CH416359A - Device for beveling the edge of semiconductor bodies by lapping - Google Patents

Device for beveling the edge of semiconductor bodies by lapping

Info

Publication number
CH416359A
CH416359A CH1135664A CH1135664A CH416359A CH 416359 A CH416359 A CH 416359A CH 1135664 A CH1135664 A CH 1135664A CH 1135664 A CH1135664 A CH 1135664A CH 416359 A CH416359 A CH 416359A
Authority
CH
Switzerland
Prior art keywords
beveling
lapping
edge
semiconductor bodies
bodies
Prior art date
Application number
CH1135664A
Other languages
German (de)
Inventor
Emeis Reimer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH416359A publication Critical patent/CH416359A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
CH1135664A 1963-11-13 1964-08-31 Device for beveling the edge of semiconductor bodies by lapping CH416359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0088260 1963-11-13

Publications (1)

Publication Number Publication Date
CH416359A true CH416359A (en) 1966-06-30

Family

ID=7514326

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1135664A CH416359A (en) 1963-11-13 1964-08-31 Device for beveling the edge of semiconductor bodies by lapping

Country Status (3)

Country Link
CH (1) CH416359A (en)
GB (1) GB1062759A (en)
NL (1) NL6410192A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354586A2 (en) * 1988-08-12 1990-02-14 Shin-Etsu Handotai Company Limited Method of automatically chamfering a wafer and apparatus therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354586A2 (en) * 1988-08-12 1990-02-14 Shin-Etsu Handotai Company Limited Method of automatically chamfering a wafer and apparatus therefor
EP0354586A3 (en) * 1988-08-12 1991-11-27 Shin-Etsu Handotai Company Limited Method of automatically chamfering a wafer and apparatus therefor

Also Published As

Publication number Publication date
NL6410192A (en) 1965-05-14
GB1062759A (en) 1967-03-22

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