NL146330B - Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders. - Google Patents

Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders.

Info

Publication number
NL146330B
NL146330B NL696901301A NL6901301A NL146330B NL 146330 B NL146330 B NL 146330B NL 696901301 A NL696901301 A NL 696901301A NL 6901301 A NL6901301 A NL 6901301A NL 146330 B NL146330 B NL 146330B
Authority
NL
Netherlands
Prior art keywords
connectors
semi
metal plate
insulating body
device applied
Prior art date
Application number
NL696901301A
Other languages
English (en)
Dutch (nl)
Other versions
NL6901301A (oth
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of NL6901301A publication Critical patent/NL6901301A/xx
Publication of NL146330B publication Critical patent/NL146330B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
NL696901301A 1968-01-29 1969-01-27 Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders. NL146330B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1968005484U JPS5026292Y1 (oth) 1968-01-29 1968-01-29

Publications (2)

Publication Number Publication Date
NL6901301A NL6901301A (oth) 1969-07-31
NL146330B true NL146330B (nl) 1975-06-16

Family

ID=11612505

Family Applications (1)

Application Number Title Priority Date Filing Date
NL696901301A NL146330B (nl) 1968-01-29 1969-01-27 Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders.

Country Status (6)

Country Link
US (1) US3581166A (oth)
JP (1) JPS5026292Y1 (oth)
DE (1) DE1904118B2 (oth)
FR (1) FR2000900B1 (oth)
GB (1) GB1191093A (oth)
NL (1) NL146330B (oth)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675090A (en) * 1968-11-04 1972-07-04 Energy Conversion Devices Inc Film deposited semiconductor devices
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
IN148328B (oth) * 1977-04-18 1981-01-17 Rca Corp
DE2809883A1 (de) * 1977-10-14 1979-04-19 Plessey Inc Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen
US4246697A (en) 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS59125644A (ja) * 1982-12-29 1984-07-20 Fujitsu Ltd 半導体装置
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271635A (en) * 1963-05-06 1966-09-06 Rca Corp Semiconductor devices with silver-gold lead wires attached to aluminum contacts
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng

Also Published As

Publication number Publication date
GB1191093A (en) 1970-05-06
US3581166A (en) 1971-05-25
DE1904118B2 (de) 1972-06-22
NL6901301A (oth) 1969-07-31
DE1904118A1 (de) 1969-08-28
FR2000900B1 (oth) 1973-05-25
JPS5026292Y1 (oth) 1975-08-06
FR2000900A1 (oth) 1969-09-19

Similar Documents

Publication Publication Date Title
NL164757C (nl) Contactinrichting, voorzien van een verdeelplaat, waar- door buizen met verschillende lengte steken.
ES198136Y (es) Un dispositivo conectador electrico.
NL157145B (nl) Werkwijze voor het vervaardigen van een isolerend dragerlichaam, dat elektrisch en mechanisch is verbonden met ten minste een, een ketenelement bevattend plaatje, en isolerend dragerlichaam met ten minste een, een ketenelement bevattend plaatje, vervaardigd volgens deze werkwijze.
NL164684C (nl) Elektromagnetische instelinrichting.
NL166824C (nl) Elektrische verbindingsinrichting.
ES195039Y (es) Un conectador electrico.
NL146330B (nl) Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders.
ES197259Y (es) Aparato de conexion electromagnetico.
ES196133Y (es) Un dispositivo conectador electrico.
ES208792Y (es) Aparato de microondas perfeccionado.
ES162733Y (es) Un dispositivo de conectador electrico.
ES197749Y (es) Conjunto de cableado electrico.
NL151815B (nl) Gatenponsinrichting.
FI44639C (fi) Eletroninen laitteisto.
ES203625Y (es) Un dispositivo terminal de clavija electrica.
NL145463B (nl) Reactie-inrichting.
ES196549Y (es) Un dispositivo conectador electrico.
ES198009Y (es) Un terminal de cable perfeccionado.
ES185870Y (es) Un dispositivo de terminal electrico.
ES133383Y (es) Un dispositivo conectador electrico.
ES140584Y (es) Dispositivo de engrapado metalico.
ES160933Y (es) Dispositivo conector electrico.
ES118287Y (es) Un conductor con base auto-adherente.
ES139669Y (es) Un dispositivo de conectador electrico.
ES114557Y (es) Un dispositivo de ensamble.