NL6910274A - - Google Patents

Info

Publication number
NL6910274A
NL6910274A NL6910274A NL6910274A NL6910274A NL 6910274 A NL6910274 A NL 6910274A NL 6910274 A NL6910274 A NL 6910274A NL 6910274 A NL6910274 A NL 6910274A NL 6910274 A NL6910274 A NL 6910274A
Authority
NL
Netherlands
Application number
NL6910274A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6910274A priority Critical patent/NL6910274A/xx
Priority to DE2031333A priority patent/DE2031333C3/de
Priority to CH997670A priority patent/CH512144A/de
Priority to AT590870A priority patent/AT322633B/de
Priority to SE09130/70A priority patent/SE368114B/xx
Priority to US51575A priority patent/US3640807A/en
Priority to BE752897D priority patent/BE752897A/fr
Priority to ES381370A priority patent/ES381370A1/es
Priority to GB3226170A priority patent/GB1316830A/en
Priority to JP45057817A priority patent/JPS501985B1/ja
Priority to FR707024780A priority patent/FR2050507B1/fr
Publication of NL6910274A publication Critical patent/NL6910274A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/135—Removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Element Separation (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
NL6910274A 1969-07-04 1969-07-04 NL6910274A (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL6910274A NL6910274A (fr) 1969-07-04 1969-07-04
DE2031333A DE2031333C3 (de) 1969-07-04 1970-06-24 Verfahren zum Herstellen eines Halbleiterbauelementes
CH997670A CH512144A (de) 1969-07-04 1970-07-01 Verfahren zur Herstellung einer Halbleiteranordnung
AT590870A AT322633B (de) 1969-07-04 1970-07-01 Verfahren zur herstellung einer halbleiteranordnung
SE09130/70A SE368114B (fr) 1969-07-04 1970-07-01
US51575A US3640807A (en) 1969-07-04 1970-07-01 Method of manufacturing a semiconductor device and semiconductor device manufactured by said method
BE752897D BE752897A (fr) 1969-07-04 1970-07-02 Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur ainsi obtenu
ES381370A ES381370A1 (es) 1969-07-04 1970-07-02 Un metodo de fabricar un dispositivo semiconductor.
GB3226170A GB1316830A (en) 1969-07-04 1970-07-02 Methods of manufacturing semiconductor devices
JP45057817A JPS501985B1 (fr) 1969-07-04 1970-07-03
FR707024780A FR2050507B1 (fr) 1969-07-04 1970-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6910274A NL6910274A (fr) 1969-07-04 1969-07-04

Publications (1)

Publication Number Publication Date
NL6910274A true NL6910274A (fr) 1971-01-06

Family

ID=19807388

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6910274A NL6910274A (fr) 1969-07-04 1969-07-04

Country Status (11)

Country Link
US (1) US3640807A (fr)
JP (1) JPS501985B1 (fr)
AT (1) AT322633B (fr)
BE (1) BE752897A (fr)
CH (1) CH512144A (fr)
DE (1) DE2031333C3 (fr)
ES (1) ES381370A1 (fr)
FR (1) FR2050507B1 (fr)
GB (1) GB1316830A (fr)
NL (1) NL6910274A (fr)
SE (1) SE368114B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902979A (en) * 1974-06-24 1975-09-02 Westinghouse Electric Corp Insulator substrate with a thin mono-crystalline semiconductive layer and method of fabrication
US3962052A (en) * 1975-04-14 1976-06-08 International Business Machines Corporation Process for forming apertures in silicon bodies
US4054497A (en) * 1975-10-06 1977-10-18 Honeywell Inc. Method for electrolytically etching semiconductor material
US4033787A (en) * 1975-10-06 1977-07-05 Honeywell Inc. Fabrication of semiconductor devices utilizing ion implantation
JPS6047725B2 (ja) * 1977-06-14 1985-10-23 ソニー株式会社 フエライトの加工法
US4141621A (en) * 1977-08-05 1979-02-27 Honeywell Inc. Three layer waveguide for thin film lens fabrication
US4257061A (en) * 1977-10-17 1981-03-17 John Fluke Mfg. Co., Inc. Thermally isolated monolithic semiconductor die
NO843614L (no) * 1983-09-13 1986-06-23 Marconi Co Ltd Infra-roed detektor
US4554059A (en) * 1983-11-04 1985-11-19 Harris Corporation Electrochemical dielectric isolation technique
JPS6415913A (en) * 1987-07-09 1989-01-19 Mitsubishi Monsanto Chem Epitaxial growth method of substrate for high-brightness led
DE3889830D1 (de) * 1987-09-30 1994-07-07 Siemens Ag Verfahren zum Ätzen von (100) Silizium.
US4995953A (en) * 1989-10-30 1991-02-26 Motorola, Inc. Method of forming a semiconductor membrane using an electrochemical etch-stop
JP3151816B2 (ja) * 1990-08-06 2001-04-03 日産自動車株式会社 エッチング方法
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6500694B1 (en) * 2000-03-22 2002-12-31 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6563133B1 (en) * 2000-08-09 2003-05-13 Ziptronix, Inc. Method of epitaxial-like wafer bonding at low temperature and bonded structure
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
CN111895679B (zh) * 2020-09-10 2022-04-01 江西北冰洋实业有限公司 一种半导体制冷片安装机构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6703014A (fr) * 1967-02-25 1968-08-26
NL6706735A (fr) * 1967-05-13 1968-11-14

Also Published As

Publication number Publication date
CH512144A (de) 1971-08-31
DE2031333B2 (de) 1977-11-17
ES381370A1 (es) 1972-12-01
BE752897A (fr) 1971-01-04
GB1316830A (en) 1973-05-16
FR2050507B1 (fr) 1974-06-14
AT322633B (de) 1975-05-26
JPS501985B1 (fr) 1975-01-22
DE2031333A1 (de) 1971-01-21
SE368114B (fr) 1974-06-17
DE2031333C3 (de) 1978-07-13
FR2050507A1 (fr) 1971-04-02
US3640807A (en) 1972-02-08

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