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              NL294370A
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          1963-06-20 | 
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              DE1224147B
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          1963-08-23 | 
          1966-09-01 | 
          Kalle Ag | 
          Verfahren zur Umkehrentwicklung von Diazo-verbindungen enthaltenden Kopierschichten 
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              GB1052699A
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            *
            
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          1963-12-03 | 
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              CA774047A
              (en)
            
            *
            
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          1963-12-09 | 
          1967-12-19 | 
          Shipley Company | 
          Light-sensitive material and process for the development thereof 
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              DE1471701A1
              (de)
            
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          1964-03-06 | 
          1969-02-20 | 
          Basf Ag | 
          Verfahren zum Herstellen von Druckformen 
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              GB1053866A
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          1964-08-05 | 
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              GB1143611A
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            *
            
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          1965-03-22 | 
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              GB1113759A
              (en)
            
            *
            
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          1965-12-17 | 
          1968-05-15 | 
          Fuji Photo Film Co Ltd | 
          Lithographic printing plates 
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              NL136645C
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          1966-12-12 | 
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              US3647443A
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          1969-09-12 | 
          1972-03-07 | 
          Eastman Kodak Co | 
          Light-sensitive quinone diazide polymers and polymer compositions 
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              US3666473A
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          1970-10-06 | 
          1972-05-30 | 
          Ibm | 
          Positive photoresists for projection exposure 
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              US4052217A
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          1971-11-09 | 
          1977-10-04 | 
          Howson-Algraphy Limited | 
          Bimetallic lithographic printing plates 
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              US3865595A
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          1972-11-09 | 
          1975-02-11 | 
          Howson Algraphy Ltd | 
          Lithographic printing plates 
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          1971-12-08 | 
          1983-04-12 | 
          Energy Conversion Devices, Inc. | 
          Imaging structure with tellurium metal film and energy sensitive material thereon 
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          1972-02-09 | 
          1973-12-18 | 
          Minnesota Mining & Mfg | 
          Photosolubilizable compositions and elements 
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          1972-10-17 | 
          1975-08-18 | 
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              US4012536A
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          1972-12-14 | 
          1977-03-15 | 
          Rca Corporation | 
          Electron beam recording medium comprising 1-methylvinyl methyl ketone 
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          1972-12-14 | 
          1977-04-19 | 
          Rca Corporation | 
          Electron beam recording comprising polymer of 1-methylvinyl methyl ketone 
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          1973-01-30 | 
          1973-11-13 | 
          Ibm | 
          Method of producing multicolor planographic printing surface 
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              US3950173A
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          1973-02-12 | 
          1976-04-13 | 
          Rca Corporation | 
          Electron beam recording article with o-quinone diazide compound 
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          1973-03-16 | 
          1977-07-19 | 
          International Business Machines Corporation | 
          Photoresist process and photosensitive O-quinone diazide article with aliphatic carboxylic acid as adhesion promotor 
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          1974-02-25 | 
          1981-10-24 | 
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          1974-03-05 | 
          1976-09-28 | 
          Ibm Corporation | 
          Lift-off method of fabricating thin films and a structure utilizable as a lift-off mask 
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          1974-03-19 | 
          1979-09-25 | 
          Fuji Photo Film Co., Ltd. | 
          Light-sensitive printing plate with matt overlayer 
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          1974-03-19 | 
          1975-10-03 | 
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              US4259430A
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          1974-05-01 | 
          1981-03-31 | 
          International Business Machines Corporation | 
          Photoresist O-quinone diazide containing composition and resist mask formation process 
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          1974-06-06 | 
          1977-02-08 | 
          International Business Machines Corporation | 
          Modified processing of positive photoresists 
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          1974-08-26 | 
          1976-05-25 | 
          American Hoechst Corporation | 
          Photosensitive diazo steel lithoplate structure 
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          1974-10-04 | 
          1976-09-07 | 
          Printing Developments, Inc. | 
          Laminated lithographic printing plate 
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          1974-10-09 | 
          1980-03-04 | 
          Fuji Photo Film Co., Ltd. | 
          Photosensitive positive image forming process with two photo-sensitive layers 
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          1975-04-29 | 
          1980-02-19 | 
          American Hoechst Corporation | 
          Light-sensitive o-quinone diazide compositions and photographic reproduction processes and structures 
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          1975-05-24 | 
          1979-11-13 | 
          Tokyo Ohka Kogyo Kabushiki Kaisha | 
          Positive-type O-quinone diazide containing photoresist compositions 
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          1976-03-19 | 
          1978-11-14 | 
          Mona Industries, Inc. | 
          Laminated plates for chemical milling 
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          1976-06-30 | 
          1977-08-09 | 
          Ibm Corporation | 
          Etching process utilizing the same positive photoresist layer for two etching steps 
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              US4211834A
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          1977-12-30 | 
          1980-07-08 | 
          International Business Machines Corporation | 
          Method of using a o-quinone diazide sensitized phenol-formaldehyde resist as a deep ultraviolet light exposure mask 
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          1978-02-15 | 
          1979-09-14 | 
          Rhone Poulenc Graphic | 
          Nouveau support de plaques lithographiques et procede de mise en oeuvre 
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          1978-11-02 | 
          1980-05-10 | 
          Konishiroku Photo Ind Co Ltd | 
          Photosensitive composition 
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          1979-12-03 | 
          1981-08-18 | 
          International Business Machines Corporation | 
          Lithographic resist composition for a lift-off process 
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          1980-07-28 | 
          1982-06-01 | 
          Bell Telephone Laboratories, Incorporated | 
          Resist adhesion in integrated circuit processing 
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          1981-01-07 | 
          1984-02-14 | 
          Ovchinnikov Jury M | 
          Offset printing plate and process for making same 
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          1981-10-02 | 
          1983-04-07 | 
          Kimoto & Co Ltd | 
          製版用感光性マスク材料 
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          1982-04-20 | 
          1985-02-12 | 
          Japan Synthetic Rubber Co., Ltd. | 
          Positive type photosensitive resin composition with at least two o-quinone diazides 
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          1982-06-03 | 
          1983-12-08 | 
          Merck Patent Gmbh, 6100 Darmstadt | 
          Lichtempfindliche komponenten fuer positiv arbeitende fotoresistmaterialien 
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          1983-06-29 | 
          1985-01-10 | 
          Hoechst Ag, 6230 Frankfurt | 
          Lichtempfindliches gemisch und daraus hergestelltes kopiermaterial 
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          1983-09-08 | 
          1985-04-03 | 
          Sumitomo Chem Co Ltd | 
          ポジ型フォトレジスト組成物 
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          1984-03-16 | 
          1986-01-28 | 
          International Business Machines Corporation | 
          Multi-level resist image reversal lithography process 
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          1985-02-28 | 
          1986-05-13 | 
          American Hoechst Corporation | 
          Light-sensitive trisester of O-quinone diazide containing composition for the preparation of a positive-acting photoresist 
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          1986-03-27 | 
          1988-04-12 | 
          East Shore Chemical Co. | 
          Light sensitive diazo compound, composition and method of making the composition 
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          1986-12-23 | 
          1992-07-07 | 
          Shipley Company Inc. | 
          Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate 
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          1987-03-12 | 
          1993-01-26 | 
          Mitsubishi Kasei Corporation | 
          Positive photosensitive planographic printing plates containing specific high-molecular weight compound and photosensitive ester of O-napthoquinonediazidosulfonic acid with polyhydroxybenzophenone 
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          1987-08-12 | 
          1989-03-07 | 
          General Electric Co. | 
          Photolithography over reflective substrates comprising a titanium nitride layer 
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          1987-11-06 | 
          1995-12-20 | 
          関西ペイント株式会社 | 
          ポジ型感光性カチオン電着塗料組成物 
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          1988-03-31 | 
          1991-02-26 | 
          Morton International, Inc. | 
          Method of forming resist pattern and thermally stable and highly resolved resist pattern 
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          1988-04-19 | 
          1993-03-10 | 
          International Business Machines Corporation | 
          Verfahren zur Herstellung von integrierten Halbleiterstrukturen welche Feldeffekttransistoren mit Kanallängen im Submikrometerbereich enthalten 
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          1988-08-05 | 
          1990-07-24 | 
          Morton Thiokol, Inc. | 
          High sensitivity mid and deep UV resist 
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          1988-10-28 | 
          1990-09-25 | 
          J. T. Baker, Inc. | 
          Deep UV photoresist with alkyl 2-diazo-1-ones as solubility modification agents 
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          1988-11-17 | 
          1994-03-02 | 
          International Business Machines Corporation | 
          Verfahren zur Herstellung von Masken mit Strukturen im Submikrometerbereich 
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          1991-08-30 | 
          1994-03-22 | 
          Ciba-Geigy Corp. | 
          Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive 
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          1997-01-23 | 
          2007-10-23 | 
          Sequenom, Inc. | 
          Systems and methods for preparing and analyzing low volume analyte array elements 
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          2012-06-20 | 
          Sequenom, Inc. | 
          Method for delivery of submicroliter volumes onto a substrate 
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          2007-09-17 | 
          2009-07-16 | 
          Sequenom, Inc. | 
          Integrated robotic sample transfer device 
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