NL6901301A - - Google Patents
Info
- Publication number
- NL6901301A NL6901301A NL6901301A NL6901301A NL6901301A NL 6901301 A NL6901301 A NL 6901301A NL 6901301 A NL6901301 A NL 6901301A NL 6901301 A NL6901301 A NL 6901301A NL 6901301 A NL6901301 A NL 6901301A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968005484U JPS5026292Y1 (oth) | 1968-01-29 | 1968-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL6901301A true NL6901301A (oth) | 1969-07-31 |
| NL146330B NL146330B (nl) | 1975-06-16 |
Family
ID=11612505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL696901301A NL146330B (nl) | 1968-01-29 | 1969-01-27 | Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3581166A (oth) |
| JP (1) | JPS5026292Y1 (oth) |
| DE (1) | DE1904118B2 (oth) |
| FR (1) | FR2000900B1 (oth) |
| GB (1) | GB1191093A (oth) |
| NL (1) | NL146330B (oth) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675090A (en) * | 1968-11-04 | 1972-07-04 | Energy Conversion Devices Inc | Film deposited semiconductor devices |
| US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
| IN148328B (oth) * | 1977-04-18 | 1981-01-17 | Rca Corp | |
| DE2809883A1 (de) * | 1977-10-14 | 1979-04-19 | Plessey Inc | Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen |
| US4246697A (en) | 1978-04-06 | 1981-01-27 | Motorola, Inc. | Method of manufacturing RF power semiconductor package |
| JPS59125644A (ja) * | 1982-12-29 | 1984-07-20 | Fujitsu Ltd | 半導体装置 |
| KR960000706B1 (ko) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | 전력소자용 플라스틱 패키지 구조 및 그 제조방법 |
| JPH0799368A (ja) * | 1993-09-29 | 1995-04-11 | Mitsubishi Electric Corp | 光半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3271635A (en) * | 1963-05-06 | 1966-09-06 | Rca Corp | Semiconductor devices with silver-gold lead wires attached to aluminum contacts |
| DE1514273B2 (de) * | 1964-08-21 | 1974-08-22 | Nippon Electric Co., Ltd., Tokio | Halbleiteranordmng |
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1968
- 1968-01-29 JP JP1968005484U patent/JPS5026292Y1/ja not_active Expired
-
1969
- 1969-01-22 US US792992*A patent/US3581166A/en not_active Expired - Lifetime
- 1969-01-27 NL NL696901301A patent/NL146330B/xx unknown
- 1969-01-27 GB GB4479/69A patent/GB1191093A/en not_active Expired
- 1969-01-28 DE DE19691904118 patent/DE1904118B2/de active Pending
- 1969-01-28 FR FR696901677A patent/FR2000900B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1191093A (en) | 1970-05-06 |
| US3581166A (en) | 1971-05-25 |
| DE1904118B2 (de) | 1972-06-22 |
| DE1904118A1 (de) | 1969-08-28 |
| FR2000900B1 (oth) | 1973-05-25 |
| NL146330B (nl) | 1975-06-16 |
| JPS5026292Y1 (oth) | 1975-08-06 |
| FR2000900A1 (oth) | 1969-09-19 |