MY6900226A - Dielectric bidies with selectively formed conductive portions and composites thereof with semiconductor material - Google Patents

Dielectric bidies with selectively formed conductive portions and composites thereof with semiconductor material

Info

Publication number
MY6900226A
MY6900226A MY1969226A MY6900226A MY6900226A MY 6900226 A MY6900226 A MY 6900226A MY 1969226 A MY1969226 A MY 1969226A MY 6900226 A MY6900226 A MY 6900226A MY 6900226 A MY6900226 A MY 6900226A
Authority
MY
Malaysia
Prior art keywords
reduction
yig
plating
nickel
metals
Prior art date
Application number
MY1969226A
Other languages
English (en)
Original Assignee
Texas Instruments Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Incorporated filed Critical Texas Instruments Incorporated
Publication of MY6900226A publication Critical patent/MY6900226A/xx

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/1025—Semiconducting materials
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    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Chemically Coating (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
MY1969226A 1964-05-14 1969-12-31 Dielectric bidies with selectively formed conductive portions and composites thereof with semiconductor material MY6900226A (en)

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US36746264A 1964-05-14 1964-05-14
US398480A US3390012A (en) 1964-05-14 1964-09-18 Method of making dielectric bodies having conducting portions

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US (1) US3390012A (fr)
DE (1) DE1590647A1 (fr)
FR (1) FR1472038A (fr)
GB (1) GB1107305A (fr)
MY (1) MY6900226A (fr)
NL (1) NL6506180A (fr)

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US3620833A (en) * 1966-12-23 1971-11-16 Texas Instruments Inc Integrated circuit fabrication
US3835530A (en) * 1967-06-05 1974-09-17 Texas Instruments Inc Method of making semiconductor devices
US3516133A (en) * 1967-10-18 1970-06-23 Melpar Inc High temperature bulk capacitor
US3886415A (en) * 1968-04-01 1975-05-27 Itek Corp Capacitor with photo-conductive dielectric
US3634929A (en) * 1968-11-02 1972-01-18 Tokyo Shibaura Electric Co Method of manufacturing semiconductor integrated circuits
US3634927A (en) * 1968-11-29 1972-01-18 Energy Conversion Devices Inc Method of selective wiring of integrated electronic circuits and the article formed thereby
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards
US3712700A (en) * 1971-01-18 1973-01-23 Rca Corp Method of making an electron emitter device
IL38468A (en) * 1971-02-02 1974-11-29 Hughes Aircraft Co Electrical resistance device and its production
US3795977A (en) * 1971-12-30 1974-03-12 Ibm Methods for fabricating bistable resistors
US4189760A (en) * 1973-05-13 1980-02-19 Erie Technological Products, Inc. Monolithic capacitor with non-noble metal electrodes and method of making the same
US3922708A (en) * 1974-03-04 1975-11-25 Ibm Method of producing high value ion implanted resistors
CH575166A5 (fr) * 1974-05-20 1976-04-30 Suisse Horlogerie
US4197633A (en) * 1977-09-01 1980-04-15 Honeywell, Inc. Hybrid mosaic IR/CCD focal plane
GB1604004A (en) * 1977-10-11 1981-12-02 Fujitsu Ltd Method and apparatus for processing semi-conductor wafers
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
EP0041381A1 (fr) * 1980-06-02 1981-12-09 British Aerospace Public Limited Company Modification de la conductibilité électrique de matériaux
DE3151557A1 (de) * 1981-12-28 1983-07-21 SWF-Spezialfabrik für Autozubehör Gustav Rau GmbH, 7120 Bietigheim-Bissingen Elektrooptische anzeigevorrichtung und verfahren zu ihrer herstellung
FR2535887A1 (fr) * 1982-11-04 1984-05-11 Thomson Csf Procede de fabrication d'une structure logique integree programmee selon une configuration preetablie fixe
US4541035A (en) * 1984-07-30 1985-09-10 General Electric Company Low loss, multilevel silicon circuit board
GB2217349B (en) * 1988-03-29 1992-06-24 Univ Hull Vapour deposited self-sealing ceramic coatings
DE3942472A1 (de) * 1989-12-22 1991-06-27 Asea Brown Boveri Beschichtungsverfahren
DE10320090A1 (de) * 2003-05-05 2004-08-26 Infineon Technologies Ag Elektrisches Bauteil mit Leitungen aus karbonisiertem Kunststoff, sowie Verfahren und Vorrichtung zu seiner Herstellung
DE102007014501A1 (de) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil
RU2543518C1 (ru) * 2013-10-03 2015-03-10 Общество с ограниченной ответственностью "Компания РМТ"(ООО"РМТ") Способ изготовления двусторонней печатной платы
US20160005514A1 (en) * 2014-07-07 2016-01-07 Epistar Corporation Method for forming electronic element
US10834828B2 (en) * 2018-01-26 2020-11-10 International Business Machines Corporation Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology

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US3118788A (en) * 1956-12-07 1964-01-21 Bausch & Lomb Metallic surface glass article
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
US3234044A (en) * 1962-09-25 1966-02-08 Sperry Rand Corp Use of an electron beam for manufacturing conductive patterns

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DE1590647A1 (de) 1970-05-06
US3390012A (en) 1968-06-25
GB1107305A (en) 1968-03-27
NL6506180A (fr) 1965-11-15
FR1472038A (fr) 1967-03-10

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