC10.html)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL7117429A NL7117429A (cg-RX-API-DMAC10.html) 1971-12-18 1971-12-18
US00312847A US3853613A (en) 1971-12-18 1972-12-07 Method of manufacturing an article and article manufactured by means of the method
CA158,768A CA964384A (en) 1971-12-18 1972-12-13 Processing platinum patterns
FR7244508A FR2163609A1 (cg-RX-API-DMAC10.html) 1971-12-18 1972-12-14
GB5801272A GB1372459A (en) 1971-12-18 1972-12-15 Method of producing metal patterns
JP47125342A JPS5125225B2 (cg-RX-API-DMAC10.html) 1971-12-18 1972-12-15
IT70942/72A IT976061B (it) 1971-12-18 1972-12-15 Procedimento per la fabbricazione di articoli comprendenti un traccia to di platino particolarmente di dispositivi semiconduttori
DE19722261672 DE2261672A1 (de) 1971-12-18 1972-12-16 Verfahren zur herstellung eines gegenstandes und durch dieses verfahren hergestellter gegenstand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7117429A NL7117429A (cg-RX-API-DMAC10.html) 1971-12-18 1971-12-18

Publications (1)

Publication Number Publication Date
NL7117429A true NL7117429A (cg-RX-API-DMAC10.html) 1973-06-20

Family

ID=19814730

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7117429A NL7117429A (cg-RX-API-DMAC10.html) 1971-12-18 1971-12-18

Country Status (8)

Country Link
US (1) US3853613A (cg-RX-API-DMAC10.html)
JP (1) JPS5125225B2 (cg-RX-API-DMAC10.html)
CA (1) CA964384A (cg-RX-API-DMAC10.html)
DE (1) DE2261672A1 (cg-RX-API-DMAC10.html)
FR (1) FR2163609A1 (cg-RX-API-DMAC10.html)
GB (1) GB1372459A (cg-RX-API-DMAC10.html)
IT (1) IT976061B (cg-RX-API-DMAC10.html)
NL (1) NL7117429A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52153137U (cg-RX-API-DMAC10.html) * 1976-05-17 1977-11-19
JPS53157435U (cg-RX-API-DMAC10.html) * 1977-05-17 1978-12-09
JPS5950212B2 (ja) * 1978-07-28 1984-12-07 富士電機株式会社 半導体素子の電極の製造方法
JPS5679450A (en) * 1979-11-30 1981-06-30 Mitsubishi Electric Corp Electrode and wiring of semiconductor device
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate
US11011381B2 (en) * 2018-07-27 2021-05-18 Texas Instruments Incorporated Patterning platinum by alloying and etching platinum alloy

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686080A (en) * 1971-07-21 1972-08-22 Rca Corp Method of fabrication of semiconductor devices

Also Published As

Publication number Publication date
IT976061B (it) 1974-08-20
DE2261672A1 (de) 1973-06-20
JPS4868437A (cg-RX-API-DMAC10.html) 1973-09-18
GB1372459A (en) 1974-10-30
US3853613A (en) 1974-12-10
CA964384A (en) 1975-03-11
JPS5125225B2 (cg-RX-API-DMAC10.html) 1976-07-29
FR2163609A1 (cg-RX-API-DMAC10.html) 1973-07-27

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