FR1472038A - Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments composites - Google Patents
Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments compositesInfo
- Publication number
- FR1472038A FR1472038A FR17129A FR17129A FR1472038A FR 1472038 A FR1472038 A FR 1472038A FR 17129 A FR17129 A FR 17129A FR 17129 A FR17129 A FR 17129A FR 1472038 A FR1472038 A FR 1472038A
- Authority
- FR
- France
- Prior art keywords
- elements
- composite
- bodies
- semiconductors
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
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- H01C7/001—Mass resistors
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- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/0302—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity characterised by unspecified or heterogeneous hardness or specially adapted for magnetic hardness transitions
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S148/026—Deposition thru hole in mask
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S148/106—Masks, special
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S148/15—Silicon on sapphire SOS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S430/143—Electron beam
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Electromagnetism (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Chemically Coating (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36746264A | 1964-05-14 | 1964-05-14 | |
US398480A US3390012A (en) | 1964-05-14 | 1964-09-18 | Method of making dielectric bodies having conducting portions |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1472038A true FR1472038A (fr) | 1967-03-10 |
Family
ID=27003803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR17129A Expired FR1472038A (fr) | 1964-05-14 | 1965-05-14 | Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments composites |
Country Status (6)
Country | Link |
---|---|
US (1) | US3390012A (fr) |
DE (1) | DE1590647A1 (fr) |
FR (1) | FR1472038A (fr) |
GB (1) | GB1107305A (fr) |
MY (1) | MY6900226A (fr) |
NL (1) | NL6506180A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2406304A1 (fr) * | 1977-10-11 | 1979-05-11 | Fujitsu Ltd | Procede et appareil d'etablissement d'un contact electrique par decharge avec une plaquette semi-conductrice |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3544925A (en) * | 1965-08-31 | 1970-12-01 | Vitramon Inc | Solid-state electrical component with capacitance defeating resistor arrangement |
US3620833A (en) * | 1966-12-23 | 1971-11-16 | Texas Instruments Inc | Integrated circuit fabrication |
US3835530A (en) * | 1967-06-05 | 1974-09-17 | Texas Instruments Inc | Method of making semiconductor devices |
US3516133A (en) * | 1967-10-18 | 1970-06-23 | Melpar Inc | High temperature bulk capacitor |
US3886415A (en) * | 1968-04-01 | 1975-05-27 | Itek Corp | Capacitor with photo-conductive dielectric |
US3634929A (en) * | 1968-11-02 | 1972-01-18 | Tokyo Shibaura Electric Co | Method of manufacturing semiconductor integrated circuits |
US3634927A (en) * | 1968-11-29 | 1972-01-18 | Energy Conversion Devices Inc | Method of selective wiring of integrated electronic circuits and the article formed thereby |
US3628999A (en) * | 1970-03-05 | 1971-12-21 | Frederick W Schneble Jr | Plated through hole printed circuit boards |
US3712700A (en) * | 1971-01-18 | 1973-01-23 | Rca Corp | Method of making an electron emitter device |
IL38468A (en) * | 1971-02-02 | 1974-11-29 | Hughes Aircraft Co | Electrical resistance device and its production |
US3795977A (en) * | 1971-12-30 | 1974-03-12 | Ibm | Methods for fabricating bistable resistors |
US4189760A (en) * | 1973-05-13 | 1980-02-19 | Erie Technological Products, Inc. | Monolithic capacitor with non-noble metal electrodes and method of making the same |
US3922708A (en) * | 1974-03-04 | 1975-11-25 | Ibm | Method of producing high value ion implanted resistors |
CH575166A5 (fr) * | 1974-05-20 | 1976-04-30 | Suisse Horlogerie | |
US4197633A (en) * | 1977-09-01 | 1980-04-15 | Honeywell, Inc. | Hybrid mosaic IR/CCD focal plane |
US4249196A (en) * | 1978-08-21 | 1981-02-03 | Burroughs Corporation | Integrated circuit module with integral capacitor |
EP0041381A1 (fr) * | 1980-06-02 | 1981-12-09 | British Aerospace Public Limited Company | Modification de la conductibilité électrique de matériaux |
DE3151557A1 (de) * | 1981-12-28 | 1983-07-21 | SWF-Spezialfabrik für Autozubehör Gustav Rau GmbH, 7120 Bietigheim-Bissingen | Elektrooptische anzeigevorrichtung und verfahren zu ihrer herstellung |
FR2535887A1 (fr) * | 1982-11-04 | 1984-05-11 | Thomson Csf | Procede de fabrication d'une structure logique integree programmee selon une configuration preetablie fixe |
US4541035A (en) * | 1984-07-30 | 1985-09-10 | General Electric Company | Low loss, multilevel silicon circuit board |
GB2217349B (en) * | 1988-03-29 | 1992-06-24 | Univ Hull | Vapour deposited self-sealing ceramic coatings |
DE3942472A1 (de) * | 1989-12-22 | 1991-06-27 | Asea Brown Boveri | Beschichtungsverfahren |
DE10320090A1 (de) * | 2003-05-05 | 2004-08-26 | Infineon Technologies Ag | Elektrisches Bauteil mit Leitungen aus karbonisiertem Kunststoff, sowie Verfahren und Vorrichtung zu seiner Herstellung |
DE102007014501A1 (de) * | 2007-03-27 | 2008-10-02 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil |
RU2543518C1 (ru) * | 2013-10-03 | 2015-03-10 | Общество с ограниченной ответственностью "Компания РМТ"(ООО"РМТ") | Способ изготовления двусторонней печатной платы |
US20160005514A1 (en) * | 2014-07-07 | 2016-01-07 | Epistar Corporation | Method for forming electronic element |
US10834828B2 (en) * | 2018-01-26 | 2020-11-10 | International Business Machines Corporation | Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3118788A (en) * | 1956-12-07 | 1964-01-21 | Bausch & Lomb | Metallic surface glass article |
US3056881A (en) * | 1961-06-07 | 1962-10-02 | United Aircraft Corp | Method of making electrical conductor device |
US3234044A (en) * | 1962-09-25 | 1966-02-08 | Sperry Rand Corp | Use of an electron beam for manufacturing conductive patterns |
-
1964
- 1964-09-18 US US398480A patent/US3390012A/en not_active Expired - Lifetime
-
1965
- 1965-05-03 GB GB18595/65A patent/GB1107305A/en not_active Expired
- 1965-05-14 FR FR17129A patent/FR1472038A/fr not_active Expired
- 1965-05-14 NL NL6506180A patent/NL6506180A/xx unknown
- 1965-05-14 DE DE1965T0028593 patent/DE1590647A1/de active Pending
-
1969
- 1969-12-31 MY MY1969226A patent/MY6900226A/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2406304A1 (fr) * | 1977-10-11 | 1979-05-11 | Fujitsu Ltd | Procede et appareil d'etablissement d'un contact electrique par decharge avec une plaquette semi-conductrice |
Also Published As
Publication number | Publication date |
---|---|
NL6506180A (fr) | 1965-11-15 |
GB1107305A (en) | 1968-03-27 |
DE1590647A1 (de) | 1970-05-06 |
US3390012A (en) | 1968-06-25 |
MY6900226A (en) | 1969-12-31 |
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