MY199761A - A method for conveying a group of electronic components during pick and place process - Google Patents

A method for conveying a group of electronic components during pick and place process

Info

Publication number
MY199761A
MY199761A MYPI2019006868A MYPI2019006868A MY199761A MY 199761 A MY199761 A MY 199761A MY PI2019006868 A MYPI2019006868 A MY PI2019006868A MY PI2019006868 A MYPI2019006868 A MY PI2019006868A MY 199761 A MY199761 A MY 199761A
Authority
MY
Malaysia
Prior art keywords
electronic components
conveying
group
place process
components during
Prior art date
Application number
MYPI2019006868A
Other languages
English (en)
Inventor
Liang Yong Loo
Mei Yin Khor
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYPI2019006868A priority Critical patent/MY199761A/en
Priority to TW109117432A priority patent/TWI718064B/zh
Priority to KR1020200063372A priority patent/KR102434661B1/ko
Priority to PH12020050193A priority patent/PH12020050193A1/en
Publication of MY199761A publication Critical patent/MY199761A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
MYPI2019006868A 2019-11-22 2019-11-22 A method for conveying a group of electronic components during pick and place process MY199761A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI2019006868A MY199761A (en) 2019-11-22 2019-11-22 A method for conveying a group of electronic components during pick and place process
TW109117432A TWI718064B (zh) 2019-11-22 2020-05-26 取放程序中搬運一組電子元件的方法
KR1020200063372A KR102434661B1 (ko) 2019-11-22 2020-05-27 픽 앤 플레이스 공정 중에 전자 부품 그룹을 이송하기 위한 방법
PH12020050193A PH12020050193A1 (en) 2019-11-22 2020-06-29 A method for conveying a group of electronic components during pick and place process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2019006868A MY199761A (en) 2019-11-22 2019-11-22 A method for conveying a group of electronic components during pick and place process

Publications (1)

Publication Number Publication Date
MY199761A true MY199761A (en) 2023-11-21

Family

ID=75745582

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006868A MY199761A (en) 2019-11-22 2019-11-22 A method for conveying a group of electronic components during pick and place process

Country Status (4)

Country Link
KR (1) KR102434661B1 (ko)
MY (1) MY199761A (ko)
PH (1) PH12020050193A1 (ko)
TW (1) TWI718064B (ko)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008094625A1 (en) * 2007-01-31 2008-08-07 Kaufman Engineered Systems Layer formation table and process
KR20100034615A (ko) * 2008-09-24 2010-04-01 주식회사 하이닉스반도체 포토마스크의 노광 방법
KR100979721B1 (ko) * 2008-12-04 2010-09-03 (주)에이피텍 반도체 다이의 검사 및 분류 일체화장치
JP5472214B2 (ja) * 2011-06-20 2014-04-16 株式会社安川電機 ピッキングシステム
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法
KR101697119B1 (ko) * 2016-07-07 2017-01-18 에스에스오트론 주식회사 반도체소자의 비전검사장치
JP7047249B2 (ja) * 2017-01-10 2022-04-05 オムロン株式会社 画像処理システム、画像処理装置、ワークのピックアップ方法、および、ワークのピックアッププログラム
CN109516203B (zh) * 2018-12-10 2020-07-21 温州大学瓯江学院 一种基于旋转结构的吸附式工位转位装置

Also Published As

Publication number Publication date
TW202120279A (zh) 2021-06-01
TWI718064B (zh) 2021-02-01
KR20210064023A (ko) 2021-06-02
PH12020050193A1 (en) 2021-05-31
KR102434661B1 (ko) 2022-08-19

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