NL183594C - Werkwijze voor het bereiden van een vulstof met katalytische werking voor het stroomloos neerslaan van metaal alsmede werkwijze voor het vervaardigen van een elektrisch isolerend voorwerp dat een aldus bereide vulstof bevat. - Google Patents
Werkwijze voor het bereiden van een vulstof met katalytische werking voor het stroomloos neerslaan van metaal alsmede werkwijze voor het vervaardigen van een elektrisch isolerend voorwerp dat een aldus bereide vulstof bevat.Info
- Publication number
- NL183594C NL183594C NLAANVRAGE7603624,A NL7603624A NL183594C NL 183594 C NL183594 C NL 183594C NL 7603624 A NL7603624 A NL 7603624A NL 183594 C NL183594 C NL 183594C
- Authority
- NL
- Netherlands
- Prior art keywords
- filler
- streamless
- preparing
- manufacturing
- electrically insulating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/251—Mica
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/566,611 US4287253A (en) | 1975-04-08 | 1975-04-08 | Catalytic filler for electroless metallization of hole walls |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7603624A NL7603624A (nl) | 1976-10-12 |
NL183594B NL183594B (nl) | 1988-07-01 |
NL183594C true NL183594C (nl) | 1988-12-01 |
Family
ID=24263612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7603624,A NL183594C (nl) | 1975-04-08 | 1976-04-07 | Werkwijze voor het bereiden van een vulstof met katalytische werking voor het stroomloos neerslaan van metaal alsmede werkwijze voor het vervaardigen van een elektrisch isolerend voorwerp dat een aldus bereide vulstof bevat. |
Country Status (13)
Country | Link |
---|---|
US (1) | US4287253A (fr) |
JP (1) | JPS51123729A (fr) |
AT (1) | AT340738B (fr) |
AU (1) | AU500576B2 (fr) |
CA (1) | CA1067879A (fr) |
CH (1) | CH616454A5 (fr) |
DE (1) | DE2613637C3 (fr) |
FR (1) | FR2307050A1 (fr) |
GB (1) | GB1508518A (fr) |
IT (1) | IT1059409B (fr) |
NL (1) | NL183594C (fr) |
SE (1) | SE7603946L (fr) |
ZA (1) | ZA7645B (fr) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450188A (en) * | 1980-04-18 | 1984-05-22 | Shinroku Kawasumi | Process for the preparation of precious metal-coated particles |
JPS57500568A (fr) * | 1980-05-12 | 1982-04-01 | ||
DK148327C (da) * | 1981-07-24 | 1985-11-04 | Neselco As | Pulver til brug ved toer sensibilisering for stroemloes metallisering |
DE3130159A1 (de) * | 1981-07-30 | 1983-02-17 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | "verfahren zur herstellung von leiterplatten" |
DK153572C (da) * | 1982-02-18 | 1988-12-19 | Platonec Aps | Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf |
DE3404270A1 (de) * | 1984-02-04 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen |
DE3407468A1 (de) * | 1984-02-29 | 1985-08-29 | Siemens AG, 1000 Berlin und 8000 München | Kunststoffe mit magnetischer abschirmwirkung |
US5100714A (en) * | 1986-07-24 | 1992-03-31 | Ceramic Packaging, Inc. | Metallized ceramic substrate and method therefor |
US4859571A (en) * | 1986-12-30 | 1989-08-22 | E. I. Du Pont De Nemours And Company | Embedded catalyst receptors for metallization of dielectrics |
US4737446A (en) * | 1986-12-30 | 1988-04-12 | E. I. Du Pont De Nemours And Company | Method for making multilayer circuits using embedded catalyst receptors |
US4872844A (en) * | 1988-07-08 | 1989-10-10 | Amp Incorporated | Component-carrying adapter for chip carrier socket |
US4871319A (en) * | 1988-12-21 | 1989-10-03 | Amp Incorporated | Molded circuit board for ribbon cable connector |
US5002493A (en) * | 1989-09-19 | 1991-03-26 | Amp Incorporated | Panel mounted electronic assembly |
US5013248A (en) * | 1989-09-19 | 1991-05-07 | Amp Incorporated | Multicircuit connector assembly |
JPH0363295U (fr) * | 1989-10-18 | 1991-06-20 | ||
US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
EP0460548A3 (en) * | 1990-06-08 | 1993-03-24 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for etal deposition |
JPH0760821B2 (ja) * | 1991-05-17 | 1995-06-28 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ポリマー基材の状態調整方法 |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
US6517939B1 (en) | 1999-09-03 | 2003-02-11 | Engelhard Corporation | Noble metal coated substrate pigments |
FR2846205B1 (fr) * | 2002-10-29 | 2005-03-11 | Oreal | Dispositif de conditionnement et d'application comportant un corps contenant des particules |
KR20080031360A (ko) * | 2005-07-04 | 2008-04-08 | 쉬드-케미아크티엔게젤샤프트 | 높은 고체 함량을 가지는 층상 규산염 슬러리 |
US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
US10573610B2 (en) * | 2014-05-19 | 2020-02-25 | Catlam, Llc | Method for wafer level packaging |
US9398703B2 (en) * | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
US9631279B2 (en) * | 2014-05-19 | 2017-04-25 | Sierra Circuits, Inc. | Methods for forming embedded traces |
US20160278206A1 (en) * | 2014-05-19 | 2016-09-22 | Sierra Circuits, Inc. | Printed circuit board |
US9706667B2 (en) | 2014-05-19 | 2017-07-11 | Sierra Circuits, Inc. | Via in a printed circuit board |
US9380700B2 (en) | 2014-05-19 | 2016-06-28 | Sierra Circuits, Inc. | Method for forming traces of a printed circuit board |
TWI686115B (zh) * | 2014-06-05 | 2020-02-21 | 美商凱特聯有限責任公司 | 嵌入跡線 |
US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
US9706650B1 (en) * | 2016-08-18 | 2017-07-11 | Sierra Circuits, Inc. | Catalytic laminate apparatus and method |
US9922951B1 (en) | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
WO2018089798A1 (fr) * | 2016-11-12 | 2018-05-17 | Sierra Circuits, Inc. | Intégration de tranche à circuit intégré à un adhésif ou un stratifié catalytique |
US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2690402A (en) * | 1952-04-01 | 1954-09-28 | Gen Am Transport | Processes of chemical nickel plating of nonmetallic bodies |
IT567854A (fr) * | 1956-04-11 | |||
US3171756A (en) * | 1961-05-04 | 1965-03-02 | Ibm | Method of making a printed circuit and base therefor |
US3318711A (en) * | 1964-04-02 | 1967-05-09 | Sel Rex Corp | Immersion plating process for the deposition of copper |
US3399268A (en) * | 1966-06-07 | 1968-08-27 | Photocircuits Corp | Chemical metallization and products produced thereby |
US3600330A (en) * | 1967-01-03 | 1971-08-17 | Photocircuits Division Of Koli | Metallization of insulating substrates |
DE1615961A1 (de) * | 1967-04-12 | 1970-06-25 | Degussa | Verfahren zur Herstellung von gedruckten Schaltungen |
US3628999A (en) * | 1970-03-05 | 1971-12-21 | Frederick W Schneble Jr | Plated through hole printed circuit boards |
US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
DE2111136A1 (de) * | 1971-03-09 | 1972-09-28 | Kalle Ag | Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material |
US3928663A (en) * | 1974-04-01 | 1975-12-23 | Amp Inc | Modified hectorite for electroless plating |
-
1975
- 1975-04-08 US US05/566,611 patent/US4287253A/en not_active Expired - Lifetime
-
1976
- 1976-01-05 ZA ZA00760045A patent/ZA7645B/xx unknown
- 1976-01-16 CA CA243,679A patent/CA1067879A/fr not_active Expired
- 1976-02-03 AU AU10775/76A patent/AU500576B2/en not_active Expired
- 1976-03-26 DE DE762613637A patent/DE2613637C3/de not_active Expired
- 1976-03-29 CH CH388576A patent/CH616454A5/de not_active IP Right Cessation
- 1976-03-31 AT AT232776A patent/AT340738B/de not_active IP Right Cessation
- 1976-04-02 SE SE7603946A patent/SE7603946L/xx unknown
- 1976-04-05 GB GB13652/76A patent/GB1508518A/en not_active Expired
- 1976-04-05 JP JP51038686A patent/JPS51123729A/ja active Granted
- 1976-04-07 NL NLAANVRAGE7603624,A patent/NL183594C/xx not_active IP Right Cessation
- 1976-04-08 IT IT48924/76A patent/IT1059409B/it active
- 1976-04-08 FR FR7610257A patent/FR2307050A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2307050A1 (fr) | 1976-11-05 |
AU500576B2 (en) | 1979-05-24 |
DE2613637B2 (de) | 1978-07-20 |
ZA7645B (en) | 1976-12-29 |
JPS5734344B2 (fr) | 1982-07-22 |
GB1508518A (en) | 1978-04-26 |
IT1059409B (it) | 1982-05-31 |
NL7603624A (nl) | 1976-10-12 |
FR2307050B1 (fr) | 1979-10-05 |
DE2613637A1 (de) | 1976-10-14 |
AT340738B (de) | 1977-12-27 |
NL183594B (nl) | 1988-07-01 |
AU1077576A (en) | 1977-08-11 |
CH616454A5 (fr) | 1980-03-31 |
US4287253A (en) | 1981-09-01 |
SE7603946L (sv) | 1976-10-09 |
JPS51123729A (en) | 1976-10-28 |
DE2613637C3 (de) | 1979-03-08 |
ATA232776A (de) | 1977-04-15 |
CA1067879A (fr) | 1979-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
SNR | Assignments of patents or rights arising from examined patent applications |
Owner name: AMP-AKZO CORPORATION |
|
V1 | Lapsed because of non-payment of the annual fee |