MY7300448A - Improvements in or relating to methods of etching semiconductor devices - Google Patents

Improvements in or relating to methods of etching semiconductor devices

Info

Publication number
MY7300448A
MY7300448A MY448/73A MY7300448A MY7300448A MY 7300448 A MY7300448 A MY 7300448A MY 448/73 A MY448/73 A MY 448/73A MY 7300448 A MY7300448 A MY 7300448A MY 7300448 A MY7300448 A MY 7300448A
Authority
MY
Malaysia
Prior art keywords
relating
methods
semiconductor devices
etching semiconductor
etching
Prior art date
Application number
MY448/73A
Other languages
English (en)
Inventor
Roger Clyde Kragness
Herbert Atkin Waggener
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of MY7300448A publication Critical patent/MY7300448A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/115—Orientation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)
MY448/73A 1967-11-01 1973-12-30 Improvements in or relating to methods of etching semiconductor devices MY7300448A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67981867A 1967-11-01 1967-11-01

Publications (1)

Publication Number Publication Date
MY7300448A true MY7300448A (en) 1973-12-31

Family

ID=24728489

Family Applications (1)

Application Number Title Priority Date Filing Date
MY448/73A MY7300448A (en) 1967-11-01 1973-12-30 Improvements in or relating to methods of etching semiconductor devices

Country Status (7)

Country Link
US (1) US3506509A (xx)
BE (1) BE723234A (xx)
FR (1) FR96065E (xx)
GB (1) GB1250653A (xx)
MY (1) MY7300448A (xx)
NL (1) NL152115B (xx)
SE (1) SE353185B (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770533A (en) * 1971-07-02 1973-11-06 Philips Corp Method of producing high resolution patterns in single crystals
US3909325A (en) * 1974-06-28 1975-09-30 Motorola Inc Polycrystalline etch
US4137123A (en) * 1975-12-31 1979-01-30 Motorola, Inc. Texture etching of silicon: method
US4859280A (en) * 1986-12-01 1989-08-22 Harris Corporation Method of etching silicon by enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions
US4810557A (en) * 1988-03-03 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making an article comprising a tandem groove, and article produced by the method
US4918030A (en) * 1989-03-31 1990-04-17 Electric Power Research Institute Method of forming light-trapping surface for photovoltaic cell and resulting structure
DE3920644C1 (xx) * 1989-06-23 1990-12-20 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
US5431777A (en) * 1992-09-17 1995-07-11 International Business Machines Corporation Methods and compositions for the selective etching of silicon
DE19811878C2 (de) 1998-03-18 2002-09-19 Siemens Solar Gmbh Verfahren und Ätzlösung zum naßchemischen pyramidalen Texturätzen von Siliziumoberflächen
US6326689B1 (en) * 1999-07-26 2001-12-04 Stmicroelectronics, Inc. Backside contact for touchchip
WO2007129555A1 (ja) * 2006-05-02 2007-11-15 Mimasu Semiconductor Industry Co., Ltd. 半導体基板の製造方法、ソーラー用半導体基板及びエッチング液

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL213347A (xx) * 1955-12-30
US3041226A (en) * 1958-04-02 1962-06-26 Hughes Aircraft Co Method of preparing semiconductor crystals
US3425879A (en) * 1965-10-24 1969-02-04 Texas Instruments Inc Method of making shaped epitaxial deposits

Also Published As

Publication number Publication date
DE1806225B2 (de) 1972-08-24
US3506509A (en) 1970-04-14
NL152115B (nl) 1977-01-17
FR96065E (fr) 1972-05-19
DE1806225A1 (de) 1971-01-28
GB1250653A (xx) 1971-10-20
SE353185B (xx) 1973-01-22
BE723234A (xx) 1969-04-01
NL6815372A (xx) 1969-05-05

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