NL1002387A1 - Elektrodepositie-apparaat. - Google Patents

Elektrodepositie-apparaat.

Info

Publication number
NL1002387A1
NL1002387A1 NL1002387A NL1002387A NL1002387A1 NL 1002387 A1 NL1002387 A1 NL 1002387A1 NL 1002387 A NL1002387 A NL 1002387A NL 1002387 A NL1002387 A NL 1002387A NL 1002387 A1 NL1002387 A1 NL 1002387A1
Authority
NL
Netherlands
Prior art keywords
electrodeposition device
electrodeposition
Prior art date
Application number
NL1002387A
Other languages
English (en)
Other versions
NL1002387C2 (nl
Inventor
Tadashi Saito
Atsushi Sato
Hisashi Misumi
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7031096A external-priority patent/JP2977461B2/ja
Priority claimed from JP13214995A external-priority patent/JP3442904B2/ja
Priority claimed from JP13948495A external-priority patent/JP3442906B2/ja
Application filed by Kao Corp filed Critical Kao Corp
Publication of NL1002387A1 publication Critical patent/NL1002387A1/nl
Application granted granted Critical
Publication of NL1002387C2 publication Critical patent/NL1002387C2/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
NL1002387A 1995-02-20 1996-02-19 Elektrodepositie-apparaat. NL1002387C2 (nl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7031096A JP2977461B2 (ja) 1995-02-20 1995-02-20 電鋳装置
JP13214995A JP3442904B2 (ja) 1995-05-30 1995-05-30 電鋳装置
JP13948495A JP3442906B2 (ja) 1995-06-06 1995-06-06 電鋳装置

Publications (2)

Publication Number Publication Date
NL1002387A1 true NL1002387A1 (nl) 1996-08-22
NL1002387C2 NL1002387C2 (nl) 1996-11-19

Family

ID=27287202

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1002387A NL1002387C2 (nl) 1995-02-20 1996-02-19 Elektrodepositie-apparaat.

Country Status (2)

Country Link
US (1) US5660699A (nl)
NL (1) NL1002387C2 (nl)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376258B2 (ja) 1996-11-28 2003-02-10 キヤノン株式会社 陽極化成装置及びそれに関連する装置及び方法
JP3347742B2 (ja) * 1997-01-02 2002-11-20 シーヴイシー・プロダクツ・インコーポレーテッド 真空処理装置のための熱伝導性チャック、熱伝達装置及びチャック本体と基材との間で熱を伝達させる方法
US5833820A (en) * 1997-06-19 1998-11-10 Advanced Micro Devices, Inc. Electroplating apparatus
US6138745A (en) 1997-09-26 2000-10-31 Cvc Products, Inc. Two-stage sealing system for thermally conductive chuck
US6187164B1 (en) 1997-09-30 2001-02-13 Symyx Technologies, Inc. Method for creating and testing a combinatorial array employing individually addressable electrodes
US6818110B1 (en) 1997-09-30 2004-11-16 Symyx Technologies, Inc. Combinatorial electrochemical deposition and testing system
US6073576A (en) * 1997-11-25 2000-06-13 Cvc Products, Inc. Substrate edge seal and clamp for low-pressure processing equipment
DE19831529C2 (de) * 1998-07-14 2002-04-11 Micronas Gmbh Verfahren zum Herstellen einer Elektrode
US6039858A (en) 1998-07-22 2000-03-21 International Business Machines Corporation Plating process for x-ray mask fabrication
DE19859467C2 (de) 1998-12-22 2002-11-28 Steag Micro Tech Gmbh Substrathalter
US6217734B1 (en) * 1999-02-23 2001-04-17 International Business Machines Corporation Electroplating electrical contacts
DE19962170A1 (de) * 1999-12-22 2001-07-12 Steag Micro Tech Gmbh Substrahthalter
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
SE0001368L (sv) * 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE0001367L (sv) * 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
JP3934891B2 (ja) 2001-01-15 2007-06-20 株式会社日立製作所 陽極酸化処理方法および装置
US6638409B1 (en) 2002-05-21 2003-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Stable plating performance in copper electrochemical plating
US7722747B2 (en) * 2003-10-22 2010-05-25 Nexx Systems, Inc. Method and apparatus for fluid processing a workpiece
US7727366B2 (en) 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
US7241476B2 (en) * 2004-09-16 2007-07-10 Honeywell International Inc. Airflow masking of carbon-carbon composites for application of antioxidants
JP2006233296A (ja) * 2005-02-25 2006-09-07 Yamamoto Mekki Shikenki:Kk 電気めっき用治具
US20080194113A1 (en) * 2006-09-20 2008-08-14 Samsung Electronics Co., Ltd. Methods and apparatus for semiconductor etching including an electro static chuck
US7823452B2 (en) * 2007-09-27 2010-11-02 International Business Machines Corporation Slip ring positive Z force liquid isolation fixture permitting zero net force on workpiece
US20100151680A1 (en) * 2008-12-17 2010-06-17 Optisolar Inc. Substrate carrier with enhanced temperature uniformity
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
CN104862660B (zh) * 2014-02-24 2017-10-13 北京北方华创微电子装备有限公司 承载装置及等离子体加工设备
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
RU2630996C1 (ru) * 2016-11-10 2017-09-15 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" Устройство для локального нанесения металлических покрытий электролитическим методом
JP6893142B2 (ja) * 2017-07-25 2021-06-23 上村工業株式会社 ワーク保持治具及び電気めっき装置
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
EP3960909B1 (en) * 2020-08-25 2023-11-01 Semsysco GmbH Plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE741264C (de) * 1941-10-31 1943-11-08 Rheinmetall Borsig Ag Haltevorrichtung fuer Geschosse
US3536594A (en) * 1968-07-05 1970-10-27 Western Electric Co Method and apparatus for rapid gold plating integrated circuit slices
JPS569141A (en) * 1979-06-29 1981-01-30 Hitachi Metals Ltd Supporting method for article
US4381964A (en) * 1981-05-29 1983-05-03 Rca Corporation Method and apparatus for separating a stamper from a mold
NL8701603A (nl) * 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
US5167792A (en) * 1990-12-19 1992-12-01 Canon Kabushiki Kaisha Master holder of stamper electroforming apparatus and electroforming method

Also Published As

Publication number Publication date
NL1002387C2 (nl) 1996-11-19
US5660699A (en) 1997-08-26

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Legal Events

Date Code Title Description
AD1A A request for search or an international type search has been filed
RD2N Patents in respect of which a decision has been taken or a report has been made (novelty report)

Effective date: 19960916

PD2B A search report has been drawn up
VD1 Lapsed due to non-payment of the annual fee

Effective date: 20060901