MY209643A - Light-emitting element for display, and display device including same - Google Patents
Light-emitting element for display, and display device including sameInfo
- Publication number
- MY209643A MY209643A MYPI2022000932A MYPI2022000932A MY209643A MY 209643 A MY209643 A MY 209643A MY PI2022000932 A MYPI2022000932 A MY PI2022000932A MY PI2022000932 A MYPI2022000932 A MY PI2022000932A MY 209643 A MY209643 A MY 209643A
- Authority
- MY
- Malaysia
- Prior art keywords
- light
- led stack
- display
- emitting element
- peak wavelength
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962889158P | 2019-08-20 | 2019-08-20 | |
| US16/940,394 US11482566B2 (en) | 2019-08-20 | 2020-07-28 | Light emitting device for display and display apparatus having the same |
| PCT/KR2020/010104 WO2021033949A1 (ko) | 2019-08-20 | 2020-07-31 | 디스플레이용 발광 소자 및 그것을 가지는 디스플레이 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY209643A true MY209643A (en) | 2025-07-28 |
Family
ID=74371207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2022000932A MY209643A (en) | 2019-08-20 | 2020-07-31 | Light-emitting element for display, and display device including same |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US12154934B2 (https=) |
| EP (1) | EP4020552A4 (https=) |
| JP (1) | JP7520106B2 (https=) |
| KR (1) | KR20220048467A (https=) |
| CN (2) | CN114303240A (https=) |
| BR (1) | BR112022003052A2 (https=) |
| MX (1) | MX2022001794A (https=) |
| MY (1) | MY209643A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214672619U (zh) * | 2020-05-28 | 2021-11-09 | 首尔伟傲世有限公司 | 发光元件及具有该发光元件的显示装置 |
| US12604563B2 (en) * | 2022-04-25 | 2026-04-14 | Seoul Viosys Co., Ltd. | Light emitting device and light emitting module having the same |
| KR102822777B1 (ko) * | 2022-12-15 | 2025-06-19 | 엘지전자 주식회사 | 발광 구조를 구비한 디스플레이 장치 |
| WO2025255812A1 (en) * | 2024-06-14 | 2025-12-18 | Jade Bird Display (shanghai) Limited | Micro led pixel and micro led display panel |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2349989C1 (ru) | 2007-07-03 | 2009-03-20 | Самсунг Электро-Меканикс Ко., Лтд. | Многоцветное светоизлучающее устройство с использованием микрорезонатора |
| US8058663B2 (en) | 2007-09-26 | 2011-11-15 | Iii-N Technology, Inc. | Micro-emitter array based full-color micro-display |
| CN101821866B (zh) | 2007-10-08 | 2012-05-23 | 3M创新有限公司 | 具有粘接的半导体波长转换器的发光二极管 |
| US7732803B2 (en) * | 2008-05-01 | 2010-06-08 | Bridgelux, Inc. | Light emitting device having stacked multiple LEDS |
| US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
| KR102513080B1 (ko) * | 2016-04-04 | 2023-03-24 | 삼성전자주식회사 | Led 광원 모듈 및 디스플레이 장치 |
| WO2018101616A1 (ko) | 2016-11-30 | 2018-06-07 | 서울바이오시스주식회사 | 복수의 발광셀들을 가지는 발광 다이오드 |
| KR102550007B1 (ko) | 2016-11-30 | 2023-07-03 | 서울바이오시스 주식회사 | 복수의 발광셀들을 가지는 발광 다이오드 |
| US11527519B2 (en) * | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US10748881B2 (en) | 2017-12-05 | 2020-08-18 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US11552057B2 (en) * | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US11552061B2 (en) * | 2017-12-22 | 2023-01-10 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US11482566B2 (en) * | 2019-08-20 | 2022-10-25 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
-
2020
- 2020-07-31 CN CN202080058448.2A patent/CN114303240A/zh active Pending
- 2020-07-31 BR BR112022003052A patent/BR112022003052A2/pt not_active Application Discontinuation
- 2020-07-31 CN CN202021570803.8U patent/CN212412081U/zh active Active
- 2020-07-31 MX MX2022001794A patent/MX2022001794A/es unknown
- 2020-07-31 EP EP20855589.6A patent/EP4020552A4/en active Pending
- 2020-07-31 JP JP2022510821A patent/JP7520106B2/ja active Active
- 2020-07-31 KR KR1020227003035A patent/KR20220048467A/ko active Pending
- 2020-07-31 MY MYPI2022000932A patent/MY209643A/en unknown
-
2022
- 2022-10-21 US US17/970,573 patent/US12154934B2/en active Active
-
2024
- 2024-10-25 US US18/927,345 patent/US20250056952A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250056952A1 (en) | 2025-02-13 |
| KR20220048467A (ko) | 2022-04-19 |
| US12154934B2 (en) | 2024-11-26 |
| US20230037604A1 (en) | 2023-02-09 |
| CN212412081U (zh) | 2021-01-26 |
| EP4020552A4 (en) | 2023-10-04 |
| EP4020552A1 (en) | 2022-06-29 |
| BR112022003052A2 (pt) | 2022-05-17 |
| CN114303240A (zh) | 2022-04-08 |
| MX2022001794A (es) | 2022-03-11 |
| JP7520106B2 (ja) | 2024-07-22 |
| JP2022545783A (ja) | 2022-10-31 |
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