NL1028960C2 - Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. - Google Patents

Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. Download PDF

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Publication number
NL1028960C2
NL1028960C2 NL1028960A NL1028960A NL1028960C2 NL 1028960 C2 NL1028960 C2 NL 1028960C2 NL 1028960 A NL1028960 A NL 1028960A NL 1028960 A NL1028960 A NL 1028960A NL 1028960 C2 NL1028960 C2 NL 1028960C2
Authority
NL
Netherlands
Prior art keywords
exposure
time
resist layer
dose
semiconductor wafer
Prior art date
Application number
NL1028960A
Other languages
English (en)
Dutch (nl)
Other versions
NL1028960A1 (nl
Inventor
Karl Schumacher
Thorsten Schedel
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of NL1028960A1 publication Critical patent/NL1028960A1/nl
Application granted granted Critical
Publication of NL1028960C2 publication Critical patent/NL1028960C2/nl

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NL1028960A 2004-05-06 2005-05-04 Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat. NL1028960C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004022329 2004-05-06
DE200410022329 DE102004022329B3 (de) 2004-05-06 2004-05-06 Verfahren zur dynamischen Dosisanpassung in einem lithographischen Projektionsapparat und Projektionsapparat

Publications (2)

Publication Number Publication Date
NL1028960A1 NL1028960A1 (nl) 2005-11-08
NL1028960C2 true NL1028960C2 (nl) 2007-12-11

Family

ID=35455219

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1028960A NL1028960C2 (nl) 2004-05-06 2005-05-04 Werkwijze voor het dynamisch aanpassen van de dosis in een lithografisch projectieapparaat en projectieapparaat.

Country Status (3)

Country Link
JP (1) JP2005322930A (ja)
DE (1) DE102004022329B3 (ja)
NL (1) NL1028960C2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035706A (ja) * 2005-07-22 2007-02-08 Nikon Corp 搬送装置、露光装置及びマイクロデバイスの製造方法
JP4682734B2 (ja) * 2005-07-29 2011-05-11 凸版印刷株式会社 フォトマスクのパターン描画方法
JP4347354B2 (ja) 2007-02-22 2009-10-21 キヤノン株式会社 露光装置、製造システム及びデバイスの製造方法
JP4683163B2 (ja) * 2010-10-29 2011-05-11 凸版印刷株式会社 フォトマスクのパターン描画方法
JP2016086042A (ja) * 2014-10-23 2016-05-19 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2186145A5 (ja) * 1972-05-25 1974-01-04 Misomex Ab
EP1205806A1 (en) * 2000-11-09 2002-05-15 Semiconductor300 GmbH & Co KG Method for exposing a semiconductor wafer
WO2005013007A1 (en) * 2003-08-04 2005-02-10 Micronic Laser Systems Ab Further method to pattern a substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338865A (ja) * 2000-05-30 2001-12-07 Nec Corp 半導体露光方法及び半導体製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2186145A5 (ja) * 1972-05-25 1974-01-04 Misomex Ab
EP1205806A1 (en) * 2000-11-09 2002-05-15 Semiconductor300 GmbH & Co KG Method for exposing a semiconductor wafer
WO2005013007A1 (en) * 2003-08-04 2005-02-10 Micronic Laser Systems Ab Further method to pattern a substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SHI F F ET AL: "Electron beam stabilization and dissolution behaviors of advanced deep UV photoresist for sub 0.3 mum microelectronics fabrication", PREPARATION AND CHARACTERIZATION, ELSEVIER SEQUOIA, NL, vol. 322, no. 1-2, 8 June 1998 (1998-06-08), pages 254 - 258, XP004147754, ISSN: 0040-6090 *

Also Published As

Publication number Publication date
DE102004022329B3 (de) 2005-12-29
JP2005322930A (ja) 2005-11-17
NL1028960A1 (nl) 2005-11-08

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