NL188774B - Werkwijze voor het vervaardigen van een samengestelde halfgeleiderinrichting. - Google Patents

Werkwijze voor het vervaardigen van een samengestelde halfgeleiderinrichting.

Info

Publication number
NL188774B
NL188774B NLAANVRAGE8004861,A NL8004861A NL188774B NL 188774 B NL188774 B NL 188774B NL 8004861 A NL8004861 A NL 8004861A NL 188774 B NL188774 B NL 188774B
Authority
NL
Netherlands
Prior art keywords
manufacturing
semiconductor device
composite semiconductor
composite
semiconductor
Prior art date
Application number
NLAANVRAGE8004861,A
Other languages
English (en)
Other versions
NL8004861A (nl
NL188774C (nl
Original Assignee
Nippon Telegraph & Telephone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11787379A external-priority patent/JPS5642352A/ja
Priority claimed from JP55026177A external-priority patent/JPS5833702B2/ja
Priority claimed from JP4855580A external-priority patent/JPS56144552A/ja
Application filed by Nippon Telegraph & Telephone filed Critical Nippon Telegraph & Telephone
Publication of NL8004861A publication Critical patent/NL8004861A/nl
Publication of NL188774B publication Critical patent/NL188774B/nl
Application granted granted Critical
Publication of NL188774C publication Critical patent/NL188774C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8222—Bipolar technology
    • H01L21/8228—Complementary devices, e.g. complementary transistors
    • H01L21/82285—Complementary vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0817—Thyristors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
    • H01L27/0826—Combination of vertical complementary transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Element Separation (AREA)
NLAANVRAGE8004861,A 1979-09-17 1980-08-28 Werkwijze voor het vervaardigen van een samengestelde halfgeleiderinrichting. NL188774C (nl)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP11787379 1979-09-17
JP11787379A JPS5642352A (en) 1979-09-17 1979-09-17 Manufacture of composite semiconductor device
JP55026177A JPS5833702B2 (ja) 1980-03-04 1980-03-04 半導体基体の製法
JP2617780 1980-03-04
JP4855580 1980-04-14
JP4855580A JPS56144552A (en) 1980-04-14 1980-04-14 Semiconductor substrate

Publications (3)

Publication Number Publication Date
NL8004861A NL8004861A (nl) 1981-03-19
NL188774B true NL188774B (nl) 1992-04-16
NL188774C NL188774C (nl) 1992-09-16

Family

ID=27285291

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8004861,A NL188774C (nl) 1979-09-17 1980-08-28 Werkwijze voor het vervaardigen van een samengestelde halfgeleiderinrichting.

Country Status (6)

Country Link
US (1) US4393573A (nl)
CA (1) CA1154174A (nl)
DE (1) DE3034894A1 (nl)
FR (1) FR2465316A1 (nl)
GB (1) GB2060252B (nl)
NL (1) NL188774C (nl)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210634A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 半導体装置の製造方法
US4560422A (en) * 1982-12-06 1985-12-24 Harris Corporation Method for forming integrated circuits bearing polysilicon of reduced resistance
US4571818A (en) * 1983-09-29 1986-02-25 At&T Bell Laboratories Isolation process for high-voltage semiconductor devices
JPS6081839A (ja) * 1983-10-12 1985-05-09 Fujitsu Ltd 半導体装置の製造方法
US4609413A (en) * 1983-11-18 1986-09-02 Motorola, Inc. Method for manufacturing and epitaxially isolated semiconductor utilizing etch and refill technique
US4566176A (en) * 1984-05-23 1986-01-28 U.S. Philips Corporation Method of manufacturing transistors
US4860081A (en) * 1984-06-28 1989-08-22 Gte Laboratories Incorporated Semiconductor integrated circuit structure with insulative partitions
US4570330A (en) * 1984-06-28 1986-02-18 Gte Laboratories Incorporated Method of producing isolated regions for an integrated circuit substrate
JPH0618234B2 (ja) * 1985-04-19 1994-03-09 日本電信電話株式会社 半導体基板の接合方法
JPS6251247A (ja) * 1985-08-30 1987-03-05 Toshiba Corp 半導体装置及びその製造方法
US4804866A (en) * 1986-03-24 1989-02-14 Matsushita Electric Works, Ltd. Solid state relay
US5270569A (en) * 1990-01-24 1993-12-14 Harris Corporation Method and device in which bottoming of a well in a dielectrically isolated island is assured
JP3174786B2 (ja) * 1991-05-31 2001-06-11 富士通株式会社 半導体装置の製造方法
US6117351A (en) * 1998-04-06 2000-09-12 Micron Technology, Inc. Method for etching dielectric films
TW512526B (en) * 2000-09-07 2002-12-01 Sanyo Electric Co Semiconductor integrated circuit device and manufacturing method thereof
JP2002083876A (ja) * 2000-09-07 2002-03-22 Sanyo Electric Co Ltd 半導体集積回路装置の製造方法
KR100854077B1 (ko) * 2002-05-28 2008-08-25 페어차일드코리아반도체 주식회사 웨이퍼 본딩을 이용한 ｓｏｉ 기판 제조 방법과 이 ｓｏｉ기판을 사용한 상보형 고전압 바이폴라 트랜지스터 제조방법
US20070042563A1 (en) * 2005-08-19 2007-02-22 Honeywell International Inc. Single crystal based through the wafer connections technical field

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189973A (en) * 1961-11-27 1965-06-22 Bell Telephone Labor Inc Method of fabricating a semiconductor device
US3312879A (en) * 1964-07-29 1967-04-04 North American Aviation Inc Semiconductor structure including opposite conductivity segments
US3850707A (en) * 1964-09-09 1974-11-26 Honeywell Inc Semiconductors
US3461003A (en) * 1964-12-14 1969-08-12 Motorola Inc Method of fabricating a semiconductor structure with an electrically isolated region of semiconductor material
CH439499A (fr) * 1965-04-07 1967-07-15 Centre Electron Horloger Résistance semiconductrice et procédé pour sa fabrication
US3507713A (en) * 1966-07-13 1970-04-21 United Aircraft Corp Monolithic circuit chip containing noncompatible oxide-isolated regions
US3509433A (en) * 1967-05-01 1970-04-28 Fairchild Camera Instr Co Contacts for buried layer in a dielectrically isolated semiconductor pocket
US3508980A (en) * 1967-07-26 1970-04-28 Motorola Inc Method of fabricating an integrated circuit structure with dielectric isolation
NL7017085A (nl) * 1969-11-26 1971-05-28
US3818583A (en) * 1970-07-08 1974-06-25 Signetics Corp Method for fabricating semiconductor structure having complementary devices
GB1300710A (en) * 1970-12-10 1972-12-20 Signetics Corp Complementary transistor structure and method
JPS5120267B2 (nl) * 1972-05-13 1976-06-23
US3938176A (en) * 1973-09-24 1976-02-10 Texas Instruments Incorporated Process for fabricating dielectrically isolated semiconductor components of an integrated circuit
NL7408110A (nl) * 1974-06-18 1975-12-22 Philips Nv Halfgeleiderinrichting met complementaire tran- sistorstrukturen en werkwijze ter vervaardiging daarvan.
US4283235A (en) * 1979-07-27 1981-08-11 Massachusetts Institute Of Technology Dielectric isolation using shallow oxide and polycrystalline silicon utilizing selective oxidation

Also Published As

Publication number Publication date
FR2465316A1 (fr) 1981-03-20
US4393573A (en) 1983-07-19
DE3034894C2 (nl) 1988-06-23
GB2060252B (en) 1984-02-22
NL8004861A (nl) 1981-03-19
CA1154174A (en) 1983-09-20
NL188774C (nl) 1992-09-16
DE3034894A1 (de) 1981-03-26
FR2465316B1 (nl) 1983-03-25
GB2060252A (en) 1981-04-29

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Legal Events

Date Code Title Description
A1A A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
CNR Transfer of rights (patent application after its laying open for public inspection)

Free format text: NIPPON TELEGRAPH AND TELEPHONE CORPORATION

BC A request for examination has been filed
V4 Discontinued because of reaching the maximum lifetime of a patent

Free format text: 20000828