NL6413575A - - Google Patents

Info

Publication number
NL6413575A
NL6413575A NL6413575A NL6413575A NL6413575A NL 6413575 A NL6413575 A NL 6413575A NL 6413575 A NL6413575 A NL 6413575A NL 6413575 A NL6413575 A NL 6413575A NL 6413575 A NL6413575 A NL 6413575A
Authority
NL
Netherlands
Prior art keywords
rectifier
bead
wires
extend
lead wires
Prior art date
Application number
NL6413575A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6413575A publication Critical patent/NL6413575A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electrodes Of Semiconductors (AREA)
NL6413575A 1959-04-15 1964-11-20 NL6413575A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB12744/59A GB870599A (en) 1959-04-15 1959-04-15 Improvements in or relating to semi-conductor crystal rectifiers and methods of manufacture thereof
GB46212/63A GB1031890A (en) 1959-04-15 1963-11-22 Crystal rectifiers and mountings therefor

Publications (1)

Publication Number Publication Date
NL6413575A true NL6413575A (ja) 1966-05-25

Family

ID=62527907

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6413575A NL6413575A (ja) 1959-04-15 1964-11-20

Country Status (3)

Country Link
BE (2) BE656096A (ja)
GB (2) GB870599A (ja)
NL (1) NL6413575A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE635453A (ja) * 1962-07-27 1900-01-01
DE2727178A1 (de) * 1977-06-16 1979-01-04 Bosch Gmbh Robert Gleichrichteranordnung
FR2536211B1 (fr) * 1982-11-16 1986-02-07 Thomson Csf Structure de diode hyperfrequences dont les connexions exterieures sont prises par deux poutres metalliques
US4599636A (en) * 1984-03-08 1986-07-08 General Semiconductor Industries, Inc. Two terminal axial lead suppressor and diode bridge device

Also Published As

Publication number Publication date
BE589773A (ja) 1900-01-01
BE656096A (ja) 1965-05-24
GB870599A (en) 1961-06-14
GB1031890A (en) 1966-06-02

Similar Documents

Publication Publication Date Title
GB876133A (en) Improvements in or relating to high power semiconductor rectifiers
GB952108A (en) Improved encapsulated diode assembly
GB991940A (en) Manufacture of semiconductor devices
NL6413575A (ja)
GB1137619A (en) Semiconductor devices
JPS55166945A (en) Lead frame
JPS5366369A (en) Semiconductor device
GB819656A (en) Improvements in or relating to crystal diodes
FR1435345A (fr) élément électrique, en particulier un redresseur à semi-conducteur, portant une masse d'enrobage ou de remplissage et rendu ainsi étanche par rapport à son environnement
NL6413572A (ja)
GB1020172A (en) Improvements in or relating to peltier devices
FR1407971A (fr) Pince d'assemblage
JPS5599754A (en) Lead frame
CH387809A (de) Lötverbindung an einem Halbleiterelement
CA681497A (en) Hermetically sealed thermoelectric generator and lead assembly
JPS5350678A (en) Semiconductor device
JPS5612761A (en) Semiconductor device
AU269343B2 (en) Carrier and package assembly
CA595666A (en) Semiconductor rectifier assembly
AU409138B2 (en) The mounting and encapsulation of semiconductor devices
JPS5778162A (en) Semiconductor recrifier reduction rectifying noise
AU270087B2 (en) Semiconductor assembly
GB907269A (en) Diode
CA670501A (en) Thermo-compression bonding of metal to semiconductors and the like
GB879390A (en) Improvements in or relating to semi-conductor devices