NL1028960C2 - Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. - Google Patents
Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. Download PDFInfo
- Publication number
- NL1028960C2 NL1028960C2 NL1028960A NL1028960A NL1028960C2 NL 1028960 C2 NL1028960 C2 NL 1028960C2 NL 1028960 A NL1028960 A NL 1028960A NL 1028960 A NL1028960 A NL 1028960A NL 1028960 C2 NL1028960 C2 NL 1028960C2
- Authority
- NL
- Netherlands
- Prior art keywords
- exposure
- time
- resist layer
- dose
- semiconductor wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004022329 | 2004-05-06 | ||
DE200410022329 DE102004022329B3 (de) | 2004-05-06 | 2004-05-06 | Verfahren zur dynamischen Dosisanpassung in einem lithographischen Projektionsapparat und Projektionsapparat |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1028960A1 NL1028960A1 (nl) | 2005-11-08 |
NL1028960C2 true NL1028960C2 (nl) | 2007-12-11 |
Family
ID=35455219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1028960A NL1028960C2 (nl) | 2004-05-06 | 2005-05-04 | Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005322930A (ja) |
DE (1) | DE102004022329B3 (ja) |
NL (1) | NL1028960C2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035706A (ja) * | 2005-07-22 | 2007-02-08 | Nikon Corp | 搬送装置、露光装置及びマイクロデバイスの製造方法 |
JP4682734B2 (ja) * | 2005-07-29 | 2011-05-11 | 凸版印刷株式会社 | フォトマスクのパターン描画方法 |
JP4347354B2 (ja) | 2007-02-22 | 2009-10-21 | キヤノン株式会社 | 露光装置、製造システム及びデバイスの製造方法 |
JP4683163B2 (ja) * | 2010-10-29 | 2011-05-11 | 凸版印刷株式会社 | フォトマスクのパターン描画方法 |
JP2016086042A (ja) * | 2014-10-23 | 2016-05-19 | 東京エレクトロン株式会社 | 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2186145A5 (ja) * | 1972-05-25 | 1974-01-04 | Misomex Ab | |
EP1205806A1 (en) * | 2000-11-09 | 2002-05-15 | Semiconductor300 GmbH & Co KG | Method for exposing a semiconductor wafer |
WO2005013007A1 (en) * | 2003-08-04 | 2005-02-10 | Micronic Laser Systems Ab | Further method to pattern a substrate |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001338865A (ja) * | 2000-05-30 | 2001-12-07 | Nec Corp | 半導体露光方法及び半導体製造装置 |
-
2004
- 2004-05-06 DE DE200410022329 patent/DE102004022329B3/de not_active Expired - Fee Related
-
2005
- 2005-05-04 NL NL1028960A patent/NL1028960C2/nl not_active IP Right Cessation
- 2005-05-06 JP JP2005135452A patent/JP2005322930A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2186145A5 (ja) * | 1972-05-25 | 1974-01-04 | Misomex Ab | |
EP1205806A1 (en) * | 2000-11-09 | 2002-05-15 | Semiconductor300 GmbH & Co KG | Method for exposing a semiconductor wafer |
WO2005013007A1 (en) * | 2003-08-04 | 2005-02-10 | Micronic Laser Systems Ab | Further method to pattern a substrate |
Non-Patent Citations (1)
Title |
---|
SHI F F ET AL: "Electron beam stabilization and dissolution behaviors of advanced deep UV photoresist for sub 0.3 mum microelectronics fabrication", PREPARATION AND CHARACTERIZATION, ELSEVIER SEQUOIA, NL, vol. 322, no. 1-2, 8 June 1998 (1998-06-08), pages 254 - 258, XP004147754, ISSN: 0040-6090 * |
Also Published As
Publication number | Publication date |
---|---|
DE102004022329B3 (de) | 2005-12-29 |
JP2005322930A (ja) | 2005-11-17 |
NL1028960A1 (nl) | 2005-11-08 |
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PD2B | A search report has been drawn up | ||
VD1 | Lapsed due to non-payment of the annual fee |
Effective date: 20091201 |