NL148744B - Werkwijze voor het vervaardigen van een stelsel halfgeleidende elementen en zo verkegen stelsels en daaruit vervaardigde kleinere stelsels en afzonderlijke halfgeleidende elementen. - Google Patents
Werkwijze voor het vervaardigen van een stelsel halfgeleidende elementen en zo verkegen stelsels en daaruit vervaardigde kleinere stelsels en afzonderlijke halfgeleidende elementen.Info
- Publication number
- NL148744B NL148744B NL686812708A NL6812708A NL148744B NL 148744 B NL148744 B NL 148744B NL 686812708 A NL686812708 A NL 686812708A NL 6812708 A NL6812708 A NL 6812708A NL 148744 B NL148744 B NL 148744B
- Authority
- NL
- Netherlands
- Prior art keywords
- systems
- semiconductive elements
- procedure
- manufacture
- separate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Photovoltaic Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5676867 | 1967-09-06 | ||
JP42061666A JPS5111475B1 (nl) | 1967-09-27 | 1967-09-27 | |
JP883668 | 1968-02-14 | ||
DE1764872A DE1764872C3 (de) | 1967-09-06 | 1968-08-22 | Verfahren zur Herstellung von Halbleiter-Gleichrichtern |
US5985370A | 1970-06-25 | 1970-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6812708A NL6812708A (nl) | 1969-03-10 |
NL148744B true NL148744B (nl) | 1976-02-16 |
Family
ID=27509955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL686812708A NL148744B (nl) | 1967-09-06 | 1968-09-06 | Werkwijze voor het vervaardigen van een stelsel halfgeleidende elementen en zo verkegen stelsels en daaruit vervaardigde kleinere stelsels en afzonderlijke halfgeleidende elementen. |
Country Status (5)
Country | Link |
---|---|
US (2) | US3648121A (nl) |
DE (1) | DE1764872C3 (nl) |
FR (1) | FR1579178A (nl) |
GB (2) | GB1246668A (nl) |
NL (1) | NL148744B (nl) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846559U (nl) * | 1971-09-30 | 1973-06-18 | ||
DE2237366A1 (de) * | 1972-07-29 | 1974-02-14 | Semikron Gleichrichterbau | Halbleiteranordnung |
IT985859B (it) * | 1973-05-07 | 1974-12-20 | Int Rectifier Corp Italiana Sp | Gruppo raddrizzatore trifase per alternatori di autoveicoli con cir cuito ausiliario di eccitazione |
US3889285A (en) * | 1974-02-20 | 1975-06-10 | Ford Motor Co | Canister diode having improved environment protective insulation |
US3939558A (en) * | 1975-02-10 | 1976-02-24 | Bourns, Inc. | Method of forming an electrical network package |
DE7512573U (de) * | 1975-04-19 | 1975-09-04 | Semikron Gesellschaft Fuer Gleichri | Halbleitergleichrichteranordnung |
FR2395609A1 (fr) * | 1977-06-24 | 1979-01-19 | Radiotechnique Compelec | Panneau generateur a cellules solaires noyees dans un stratifie et procede pour l'obtenir |
DE2734571A1 (de) * | 1977-07-30 | 1979-02-15 | Bosch Gmbh Robert | Gleichrichteranordnung |
US4218694A (en) * | 1978-10-23 | 1980-08-19 | Ford Motor Company | Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers |
FR2453500A1 (fr) * | 1979-04-04 | 1980-10-31 | Sev Alternateurs | Dispositif redresseur pour alternateur de vehicule automobile |
US4438561A (en) * | 1981-10-01 | 1984-03-27 | Rogers Corporation | Method of reworking printed circuit boards |
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
US4606000A (en) * | 1985-03-27 | 1986-08-12 | General Motors Corporation | Bridge rectifier |
DE3711192A1 (de) * | 1987-04-02 | 1988-10-13 | Bosch Gmbh Robert | Lager- und kuehleinrichtung fuer gleichrichterdioden bei elektrischen maschinen |
US5300809A (en) * | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
JP2964654B2 (ja) * | 1991-01-30 | 1999-10-18 | 住友電気工業株式会社 | 摩耗評価試験方法 |
US5413964A (en) * | 1991-06-24 | 1995-05-09 | Digital Equipment Corporation | Photo-definable template for semiconductor chip alignment |
JP2531928B2 (ja) * | 1993-11-05 | 1996-09-04 | 株式会社東芝 | 半導体スタック |
JP4479121B2 (ja) * | 2001-04-25 | 2010-06-09 | 株式会社デンソー | 半導体装置の製造方法 |
KR100570586B1 (ko) * | 2002-12-17 | 2006-04-13 | (주)아이블포토닉스 | 강유전성 단결정 막 구조물 제조 방법 |
US20050156329A1 (en) * | 2003-12-24 | 2005-07-21 | Sheen Charng G. | Semiconductor device by embedded package |
DE102013216709B4 (de) * | 2013-08-22 | 2021-03-25 | Infineon Technologies Ag | Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen und verfahren zur herstellung einer halbleiteranordnung |
WO2015053595A1 (ko) * | 2013-10-11 | 2015-04-16 | 주식회사 세미콘라이트 | 반도체 발광소자 |
DE102015007586A1 (de) * | 2015-06-16 | 2016-12-22 | Audi Ag | Energieübertragungseinrichtung |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2994121A (en) * | 1958-11-21 | 1961-08-01 | Shockley William | Method of making a semiconductive switching array |
BE584431A (nl) * | 1959-02-09 | |||
US3435516A (en) * | 1959-05-06 | 1969-04-01 | Texas Instruments Inc | Semiconductor structure fabrication |
US3179854A (en) * | 1961-04-24 | 1965-04-20 | Rca Corp | Modular structures and methods of making them |
BE620118A (nl) * | 1961-07-14 | |||
US3340347A (en) * | 1964-10-12 | 1967-09-05 | Corning Glass Works | Enclosed electronic device |
US3349481A (en) * | 1964-12-29 | 1967-10-31 | Alpha Microelectronics Company | Integrated circuit sealing method and structure |
US3476985A (en) * | 1965-12-15 | 1969-11-04 | Licentia Gmbh | Semiconductor rectifier unit |
US3461549A (en) * | 1966-03-09 | 1969-08-19 | Matsushita Electronics Corp | Method for manufacturing semiconductor devices |
US3509429A (en) * | 1968-01-15 | 1970-04-28 | Ibm | Heat sink assembly for semiconductor devices |
-
1968
- 1968-07-03 US US742292A patent/US3648121A/en not_active Expired - Lifetime
- 1968-08-21 FR FR1579178D patent/FR1579178A/fr not_active Expired
- 1968-08-22 DE DE1764872A patent/DE1764872C3/de not_active Expired
- 1968-09-06 GB GB03602/71A patent/GB1246668A/en not_active Expired
- 1968-09-06 GB GB36505/68A patent/GB1246667A/en not_active Expired
- 1968-09-06 NL NL686812708A patent/NL148744B/nl not_active IP Right Cessation
-
1970
- 1970-06-25 US US00059853A patent/US3715802A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL6812708A (nl) | 1969-03-10 |
DE1764872B2 (de) | 1979-08-30 |
GB1246667A (en) | 1971-09-15 |
DE1764872A1 (de) | 1971-11-25 |
DE1764872C3 (de) | 1980-07-17 |
FR1579178A (nl) | 1969-08-22 |
US3648121A (en) | 1972-03-07 |
GB1246668A (en) | 1971-09-15 |
US3715802A (en) | 1973-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NL80 | Information provided on patent owner name for an already discontinued patent |
Owner name: TOKYO SHIBAURA |
|
V4 | Discontinued because of reaching the maximum lifetime of a patent |