JPS5125225B2 - - Google Patents
Info
- Publication number
- JPS5125225B2 JPS5125225B2 JP47125342A JP12534272A JPS5125225B2 JP S5125225 B2 JPS5125225 B2 JP S5125225B2 JP 47125342 A JP47125342 A JP 47125342A JP 12534272 A JP12534272 A JP 12534272A JP S5125225 B2 JPS5125225 B2 JP S5125225B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H10P95/00—
-
- H10W20/40—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7117429A NL7117429A (cg-RX-API-DMAC10.html) | 1971-12-18 | 1971-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4868437A JPS4868437A (cg-RX-API-DMAC10.html) | 1973-09-18 |
| JPS5125225B2 true JPS5125225B2 (cg-RX-API-DMAC10.html) | 1976-07-29 |
Family
ID=19814730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47125342A Expired JPS5125225B2 (cg-RX-API-DMAC10.html) | 1971-12-18 | 1972-12-15 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3853613A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5125225B2 (cg-RX-API-DMAC10.html) |
| CA (1) | CA964384A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2261672A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2163609A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1372459A (cg-RX-API-DMAC10.html) |
| IT (1) | IT976061B (cg-RX-API-DMAC10.html) |
| NL (1) | NL7117429A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153137U (cg-RX-API-DMAC10.html) * | 1976-05-17 | 1977-11-19 | ||
| JPS53157435U (cg-RX-API-DMAC10.html) * | 1977-05-17 | 1978-12-09 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950212B2 (ja) * | 1978-07-28 | 1984-12-07 | 富士電機株式会社 | 半導体素子の電極の製造方法 |
| JPS5679450A (en) * | 1979-11-30 | 1981-06-30 | Mitsubishi Electric Corp | Electrode and wiring of semiconductor device |
| US4442137A (en) * | 1982-03-18 | 1984-04-10 | International Business Machines Corporation | Maskless coating of metallurgical features of a dielectric substrate |
| US11011381B2 (en) * | 2018-07-27 | 2021-05-18 | Texas Instruments Incorporated | Patterning platinum by alloying and etching platinum alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3686080A (en) * | 1971-07-21 | 1972-08-22 | Rca Corp | Method of fabrication of semiconductor devices |
-
1971
- 1971-12-18 NL NL7117429A patent/NL7117429A/xx unknown
-
1972
- 1972-12-07 US US00312847A patent/US3853613A/en not_active Expired - Lifetime
- 1972-12-13 CA CA158,768A patent/CA964384A/en not_active Expired
- 1972-12-14 FR FR7244508A patent/FR2163609A1/fr not_active Withdrawn
- 1972-12-15 GB GB5801272A patent/GB1372459A/en not_active Expired
- 1972-12-15 JP JP47125342A patent/JPS5125225B2/ja not_active Expired
- 1972-12-15 IT IT70942/72A patent/IT976061B/it active
- 1972-12-16 DE DE19722261672 patent/DE2261672A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153137U (cg-RX-API-DMAC10.html) * | 1976-05-17 | 1977-11-19 | ||
| JPS53157435U (cg-RX-API-DMAC10.html) * | 1977-05-17 | 1978-12-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT976061B (it) | 1974-08-20 |
| NL7117429A (cg-RX-API-DMAC10.html) | 1973-06-20 |
| DE2261672A1 (de) | 1973-06-20 |
| JPS4868437A (cg-RX-API-DMAC10.html) | 1973-09-18 |
| GB1372459A (en) | 1974-10-30 |
| US3853613A (en) | 1974-12-10 |
| CA964384A (en) | 1975-03-11 |
| FR2163609A1 (cg-RX-API-DMAC10.html) | 1973-07-27 |