NL178462C - Halfgeleiderinrichting, omvattende een halfgeleiderlichaam met ten minste een kruising tussen twee van elkaar geisoleerde elektrische verbindingen. - Google Patents

Halfgeleiderinrichting, omvattende een halfgeleiderlichaam met ten minste een kruising tussen twee van elkaar geisoleerde elektrische verbindingen.

Info

Publication number
NL178462C
NL178462C NLAANVRAGE7415030,A NL7415030A NL178462C NL 178462 C NL178462 C NL 178462C NL 7415030 A NL7415030 A NL 7415030A NL 178462 C NL178462 C NL 178462C
Authority
NL
Netherlands
Prior art keywords
cross
electrical connections
semiconductor device
semiconductor
semiconductor body
Prior art date
Application number
NLAANVRAGE7415030,A
Other languages
English (en)
Other versions
NL178462B (nl
NL7415030A (nl
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of NL7415030A publication Critical patent/NL7415030A/nl
Publication of NL178462B publication Critical patent/NL178462B/nl
Application granted granted Critical
Publication of NL178462C publication Critical patent/NL178462C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
NLAANVRAGE7415030,A 1973-11-23 1974-11-19 Halfgeleiderinrichting, omvattende een halfgeleiderlichaam met ten minste een kruising tussen twee van elkaar geisoleerde elektrische verbindingen. NL178462C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5439273A GB1447675A (en) 1973-11-23 1973-11-23 Semiconductor devices

Publications (3)

Publication Number Publication Date
NL7415030A NL7415030A (nl) 1975-05-27
NL178462B NL178462B (nl) 1985-10-16
NL178462C true NL178462C (nl) 1986-03-17

Family

ID=10470867

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7415030,A NL178462C (nl) 1973-11-23 1974-11-19 Halfgeleiderinrichting, omvattende een halfgeleiderlichaam met ten minste een kruising tussen twee van elkaar geisoleerde elektrische verbindingen.

Country Status (9)

Country Link
US (1) US3964092A (nl)
JP (1) JPS5651503B2 (nl)
CA (1) CA1015463A (nl)
CH (1) CH579828A5 (nl)
DE (1) DE2453279C3 (nl)
FR (1) FR2252654B1 (nl)
GB (1) GB1447675A (nl)
IT (1) IT1024876B (nl)
NL (1) NL178462C (nl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4013489A (en) * 1976-02-10 1977-03-22 Intel Corporation Process for forming a low resistance interconnect in MOS N-channel silicon gate integrated circuit
NL7700420A (nl) * 1977-01-17 1978-07-19 Philips Nv Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.
JPS5917852B2 (ja) * 1977-02-07 1984-04-24 日本電気株式会社 半導体装置
JPS54110068U (nl) * 1978-01-20 1979-08-02
US4219925A (en) * 1978-09-01 1980-09-02 Teletype Corporation Method of manufacturing a device in a silicon wafer
JPS55123147A (en) * 1979-03-15 1980-09-22 Nec Corp Semiconductor device
JPS568846A (en) * 1979-07-03 1981-01-29 Nec Corp Semiconductor integrated circuit
JPS56126969A (en) * 1980-03-11 1981-10-05 Toshiba Corp Integrated circuit device
JPS6124429Y2 (nl) * 1980-03-26 1986-07-22
JPS61144041A (ja) * 1984-12-18 1986-07-01 Yokogawa Electric Corp 半導体装置
US4778775A (en) * 1985-08-26 1988-10-18 Intel Corporation Buried interconnect for silicon on insulator structure
US4712126A (en) * 1986-03-17 1987-12-08 Rca Corporation Low resistance tunnel
US4885627A (en) * 1988-10-18 1989-12-05 International Business Machines Corporation Method and structure for reducing resistance in integrated circuits
GB2245418A (en) * 1990-06-20 1992-01-02 Koninkl Philips Electronics Nv A semiconductor device and a method of manufacturing such a device
JP3892650B2 (ja) * 2000-07-25 2007-03-14 株式会社日立製作所 液晶表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189973A (en) * 1961-11-27 1965-06-22 Bell Telephone Labor Inc Method of fabricating a semiconductor device
US3823348A (en) * 1966-03-31 1974-07-09 Ibm Monolithic integrated structure including fabrication and package therefor
NL6606912A (nl) * 1966-05-19 1967-11-20
US3443175A (en) * 1967-03-22 1969-05-06 Rca Corp Pn-junction semiconductor with polycrystalline layer on one region
US3475234A (en) * 1967-03-27 1969-10-28 Bell Telephone Labor Inc Method for making mis structures
US3365707A (en) * 1967-06-23 1968-01-23 Rca Corp Lsi array and standard cells
DE1812790A1 (de) * 1968-12-05 1970-06-11 Itt Ind Gmbh Deutsche Verfahren zum Herstellen eines niederohmigen Widerstandes oder einer elektrischen Verbindung in einer monolithischen Festkoerperschaltung
US3659162A (en) * 1968-12-27 1972-04-25 Nippon Electric Co Semiconductor integrated circuit device having improved wiring layer structure
BE792001A (fr) * 1971-11-29 1973-03-16 Western Electric Co Structures a circuits integres a croisements

Also Published As

Publication number Publication date
DE2453279C3 (de) 1984-04-26
JPS5651503B2 (nl) 1981-12-05
GB1447675A (en) 1976-08-25
JPS5085285A (nl) 1975-07-09
US3964092A (en) 1976-06-15
CA1015463A (en) 1977-08-09
IT1024876B (it) 1978-07-20
DE2453279A1 (de) 1975-05-28
NL178462B (nl) 1985-10-16
CH579828A5 (nl) 1976-09-15
DE2453279B2 (de) 1980-08-14
FR2252654B1 (nl) 1979-02-23
NL7415030A (nl) 1975-05-27
FR2252654A1 (nl) 1975-06-20

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee