Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
  • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
  • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Semiconductor Integrated Circuits (AREA)
• Bipolar Integrated Circuits (AREA)
• Bipolar Transistors (AREA)
• Apparatuses And Processes For Manufacturing Resistors (AREA)

Priority Applications (12)

Applications Claiming Priority (2)

Publications (1)

Family

ID=26414019

Family Applications (2)

Family Applications After (1)

Country Status (8)

Families Citing this family (9)

Family Cites Families (4)

• 1967
  • 1967-05-12 NL NL6706641A patent/NL6706641A/xx unknown
  • 1967-11-06 NL NL6715032A patent/NL6715032A/xx unknown
• 1968
  • 1968-04-29 DE DE1764237A patent/DE1764237C3/de not_active Expired
  • 1968-05-08 US US727562A patent/US3562607A/en not_active Expired - Lifetime
  • 1968-05-09 CH CH690368A patent/CH474157A/de not_active IP Right Cessation
  • 1968-05-09 GB GB1228916D patent/GB1228916A/en not_active Expired
  • 1968-05-09 AT AT446168A patent/AT320736B/de not_active IP Right Cessation
  • 1968-05-09 FR FR1561857D patent/FR1561857A/fr not_active Expired
  • 1968-05-10 BE BE715021D patent/BE715021A/xx unknown

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