FR1472038A - Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments composites - Google Patents

Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments composites

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Publication number
FR1472038A
FR1472038A FR17129A FR17129A FR1472038A FR 1472038 A FR1472038 A FR 1472038A FR 17129 A FR17129 A FR 17129A FR 17129 A FR17129 A FR 17129A FR 1472038 A FR1472038 A FR 1472038A
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France
Prior art keywords
elements
composite
bodies
semiconductors
conductive
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Expired
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FR17129A
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English (en)
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Texas Instruments Inc
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Texas Instruments Inc
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Publication of FR1472038A publication Critical patent/FR1472038A/fr
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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    • H01B3/004Inhomogeneous material in general with conductive additives or conductive layers
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
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    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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    • H05K2203/12Using specific substances
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    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143Electron beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Chemically Coating (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR17129A 1964-05-14 1965-05-14 Corps diélectriques comportant des parties conductrices ou métalliques, éléments composites de ceux-ci avec des semiconducteurs et procédés de fabrication de tels corps et éléments composites Expired FR1472038A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36746264A 1964-05-14 1964-05-14
US398480A US3390012A (en) 1964-05-14 1964-09-18 Method of making dielectric bodies having conducting portions

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FR1472038A true FR1472038A (fr) 1967-03-10

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US (1) US3390012A (fr)
DE (1) DE1590647A1 (fr)
FR (1) FR1472038A (fr)
GB (1) GB1107305A (fr)
MY (1) MY6900226A (fr)
NL (1) NL6506180A (fr)

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FR2406304A1 (fr) * 1977-10-11 1979-05-11 Fujitsu Ltd Procede et appareil d'etablissement d'un contact electrique par decharge avec une plaquette semi-conductrice

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US3544925A (en) * 1965-08-31 1970-12-01 Vitramon Inc Solid-state electrical component with capacitance defeating resistor arrangement
US3620833A (en) * 1966-12-23 1971-11-16 Texas Instruments Inc Integrated circuit fabrication
US3835530A (en) * 1967-06-05 1974-09-17 Texas Instruments Inc Method of making semiconductor devices
US3516133A (en) * 1967-10-18 1970-06-23 Melpar Inc High temperature bulk capacitor
US3886415A (en) * 1968-04-01 1975-05-27 Itek Corp Capacitor with photo-conductive dielectric
US3634929A (en) * 1968-11-02 1972-01-18 Tokyo Shibaura Electric Co Method of manufacturing semiconductor integrated circuits
US3634927A (en) * 1968-11-29 1972-01-18 Energy Conversion Devices Inc Method of selective wiring of integrated electronic circuits and the article formed thereby
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards
US3712700A (en) * 1971-01-18 1973-01-23 Rca Corp Method of making an electron emitter device
IL38468A (en) * 1971-02-02 1974-11-29 Hughes Aircraft Co Electrical resistance device and its production
US3795977A (en) * 1971-12-30 1974-03-12 Ibm Methods for fabricating bistable resistors
US4189760A (en) * 1973-05-13 1980-02-19 Erie Technological Products, Inc. Monolithic capacitor with non-noble metal electrodes and method of making the same
US3922708A (en) * 1974-03-04 1975-11-25 Ibm Method of producing high value ion implanted resistors
CH575166A5 (fr) * 1974-05-20 1976-04-30 Suisse Horlogerie
US4197633A (en) * 1977-09-01 1980-04-15 Honeywell, Inc. Hybrid mosaic IR/CCD focal plane
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
EP0041381A1 (fr) * 1980-06-02 1981-12-09 British Aerospace Public Limited Company Modification de la conductibilité électrique de matériaux
DE3151557A1 (de) * 1981-12-28 1983-07-21 SWF-Spezialfabrik für Autozubehör Gustav Rau GmbH, 7120 Bietigheim-Bissingen Elektrooptische anzeigevorrichtung und verfahren zu ihrer herstellung
FR2535887A1 (fr) * 1982-11-04 1984-05-11 Thomson Csf Procede de fabrication d'une structure logique integree programmee selon une configuration preetablie fixe
US4541035A (en) * 1984-07-30 1985-09-10 General Electric Company Low loss, multilevel silicon circuit board
GB2217349B (en) * 1988-03-29 1992-06-24 Univ Hull Vapour deposited self-sealing ceramic coatings
DE3942472A1 (de) * 1989-12-22 1991-06-27 Asea Brown Boveri Beschichtungsverfahren
DE10320090A1 (de) * 2003-05-05 2004-08-26 Infineon Technologies Ag Elektrisches Bauteil mit Leitungen aus karbonisiertem Kunststoff, sowie Verfahren und Vorrichtung zu seiner Herstellung
DE102007014501A1 (de) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil
RU2543518C1 (ru) * 2013-10-03 2015-03-10 Общество с ограниченной ответственностью "Компания РМТ"(ООО"РМТ") Способ изготовления двусторонней печатной платы
US20160005514A1 (en) * 2014-07-07 2016-01-07 Epistar Corporation Method for forming electronic element
US10834828B2 (en) * 2018-01-26 2020-11-10 International Business Machines Corporation Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology

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US3118788A (en) * 1956-12-07 1964-01-21 Bausch & Lomb Metallic surface glass article
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
US3234044A (en) * 1962-09-25 1966-02-08 Sperry Rand Corp Use of an electron beam for manufacturing conductive patterns

Cited By (1)

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Publication number Priority date Publication date Assignee Title
FR2406304A1 (fr) * 1977-10-11 1979-05-11 Fujitsu Ltd Procede et appareil d'etablissement d'un contact electrique par decharge avec une plaquette semi-conductrice

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NL6506180A (fr) 1965-11-15
GB1107305A (en) 1968-03-27
DE1590647A1 (de) 1970-05-06
US3390012A (en) 1968-06-25
MY6900226A (en) 1969-12-31

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