NL6809575A - - Google Patents
Info
- Publication number
- NL6809575A NL6809575A NL6809575A NL6809575A NL6809575A NL 6809575 A NL6809575 A NL 6809575A NL 6809575 A NL6809575 A NL 6809575A NL 6809575 A NL6809575 A NL 6809575A NL 6809575 A NL6809575 A NL 6809575A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0111507 | 1967-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6809575A true NL6809575A (xx) | 1969-02-26 |
Family
ID=7530983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6809575A NL6809575A (xx) | 1967-08-24 | 1968-07-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3564109A (xx) |
| DE (1) | DE1614587B2 (xx) |
| FR (1) | FR1576342A (xx) |
| GB (1) | GB1175780A (xx) |
| NL (1) | NL6809575A (xx) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1815989A1 (de) * | 1968-12-20 | 1970-07-02 | Semikron Gleichrichterbau | Halbleiter-Anordnung |
| US3849187A (en) * | 1970-03-08 | 1974-11-19 | Dexter Corp | Encapsulant compositions for semiconductors |
| US3878555A (en) * | 1970-05-14 | 1975-04-15 | Siemens Ag | Semiconductor device mounted on an epoxy substrate |
| US3738422A (en) * | 1971-05-04 | 1973-06-12 | Allen Bradley Co | Heat dissipating insulating mounting |
| US3735209A (en) * | 1972-02-10 | 1973-05-22 | Motorola Inc | Semiconductor device package with energy absorbing layer |
| US3751724A (en) * | 1972-04-28 | 1973-08-07 | C Mcgrath | Encapsulated electrical component |
| US3771091A (en) * | 1972-10-31 | 1973-11-06 | Gen Electric | Potted metal oxide varistor |
| US3846824A (en) * | 1973-06-13 | 1974-11-05 | Gen Electric | Improved thermally conductive and electrically insulative mounting systems for heat sinks |
| US4001655A (en) * | 1974-01-10 | 1977-01-04 | P. R. Mallory & Co., Inc. | Compressible intermediate layer for encapsulated electrical devices |
| DE2426229C3 (de) * | 1974-05-29 | 1979-10-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Selbsttragender Träger für die Aufnahme von elektronischen Bauelementen |
| DE3433779A1 (de) * | 1984-09-14 | 1986-03-27 | Robert Bosch Gmbh, 7000 Stuttgart | Schutzschicht fuer halbleiterschaltungen |
| JPH0521655A (ja) * | 1990-11-28 | 1993-01-29 | Mitsubishi Electric Corp | 半導体装置および半導体装置用パツケージ |
| US5254500A (en) * | 1991-02-05 | 1993-10-19 | Advanced Micro Devices, Inc. | Method for making an integrally molded semiconductor device heat sink |
| US5199165A (en) * | 1991-12-13 | 1993-04-06 | Hewlett-Packard Company | Heat pipe-electrical interconnect integration method for chip modules |
| US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
| US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
| DE9319259U1 (de) * | 1993-12-15 | 1994-03-24 | Siemens Ag | Kühlkörper |
| US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
| US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
| AU3330695A (en) * | 1994-08-22 | 1996-03-14 | Iowa State University Research Foundation Inc. | Heat sink |
| US6680015B2 (en) * | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
| US20030139510A1 (en) * | 2001-11-13 | 2003-07-24 | Sagal E. Mikhail | Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom |
| US7236368B2 (en) * | 2005-01-26 | 2007-06-26 | Power-One, Inc. | Integral molded heat sinks on DC-DC converters and power supplies |
| JP5236772B2 (ja) * | 2011-04-18 | 2013-07-17 | 株式会社ソニー・コンピュータエンタテインメント | ヒートシンク及びヒートシンクを備える電子機器 |
| DE102015120110A1 (de) * | 2015-11-19 | 2017-05-24 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul mit Kühlkörper |
| DE102016208380A1 (de) * | 2016-05-17 | 2017-05-11 | Conti Temic Microelectronic Gmbh | Gehäuselose Leistungselektronikanordnung, insbesondere gehäuseloser Wechselrichter |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2758261A (en) * | 1952-06-02 | 1956-08-07 | Rca Corp | Protection of semiconductor devices |
| US2850687A (en) * | 1953-10-13 | 1958-09-02 | Rca Corp | Semiconductor devices |
| US2763822A (en) * | 1955-05-10 | 1956-09-18 | Westinghouse Electric Corp | Silicon semiconductor devices |
| US3264248A (en) * | 1959-12-03 | 1966-08-02 | Gen Electric | Encapsulating compositions containing an epoxy resin, metaxylylene diamine, and tris-beta chlorethyl phosphate, and encapsulated modules |
| US3035419A (en) * | 1961-01-23 | 1962-05-22 | Westinghouse Electric Corp | Cooling device |
| DE1439460A1 (de) * | 1964-10-19 | 1968-12-12 | Siemens Ag | Elektrisches Bauelement,insbesondere Halbleiterbauelement,mit einer aus isolierendemStoff bestehenden Huelle |
| US3317796A (en) * | 1964-10-27 | 1967-05-02 | Gen Electric | Cooling arrangement for electrical apparatus |
-
1967
- 1967-08-24 DE DE19671614587 patent/DE1614587B2/de not_active Withdrawn
-
1968
- 1968-07-05 NL NL6809575A patent/NL6809575A/xx unknown
- 1968-08-19 FR FR1576342D patent/FR1576342A/fr not_active Expired
- 1968-08-20 US US754085A patent/US3564109A/en not_active Expired - Lifetime
- 1968-08-23 GB GB40406/68A patent/GB1175780A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1614587B2 (de) | 1976-05-13 |
| DE1614587A1 (de) | 1970-10-29 |
| GB1175780A (en) | 1969-12-23 |
| FR1576342A (xx) | 1969-07-25 |
| US3564109A (en) | 1971-02-16 |