NL136972C - - Google Patents

Info

Publication number
NL136972C
NL136972C NL136972DA NL136972C NL 136972 C NL136972 C NL 136972C NL 136972D A NL136972D A NL 136972DA NL 136972 C NL136972 C NL 136972C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of NL136972C publication Critical patent/NL136972C/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
NL136972D 1961-08-04 NL136972C (cs)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES75181A DE1276209B (de) 1961-08-04 1961-08-04 Halter fuer mindestens ein scheibenfoermiges Halbleiterbauelement
DES0077980 1962-02-10

Publications (1)

Publication Number Publication Date
NL136972C true NL136972C (cs) 1900-01-01

Family

ID=25996550

Family Applications (5)

Application Number Title Priority Date Filing Date
NL136972D NL136972C (cs) 1961-08-04
NL281641D NL281641A (cs) 1961-08-04
NL288523D NL288523A (cs) 1961-08-04
NL7214496A NL7214496A (cs) 1961-08-04 1972-10-26
NL7214497A NL7214497A (cs) 1961-08-04 1972-10-26

Family Applications After (4)

Application Number Title Priority Date Filing Date
NL281641D NL281641A (cs) 1961-08-04
NL288523D NL288523A (cs) 1961-08-04
NL7214496A NL7214496A (cs) 1961-08-04 1972-10-26
NL7214497A NL7214497A (cs) 1961-08-04 1972-10-26

Country Status (7)

Country Link
US (2) US3280389A (cs)
BE (2) BE620870A (cs)
CH (2) CH456772A (cs)
DE (2) DE1276209B (cs)
GB (2) GB1009359A (cs)
NL (5) NL7214496A (cs)
SE (2) SE312859B (cs)

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DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
NL302170A (cs) * 1963-06-15
US3414964A (en) * 1964-01-24 1968-12-10 Siemens Ag Method for the production of a soldered joint
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
USB411062I5 (cs) * 1964-11-13
US3328650A (en) * 1965-01-14 1967-06-27 Int Rectifier Corp Compression bonded semiconductor device
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
GB1132847A (en) * 1965-04-27 1968-11-06 Lucas Industries Ltd Full wave rectifier assemblies
DE1514477C3 (de) * 1965-06-10 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
NL136731C (cs) * 1965-06-23
US3354258A (en) * 1965-07-21 1967-11-21 Hughes Aircraft Co Package for semiconductor devices and method of making same
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
CA869745A (en) * 1967-09-11 1971-04-27 R. Petersen Sigrud Spring mounted pressure diodes
DE1614640B1 (de) * 1967-10-26 1971-12-02 Siemens Ag Gleichrichteranordnung
US3512053A (en) * 1968-01-25 1970-05-12 Asea Ab Semi-conductor device having means pressing a connector into contact with a semi-conductor disc
FR1600561A (cs) * 1968-01-26 1970-07-27
US3523215A (en) * 1968-03-19 1970-08-04 Westinghouse Electric Corp Stack module for flat package semiconductor device assemblies
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
US3571663A (en) * 1969-01-08 1971-03-23 Chemetron Corp Releasable clamp assembly for a solid state circuit element
US3573569A (en) * 1969-08-12 1971-04-06 Gen Motors Corp Controlled rectifier mounting assembly
US3661013A (en) * 1969-12-23 1972-05-09 Electric Regulator Corp Semiconductor assembly
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
SE350874B (cs) * 1970-03-05 1972-11-06 Asea Ab
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
CH533362A (de) * 1971-06-25 1973-01-31 Bbc Brown Boveri & Cie Halbleiterbauelement
US3718841A (en) * 1971-07-09 1973-02-27 Gen Electric Modular rectifier holding assembly with heat sink supporting circuit protecting means
US3727114A (en) * 1971-08-03 1973-04-10 Mitsubishi Electric Corp Air cooled semiconductor stack
FR2164545B1 (cs) * 1971-12-21 1974-06-07 Ibm France
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
DE2603813C2 (de) * 1976-02-02 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise
EP0102654B1 (de) * 1982-09-10 1986-05-28 BBC Aktiengesellschaft Brown, Boveri & Cie. Horizontalachsige Stromrichteranordnung
US4562512A (en) * 1984-07-23 1985-12-31 Sundstrand Corporation Multiple semiconductor containing package having a heat sink core
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
GB2189343B (en) * 1986-04-02 1990-11-14 Int Rectifier Co Ltd Semi-conductor modules
US5548965A (en) * 1995-05-31 1996-08-27 Spectronics Corporation Multi-cavity evaporator
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
US5923083A (en) * 1997-03-01 1999-07-13 Microsemi Corporation Packaging technology for Schottky die
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
TWM320181U (en) * 2007-01-11 2007-10-01 Everlight Electronics Co Ltd Altenating current light emitting diode device
KR101360012B1 (ko) * 2007-01-26 2014-02-11 인덕터썸코포레이션 반도체 컴포넌트의 압축 클램핑
GB2529338B (en) * 2013-05-13 2019-03-20 Abb Schweiz Ag Spacer system for a semiconductor switching device
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul
US10978313B2 (en) * 2018-02-20 2021-04-13 International Business Machines Corporation Fixture facilitating heat sink fabrication
EP4372806A1 (en) * 2022-11-15 2024-05-22 GE Energy Power Conversion Technology Ltd Heatsink for cooling electronic device packages and associated packaging stack

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FR7281E (fr) * 1906-07-07 1907-06-19 Vindrier Freres Soc Perfectionnement dans les cannetières
NL179929C (cs) * 1952-11-03 1900-01-01 Du Pont
NL87784C (cs) * 1953-10-23 1958-04-15
BE543787A (cs) * 1954-12-21
US2839710A (en) * 1955-05-12 1958-06-17 Westinghouse Freins & Signaux Rectifier assemblies
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
CH344786A (de) * 1956-06-29 1960-02-29 Bbc Brown Boveri & Cie Kühler für die Wärmeableitung an einer in einem Gefäss eingebauten Halbleiterzelle
FR1165234A (fr) * 1957-01-19 1958-10-20 Westinghouse Freins & Signaux Procédé de fixation d'un capot de protection d'un organe sensible tel que redresseur sur un socle destiné à supporter ledit organe et produit industriel en résultant
GB883862A (en) * 1958-05-29 1961-12-06 Ass Elect Ind Improvements relating to semi-conductor rectifiers
NL241492A (cs) * 1958-07-21
FR1256292A (fr) * 1959-05-04 1961-03-17 Thomson Houston Comp Francaise Perfectionnements aux redresseurs
GB1001269A (cs) * 1960-09-30 1900-01-01

Also Published As

Publication number Publication date
DE1276209B (de) 1968-08-29
NL7214497A (cs) 1973-02-26
GB1029171A (en) 1966-05-11
BE628175A (cs) 1900-01-01
NL288523A (cs) 1900-01-01
NL7214496A (cs) 1973-02-26
US3280389A (en) 1966-10-18
CH456772A (de) 1968-07-31
CH417775A (de) 1966-07-31
DE1439126B2 (de) 1973-12-20
DE1439126A1 (de) 1969-01-30
SE329212B (cs) 1970-10-05
NL281641A (cs) 1900-01-01
GB1009359A (en) 1965-11-10
SE312859B (cs) 1969-07-28
US3226466A (en) 1965-12-28
BE620870A (cs) 1900-01-01
DE1439126C3 (de) 1974-07-18

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