NL2002016A1 - Exposure apparatus and method for photolithography process. - Google Patents

Exposure apparatus and method for photolithography process.

Info

Publication number
NL2002016A1
NL2002016A1 NL2002016A NL2002016A NL2002016A1 NL 2002016 A1 NL2002016 A1 NL 2002016A1 NL 2002016 A NL2002016 A NL 2002016A NL 2002016 A NL2002016 A NL 2002016A NL 2002016 A1 NL2002016 A1 NL 2002016A1
Authority
NL
Netherlands
Prior art keywords
exposure apparatus
photolithography process
photolithography
exposure
Prior art date
Application number
NL2002016A
Other languages
English (en)
Other versions
NL2002016C2 (en
Inventor
Vincent Yu
Hsien-Cheng Wang
Hung-Chang Hsieh
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of NL2002016A1 publication Critical patent/NL2002016A1/nl
Application granted granted Critical
Publication of NL2002016C2 publication Critical patent/NL2002016C2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
NL2002016A 2007-10-19 2008-09-25 Exposure apparatus and method for photolithography process. NL2002016C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87547107 2007-10-19
US11/875,471 US8098364B2 (en) 2007-10-19 2007-10-19 Exposure apparatus and method for photolithography process

Publications (2)

Publication Number Publication Date
NL2002016A1 true NL2002016A1 (nl) 2009-04-21
NL2002016C2 NL2002016C2 (en) 2011-03-01

Family

ID=40563170

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2002016A NL2002016C2 (en) 2007-10-19 2008-09-25 Exposure apparatus and method for photolithography process.

Country Status (3)

Country Link
US (2) US8098364B2 (nl)
CN (1) CN101414131B (nl)
NL (1) NL2002016C2 (nl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793247B2 (en) * 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9335006B2 (en) * 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US8098364B2 (en) * 2007-10-19 2012-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure apparatus and method for photolithography process
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
WO2016061098A1 (en) * 2014-10-14 2016-04-21 Covaris, Inc. Acoustic energy mediation of genetic fragmentation
US10274830B2 (en) 2016-01-27 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for dynamic lithographic exposure
DE102017100340B4 (de) 2016-01-27 2021-04-29 Taiwan Semiconductor Manufacturing Co., Ltd. Verfahren zum Entwickeln eines lichtempfindlichen Materials und Fotolithografiewerkzeug
SG11201908444RA (en) * 2017-03-15 2019-10-30 Callaghan Innovation Apparatus for and method of manufacturing an article using photolithography and a photoresist
US10775706B2 (en) * 2018-09-27 2020-09-15 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography apparatus and method using the same
DE102020201097B4 (de) * 2020-01-30 2023-02-16 Carl Zeiss Industrielle Messtechnik Gmbh Anordnung und Verfahren zur optischen Objektkoordinatenermittlung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474463A (en) * 1982-08-30 1984-10-02 Tre Semiconductor Equipment Corporation Mixer coupling lens subassembly for photolithographic system
JPH0740090B2 (ja) * 1986-12-26 1995-05-01 キヤノン株式会社 可変焦点光学素子
KR100358422B1 (ko) * 1993-09-14 2003-01-24 가부시키가이샤 니콘 플래인위치결정장치,주사형노광장치,주사노광방법및소자제조방법
JP3162909B2 (ja) * 1994-04-14 2001-05-08 株式会社リコー 光ビーム走査装置
US6387597B1 (en) * 1998-06-05 2002-05-14 Creo Srl Method for exposing features on non-planar resists
US6304316B1 (en) * 1998-10-22 2001-10-16 Anvik Corporation Microlithography system for high-resolution large-area patterning on curved surfaces
JP4429447B2 (ja) * 2000-01-12 2010-03-10 浜松ホトニクス株式会社 ストリーク装置
JP2002050562A (ja) * 2000-08-03 2002-02-15 Mitsubishi Electric Corp 半導体製造装置、半導体装置の製造方法、及び半導体装置
JP4089177B2 (ja) * 2000-10-25 2008-05-28 株式会社日立製作所 光ディスク装置及び層間ジャンプ方法
CN100555086C (zh) * 2003-01-14 2009-10-28 Asml荷兰有限公司 用于光刻装置的水平传感器
EP1482373A1 (en) * 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005092175A (ja) * 2003-08-08 2005-04-07 Olympus Corp 光学特性可変光学素子
US7567340B2 (en) * 2006-09-29 2009-07-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8098364B2 (en) * 2007-10-19 2012-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure apparatus and method for photolithography process

Also Published As

Publication number Publication date
NL2002016C2 (en) 2011-03-01
US20090103068A1 (en) 2009-04-23
CN101414131A (zh) 2009-04-22
CN101414131B (zh) 2013-01-02
US20120082940A1 (en) 2012-04-05
US8098364B2 (en) 2012-01-17

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