NL6801149A - - Google Patents

Info

Publication number
NL6801149A
NL6801149A NL6801149A NL6801149A NL6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A NL 6801149 A NL6801149 A NL 6801149A
Authority
NL
Netherlands
Prior art keywords
plates
carrier
columns
plane
suction
Prior art date
Application number
NL6801149A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6801149A publication Critical patent/NL6801149A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

1,170,897. Abrading. SIEMENS A.G. 1 March, 1968 [3 March, 1967], No. 10004/68. Heading B3D. A process for lapping and/or polishing a plurality of plate-shaped semi-conductor crystals comprises sticking the plates 5 to a carrier 6 in such a way that their flat surfaces to be worked are all in a single plane, bringing and holding the plates in contact with the surface of a lapping and/or polishing tool in such a way that at and from the moment of first contact the working surface of the tool coincides with the plane of the surface of the plates to be worked, and moving the carrier relative to the operating surface of the tool. For mounting the plates on the carrier, a ring 1 is provided having a number of columns 2, the upper surfaces of which are in a common plane and each of which have a ring of suction holes or a single annular suction gap whereby the plates can be held one to each column with the surfaces to be lapped engaging the upper surfaces of the columns, the plates being initially positioned by being placed in recesses 5 in a template 4, the recesses corresponding to the columns. When the plates are held by suction on the columns, adhesive, such as beeswax, is placed on the upper surfaces of the plates and the carrier 6, which has been heated, engaged with the plates. Upon cooling of the carrier, the suction is switched off so that the carrier now holds the plates with the surfaces to be lapped in a common plane. The carrier plate is then applied to the lapping or polishing tool so that at the first moment of contact, the working surface coincides with the plane of the surfaces to be worked.
NL6801149A 1967-03-03 1968-01-25 NL6801149A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0108629 1967-03-03

Publications (1)

Publication Number Publication Date
NL6801149A true NL6801149A (en) 1968-09-04

Family

ID=7528929

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6801149A NL6801149A (en) 1967-03-03 1968-01-25

Country Status (5)

Country Link
US (1) US3562965A (en)
DE (1) DE1652170B2 (en)
FR (1) FR1564761A (en)
GB (1) GB1170897A (en)
NL (1) NL6801149A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
DE2712521A1 (en) * 1977-03-22 1978-09-28 Wacker Chemitronic PROCEDURE FOR FITTING DISCS
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JP2648638B2 (en) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 Wafer bonding method and apparatus
US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
US8124455B2 (en) * 2005-04-02 2012-02-28 Stats Chippac Ltd. Wafer strength reinforcement system for ultra thin wafer thinning
WO2009003008A1 (en) * 2007-06-25 2008-12-31 Saint-Gobain Ceramics & Plastics, Inc. Methods of crystallographically reorienting single crystal bodies
CN110370165B (en) * 2019-07-22 2021-07-13 吉林大学 Wear-resistant planetary grinding disc

Also Published As

Publication number Publication date
FR1564761A (en) 1969-04-25
DE1652170A1 (en) 1971-02-25
DE1652170B2 (en) 1975-05-22
GB1170897A (en) 1969-11-19
US3562965A (en) 1971-02-16

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